JPS623391Y2 - - Google Patents
Info
- Publication number
- JPS623391Y2 JPS623391Y2 JP1982115827U JP11582782U JPS623391Y2 JP S623391 Y2 JPS623391 Y2 JP S623391Y2 JP 1982115827 U JP1982115827 U JP 1982115827U JP 11582782 U JP11582782 U JP 11582782U JP S623391 Y2 JPS623391 Y2 JP S623391Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- metal
- tank
- metal strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 238000007747 plating Methods 0.000 claims description 25
- 238000005406 washing Methods 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【考案の詳細な説明】
本考案は金属帯のメツキ装置に関するものであ
る。[Detailed Description of the Invention] The present invention relates to a plating device for metal strips.
従来、アルミ帯等の金属帯に銅等の電気メツキ
をするには、メツキ槽にアルミ帯をその長方形断
面の長辺を垂直にて通過させると共に給電ロール
電極をアルミ帯の両側面に接触させている。 Conventionally, in order to electroplate copper or other metal onto a metal strip such as an aluminum strip, the aluminum strip is passed through a plating bath with its long side perpendicular to its rectangular cross section, and a power supply roll electrode is brought into contact with both sides of the aluminum strip. ing.
しかしながら、このようなメツキ方法では、ア
ルミ帯のメツキが施こされる側面が給電ロール電
極で傷を受け易く、また、摩耗粉がアルミ帯側面
に付着したまゝとなり易く、メツキ不良が懸念さ
れる。 However, with this plating method, the side surface of the aluminum strip to be plated is easily damaged by the power supply roll electrode, and abrasion particles tend to remain attached to the side surface of the aluminum strip, resulting in poor plating. Ru.
本考案に係る金属帯のメツキ装置は、上述の不
利を解消し得る構成であり、メツキ工程における
水洗槽とメツキ槽の間に中間室を設け、該中間室
において被メツキ金属体の下端端面に摺動接触す
る金属板と、該金属板を上記被メツキ金属帯に対
し押圧するバネ体とからなる給電装置を設置した
構造としたことを特徴とするものである。 The metal strip plating device according to the present invention has a configuration that can eliminate the above-mentioned disadvantages, and an intermediate chamber is provided between the washing tank and the plating tank in the plating process, and in the intermediate chamber, the lower end surface of the metal object to be plated is The present invention is characterized by a structure in which a power supply device is installed, which includes a metal plate that makes sliding contact and a spring body that presses the metal plate against the metal strip to be plated.
以下、図面により本考案を説明する。 The present invention will be explained below with reference to the drawings.
第１図は本考案装置の縦断面説明図を、第２図
は第１図における−断面説明図をそれぞれ示
している。 FIG. 1 is an explanatory longitudinal cross-sectional view of the device of the present invention, and FIG. 2 is an explanatory cross-sectional view of the apparatus of the present invention.
図において１はメツキ槽、２はメツキ液であ
り、被メツキ体の金属帯Ａはメツキ槽１のスリツ
ト１１を通つて連続メツキされる。２′は上記ス
リツトから漏出する液でこの漏出液はポンプ（図
示せず）によりメツキ槽１に返送される。３は水
洗槽、４は水洗槽とメツキ槽の中間室である。 In the figure, 1 is a plating tank, 2 is a plating solution, and a metal band A to be plated is continuously plated through a slit 11 of the plating tank 1. Reference numeral 2' indicates liquid leaking from the slit, and this leaking liquid is returned to the plating tank 1 by a pump (not shown). 3 is a washing tank, and 4 is an intermediate chamber between the washing tank and the plating tank.
被メツキ体Ａは、その長方形断面の長辺が垂直
となるよう第２図に示す如く水洗槽３並びにメツ
キ槽１に通過される。 The object A to be plated is passed through a washing tank 3 and a plating tank 1 as shown in FIG. 2 so that the long sides of its rectangular cross section are perpendicular.
５は中間室４に設けた給電電極であり、金属帯
Ａの下端々面が摺動接触するプレート電極（例え
ば銅製）５１を絶縁台５２上にスプリング５３…
…によつて支持した構成である。５４は給電リー
ド線である。 Reference numeral 5 designates a power supply electrode provided in the intermediate chamber 4, in which a plate electrode (for example, made of copper) 51 with which the bottom surfaces of the metal band A come into sliding contact is mounted on an insulating stand 52 with a spring 53...
This is a configuration supported by... 54 is a power supply lead wire.
６は金属帯ガイドロールであり、被メツキ体を
損傷することのないようゴム製でできている。 A metal band guide roll 6 is made of rubber so as not to damage the body to be plated.
上記において、給電々極５はメツキ槽の入口側
に設けたが、出口側または入口側と出口側の双方
に設けることもできる。 In the above description, the power supply electrode 5 is provided on the inlet side of the plating tank, but it can also be provided on the outlet side or both the inlet and outlet sides.
本考案に係る金属帯のメツキ装置は、上述した
通りの構成であり、金属帯の下端々面に給電電極
を接触させているから被メツキ金属帯側面の電極
接触による傷付きを防止できる。また、摩耗粉が
発生しても、その発生箇所が金属帯の下端々面で
あるから直に脱落してしまい、たとえ付着した
まゝであつても、金属帯側面での付着ではないか
ら、金属帯側面のメツキには影響がない。 The metal strip plating device according to the present invention has the above-described configuration, and since the power supply electrode is brought into contact with the bottom surfaces of the metal strip, it is possible to prevent the side surface of the metal strip to be plated from being damaged due to contact with the electrodes. Furthermore, even if wear particles are generated, they will fall off directly because they are generated at the lower end of the metal band, and even if they remain attached, they will not be attached to the sides of the metal band. There is no effect on the plating on the side of the metal band.
従つて、本考案によれば、金属帯の両側面に良
品質のメツキ層を被着することができる。 Therefore, according to the present invention, high-quality plating layers can be applied to both sides of the metal strip.
第１図は本考案に係るメツキ装置を示す縦断面
説明図、第２図は第１図における−断面説明
図である。
図において、１はメツキ槽、Ａは被メツキ金属
帯、５は給電電極である。
FIG. 1 is an explanatory longitudinal cross-sectional view showing a plating device according to the present invention, and FIG. 2 is an explanatory cross-sectional view showing the plating device according to the present invention. In the figure, 1 is a plating tank, A is a metal strip to be plated, and 5 is a power supply electrode.
Claims (1)
直となるよう水洗槽、メツキ槽に通過させ、連続
メツキするメツキ装置において、前記水洗槽とメ
ツキ槽との間に中間室を設け、該中間室において
被メツキ金属帯の下端端面に摺動接触する金属板
と、該金属板を上記被メツキ金属帯に対し押圧す
るバネ体とからなる給電装置を設置してなること
を特徴とする金属体のメツキ装置。 In a plating device for continuous plating, the metal strip to be plated is passed through a washing tank and a plating tank so that the long sides of its rectangular cross section are perpendicular, and an intermediate chamber is provided between the washing tank and the plating tank, and the intermediate chamber is provided between the washing tank and the plating tank. A metal body characterized in that a power supply device is installed in the chamber, comprising a metal plate that makes sliding contact with the lower end face of the metal strip to be plated, and a spring body that presses the metal plate against the metal strip to be plated. Metsuki device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11582782U JPS5921666U (en) | 1982-07-29 | 1982-07-29 | Metal strip plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11582782U JPS5921666U (en) | 1982-07-29 | 1982-07-29 | Metal strip plating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5921666U JPS5921666U (en) | 1984-02-09 |
| JPS623391Y2 true JPS623391Y2 (en) | 1987-01-26 |
Family
ID=30267239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11582782U Granted JPS5921666U (en) | 1982-07-29 | 1982-07-29 | Metal strip plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5921666U (en) |
-
1982
- 1982-07-29 JP JP11582782U patent/JPS5921666U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5921666U (en) | 1984-02-09 |
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