JPS59214293A - Printing device for semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printing apparatus for semiconductor devices that forms the same pattern on multiple surfaces of a semiconductor device.

Conventionally, a printing apparatus for semiconductor devices has been constructed as shown in FIG. This can be roughly explained based on the same figure (
1) is a semiconductor device having a substrate (2) of ceramic or the like;
(3) is a stage on which the semiconductor device (1) is placed and fixed; (4) is a mask having pattern holes (5) for printing;
(6) is a frame that holds this mask (4), and (7) is a frame that moves above the mask (4) as shown by the arrow to supply printing liquid from the pattern hole (5) onto the substrate (2). squeegee,
(8) is a feeding rail that feeds the semiconductor device (1).

In the printing apparatus configured in this way, the semiconductor device (
11 is fed and fixed onto the stage (3) through the feeding rail (8) by a feeding device (not shown). Next, printing liquid is supplied onto the substrate (2) from the squeegee (7) through the pattern holes (5) to form a wiring pattern. and the semiconductor device (11 is the feed rail (8) on the opposite side)
will be sent to.

However, in the conventional printing apparatus for semiconductor devices, when printing a pattern on both sides of the substrate (2), for example, the supply process must be performed twice, which increases the process time in the printing process. The disadvantage is that the yield is poor.

The present invention was developed in view of the above circumstances, and has an extremely simple configuration in which a reversing device that can rotate the semiconductor device is attached to the side of the stage.The present invention has an extremely simple configuration in which a reversing device that can rotate the semiconductor device is attached to the side of the stage. The present invention provides a printing apparatus for semiconductor devices that can form a semiconductor device.

Hereinafter, the configuration and the like will be explained in detail with reference to embodiments shown in the drawings.

FIG. 2 is a perspective view showing a printing apparatus for semiconductor devices according to the present invention, in which the same members as in FIG. 1 are denoted by the same reference numerals.
Detailed explanation will be omitted. In the figure, what is indicated by the reference numeral (9) is a reversing device which is a main part of the present invention, and a chuck part 00 that holds the semiconductor device (1) on the stage (3).
) and an actuator H, which is a rotating part that rotates the chuck part, and is attached to the side of the stage (3) on the printing apparatus for semiconductor devices. Then, the reversing device (9) is driven by a drive section (not shown) to drive the semiconductor device (1).
) operates in a direction perpendicular to the feeding direction of the stage (3).
It is configured to move forward and backward.

In the printing apparatus for semiconductor devices configured in this way,
When the surface of the substrate (2) of the semiconductor device (1) is printed,
The reversing device (9) moves forward with respect to the stage (3), and the chuck part [9] holds the semiconductor device (1) on the stage (3). Next, the reversing device (9) moves back and the actuator (ill) rotates the chuck part (ltl. At this time, the semiconductor device (11) is reversed. After that, the reversing device (9) moves forward again and rotates the chuck part (ltl). The recess is the stage (3
) to release the semiconductor device fi+. At this time, the semiconductor device (1) is placed on the stage (3) again, so
By printing the back side of the substrate (2), patterns can be formed on both sides.

In this embodiment, printing is performed on the front and back surfaces of the semiconductor device (11), but it goes without saying that printing can be performed on other surfaces in the same manner.Furthermore, in this embodiment,
Although the reversing device (9) is shown as being installed on one side of the stage (3), the reversing device according to the present invention! (9) can also be provided on the other side of the stage (3).

As explained above, according to the present invention, since the reversing device, which has a chuck part for holding the semiconductor device and a rotating part for rotating the chuck part and moves forward and backward with respect to the stage, is attached to the side of the stage, the supply process The same pattern can be reliably formed on multiple surfaces of one semiconductor device without repeating the process. Therefore, there are advantages in that the process time in the printing process can be shortened and setups can be made more frequently.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a conventional printing apparatus for semiconductor devices, and FIG. 2 is a perspective view showing an embodiment of the printing apparatus for semiconductor devices according to the present invention. (1)... Semiconductor device, (21... Substrate, (3
)・・・Stage, (4)・・・Mask, (5)・
...Pattern hole, (force...squeegee, (9)...
... Reversing device, (101... Chuck part, (lII
...actuator. Agent Masuo Oiwa

Claims (1)

[Claims] A printing apparatus for a semiconductor device, comprising a stage on which a semiconductor device is placed, and a squeegee that supplies a printing liquid to a substrate for the semiconductor device to form a pattern through a pattern hole formed in a mask. Printing for semiconductor devices, characterized in that a reversing device, which has a chuck part that holds the semiconductor device on the stage and a rotating part that rotates the chuck part, and which moves forward and backward with respect to the stage, is attached to the side of the stage. Device.