JPS58189166U - Selective plating device - Google Patents
Selective plating deviceInfo
- Publication number
- JPS58189166U JPS58189166U JP8709882U JP8709882U JPS58189166U JP S58189166 U JPS58189166 U JP S58189166U JP 8709882 U JP8709882 U JP 8709882U JP 8709882 U JP8709882 U JP 8709882U JP S58189166 U JPS58189166 U JP S58189166U
- Authority
- JP
- Japan
- Prior art keywords
- selective plating
- storage groove
- plating device
- solution storage
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の選択メッキ装置によって得られるメッキ
帯を示すための金属材の説明的斜視図、第2図はこの考
案の装置によった金属材の説明的斜視図、第3図は従来
の選択メッキ装置を説明す′るための断面図、第4図は
この考案による選択メッキ装置の断面図である。
符号説明、1・・・・・・ストリップ状金属材、2・・
・・・・メッキ帯、3・・・・・・境界線、4・・・・
・・本体、5・・・・・・メッキ液収容溝、6・・・・
・・開口端縁、7・・・・・・陽電極、8・・・・・・
波状はみ出し部分、9・・・・・・絶縁被膜。FIG. 1 is an explanatory perspective view of a metal material to show a plated band obtained by a conventional selective plating device, FIG. 2 is an explanatory perspective view of a metal material by the device of this invention, and FIG. 3 is a conventional selective plating device. FIG. 4 is a cross-sectional view of the selective plating apparatus according to this invention. Code explanation, 1... Strip-shaped metal material, 2...
...Plated band, 3...Border line, 4...
...Main body, 5...Plating liquid storage groove, 6...
...Opening edge, 7...Positive electrode, 8...
Wavy protruding portion, 9...Insulating coating.
Claims (1)
溝に設けられた陽電極とを有する選択メッキ装置にして
、該メッキ液収容溝の上部開口端縁を陰電極としたこと
を特徴とする選択メッキ装置。The selective plating apparatus has a plating solution storage groove provided in the main body and a positive electrode provided in the plating solution storage groove, and the upper opening edge of the plating solution storage groove is used as a negative electrode. Select plating equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8709882U JPS58189166U (en) | 1982-06-11 | 1982-06-11 | Selective plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8709882U JPS58189166U (en) | 1982-06-11 | 1982-06-11 | Selective plating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58189166U true JPS58189166U (en) | 1983-12-15 |
JPS6211963Y2 JPS6211963Y2 (en) | 1987-03-24 |
Family
ID=30095842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8709882U Granted JPS58189166U (en) | 1982-06-11 | 1982-06-11 | Selective plating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58189166U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5328039A (en) * | 1976-08-27 | 1978-03-15 | Matsushita Electric Ind Co Ltd | Continuous plating device |
-
1982
- 1982-06-11 JP JP8709882U patent/JPS58189166U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5328039A (en) * | 1976-08-27 | 1978-03-15 | Matsushita Electric Ind Co Ltd | Continuous plating device |
Also Published As
Publication number | Publication date |
---|---|
JPS6211963Y2 (en) | 1987-03-24 |
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