JPS5875767U - Partial plating nozzle - Google Patents

Partial plating nozzle

Info

Publication number
JPS5875767U
JPS5875767U JP17124881U JP17124881U JPS5875767U JP S5875767 U JPS5875767 U JP S5875767U JP 17124881 U JP17124881 U JP 17124881U JP 17124881 U JP17124881 U JP 17124881U JP S5875767 U JPS5875767 U JP S5875767U
Authority
JP
Japan
Prior art keywords
pipe
sub
partial plating
nozzle
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17124881U
Other languages
Japanese (ja)
Inventor
正夫 岡村
Original Assignee
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーエプソン株式会社 filed Critical セイコーエプソン株式会社
Priority to JP17124881U priority Critical patent/JPS5875767U/en
Publication of JPS5875767U publication Critical patent/JPS5875767U/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は部分メッキ装置の説明用の断面図、第２図は従
来例の断面図イ、側面図口、第３図は本考案の断面図イ
、側面図口。FIG. 1 is a sectional view for explaining a partial plating apparatus, FIG. 2 is a sectional view A and a side view of a conventional example, and FIG. 3 is a sectional view A and a side view of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] メッキ液の貫流する主パイプの一部分に略直角に従パイ
プを設け、前記主パイプ中を貫流するメッキ液が従パイ
プ中に渦流を発生するようにして従パイプ端面に被メッ
キ材を湿潤接触した状態でメッキ液側を陽極に、また被
メツキ材側を陰極としてメッキする構成において、従パ
イプ外周部分に細孔を設けたことを特徴とする部分メッ
キ用ノズル。A sub-pipe is provided approximately at right angles to a portion of the main pipe through which the plating solution flows, and the plating solution flowing through the main pipe generates a vortex in the sub-pipe so that the material to be plated is brought into wet contact with the end surface of the sub-pipe. 1. A nozzle for partial plating, characterized in that the plating liquid side is used as an anode and the material to be plated is used as a cathode.
JP17124881U 1981-11-17 1981-11-17 Partial plating nozzle Pending JPS5875767U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17124881U JPS5875767U (en) 1981-11-17 1981-11-17 Partial plating nozzle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17124881U JPS5875767U (en) 1981-11-17 1981-11-17 Partial plating nozzle

Publications (1)

Publication Number Publication Date
JPS5875767U true JPS5875767U (en) 1983-05-21

Family

ID=29963183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17124881U Pending JPS5875767U (en) 1981-11-17 1981-11-17 Partial plating nozzle

Country Status (1)

Country Link
JP (1) JPS5875767U (en)

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