JPS5875765U - Partial plating nozzle - Google Patents
Partial plating nozzleInfo
- Publication number
- JPS5875765U JPS5875765U JP17124681U JP17124681U JPS5875765U JP S5875765 U JPS5875765 U JP S5875765U JP 17124681 U JP17124681 U JP 17124681U JP 17124681 U JP17124681 U JP 17124681U JP S5875765 U JPS5875765 U JP S5875765U
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- plating
- sub
- partial plating
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１Ｎ：部分メッキ装置の説明用の断面図、第２図：第
１図の部分拡大図、第３図工本考案のノズル部断面図。1N: A sectional view for explaining the partial plating apparatus, FIG. 2: An enlarged partial view of FIG. 1, and FIG. 3: A sectional view of the nozzle portion of the present invention.
Claims (1)
プを設け、前記主パイプ中を貫流するメッキ液が従パイ
プ中に渦流を発生するようにして従パイプ端面に被メッ
キ材を湿潤接触した状態でメッキ液側を陽極に、また被
メツキ材側を陰極としてメッキする構成において、従パ
イプ内側部分に捩れ溝を設けたことを特徴とする部分メ
ッキ用ノズル。A sub-pipe is provided approximately at right angles to a portion of the main pipe through which the plating solution flows, and the plating solution flowing through the main pipe generates a vortex in the sub-pipe so that the material to be plated is brought into wet contact with the end surface of the sub-pipe. 1. A nozzle for partial plating, characterized in that the plating liquid side is used as an anode and the material to be plated is used as a cathode in plating conditions, and a twisted groove is provided on the inner side of the slave pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17124681U JPS5875765U (en) | 1981-11-17 | 1981-11-17 | Partial plating nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17124681U JPS5875765U (en) | 1981-11-17 | 1981-11-17 | Partial plating nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5875765U true JPS5875765U (en) | 1983-05-21 |
Family
ID=29963181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17124681U Pending JPS5875765U (en) | 1981-11-17 | 1981-11-17 | Partial plating nozzle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5875765U (en) |
-
1981
- 1981-11-17 JP JP17124681U patent/JPS5875765U/en active Pending
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