JPS59214293A - Printing device for semiconductor device - Google Patents
Printing device for semiconductor deviceInfo
- Publication number
- JPS59214293A JPS59214293A JP8953683A JP8953683A JPS59214293A JP S59214293 A JPS59214293 A JP S59214293A JP 8953683 A JP8953683 A JP 8953683A JP 8953683 A JP8953683 A JP 8953683A JP S59214293 A JPS59214293 A JP S59214293A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- stage
- printing
- semiconductor
- printing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は半導体装置の多面に同一のパターンを形成する
半導体装置用印刷装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printing apparatus for semiconductor devices that forms the same pattern on multiple surfaces of a semiconductor device.
従来、半導体装置用印刷装置は第1図に示すように構成
されている。これを同図に基づいて概略説明すると、(
1)はセラミック等の基板(2)を有する半導体装置、
(3)はこの半導体装置(1)を載置固定するステージ
、(4)は印刷用のパターン孔(5)を有するマスク、
(6)はこのマスク(4)を保持する枠、(7)は前記
マスク(4)上を矢印で示すように移動して印刷液をパ
ターン孔(5)から基板(2)上に供給するスキージ、
(8)は前記半導体装置(1)を給送する給送レールで
ある。Conventionally, a printing apparatus for semiconductor devices has been constructed as shown in FIG. This can be roughly explained based on the same figure (
1) is a semiconductor device having a substrate (2) of ceramic or the like;
(3) is a stage on which the semiconductor device (1) is placed and fixed; (4) is a mask having pattern holes (5) for printing;
(6) is a frame that holds this mask (4), and (7) is a frame that moves above the mask (4) as shown by the arrow to supply printing liquid from the pattern hole (5) onto the substrate (2). squeegee,
(8) is a feeding rail that feeds the semiconductor device (1).
このように構成された印刷装置において、半導体装置(
11は供給装置(図示せず)により給送レール(8)を
通ってステージ(3)上に供給されて固定される。次い
で、スキージ(7)からパターン孔(5)を通って印刷
液が基板(2)上に供給され配線パターンが形成される
。そして半導体装置(11は反対側の給送レール(8)
に給送される。In the printing apparatus configured in this way, the semiconductor device (
11 is fed and fixed onto the stage (3) through the feeding rail (8) by a feeding device (not shown). Next, printing liquid is supplied onto the substrate (2) from the squeegee (7) through the pattern holes (5) to form a wiring pattern. and the semiconductor device (11 is the feed rail (8) on the opposite side)
will be sent to.
しかるに、従来の半導体装置用印刷装置においては、例
えば基板(2)の両面にパターンを印刷する場合、供給
工程を2回経なければならず、その分印刷工程における
工程時間が長くなシ、段取シが悪くなるという欠点があ
る。However, in the conventional printing apparatus for semiconductor devices, when printing a pattern on both sides of the substrate (2), for example, the supply process must be performed twice, which increases the process time in the printing process. The disadvantage is that the yield is poor.
本発明はこのような事情に鑑みなされたもので、半導体
装置を回転できる反転装置をステージの側方に付設する
というきわめて簡単な構成により、供給工程を縁返すこ
となく半導体装置の多面に同一パターンを形成すること
ができる半導体装置用印刷装置を提供するものである。The present invention was developed in view of the above circumstances, and has an extremely simple configuration in which a reversing device that can rotate the semiconductor device is attached to the side of the stage.The present invention has an extremely simple configuration in which a reversing device that can rotate the semiconductor device is attached to the side of the stage. The present invention provides a printing apparatus for semiconductor devices that can form a semiconductor device.
以下、その構成等を図に示す実施例によって詳細に説明
する。Hereinafter, the configuration and the like will be explained in detail with reference to embodiments shown in the drawings.
第2図は本発明に係る半導体装置用印刷装置を示す斜視
図で、第1図と同一の部材について同一の符号を付し、
詳細な説明は省略する。同図において、符号(9)で示
すものは本発明の要部である反転装置で、前記ステージ
(3)上の半導体装置(1)を保持するチャック部00
)と、このチャック部叫を回転する回転部であるアクチ
ュエータHとを有し半導体装置用印刷装置上におけるス
テージ(3)の側方に付設されている。そして、反転装
置(9)は図示しない駆動部により前記半導体装置(1
)の供給方向と直角な方向に作動し前記ステージ(3)
に対し進退するように構成されている。FIG. 2 is a perspective view showing a printing apparatus for semiconductor devices according to the present invention, in which the same members as in FIG. 1 are denoted by the same reference numerals.
Detailed explanation will be omitted. In the figure, what is indicated by the reference numeral (9) is a reversing device which is a main part of the present invention, and a chuck part 00 that holds the semiconductor device (1) on the stage (3).
) and an actuator H, which is a rotating part that rotates the chuck part, and is attached to the side of the stage (3) on the printing apparatus for semiconductor devices. Then, the reversing device (9) is driven by a drive section (not shown) to drive the semiconductor device (1).
) operates in a direction perpendicular to the feeding direction of the stage (3).
It is configured to move forward and backward.
このように構成された半導体装置用印刷装置において、
半導体装置(1)の基板(2)の表面が印刷されると、
反転装置(9)がステージ(3)に対し前進して、チャ
ック部[9がステージ(3)上の半導体装置(1)を保
持する。次いで、反転装置(9)が後退し、アクチュエ
ータ(illがチャック部(ltlを回転する。このと
き、半導体装置(11は反転している。しかる後、反転
装置(9)が再び前進してチャック部凹がステージ(3
)上で半導体装置fi+を解放する。このとき、半導体
装置(1)は再びステージ(3)上に載置されるため、
基板(2)の裏面を印刷すれば、両面にパターンを形成
することができる。In the printing apparatus for semiconductor devices configured in this way,
When the surface of the substrate (2) of the semiconductor device (1) is printed,
The reversing device (9) moves forward with respect to the stage (3), and the chuck part [9] holds the semiconductor device (1) on the stage (3). Next, the reversing device (9) moves back and the actuator (ill) rotates the chuck part (ltl. At this time, the semiconductor device (11) is reversed. After that, the reversing device (9) moves forward again and rotates the chuck part (ltl). The recess is the stage (3
) to release the semiconductor device fi+. At this time, the semiconductor device (1) is placed on the stage (3) again, so
By printing the back side of the substrate (2), patterns can be formed on both sides.
なお、本実施例においては、半導体装置(11の表裏面
に印刷するものを示したが、他の面についても同様に実
施し得ることは勿論である。また、本実施例において、
反転装置(9)はステージ(3)の一方の側方に設ける
ものを示したが、本発明による反転装!(9)はステー
ジ(3)の他方の側方に設けることもできる。In this embodiment, printing is performed on the front and back surfaces of the semiconductor device (11), but it goes without saying that printing can be performed on other surfaces in the same manner.Furthermore, in this embodiment,
Although the reversing device (9) is shown as being installed on one side of the stage (3), the reversing device according to the present invention! (9) can also be provided on the other side of the stage (3).
以上説明したように、本発明によれば半導体装置を保持
するチャック部と、チャック部を回転する回転部とを有
しステージに対し進退する反転装置をステージの側方に
付設したので、供給工程を繰返すことなく1つの半導体
装置の多面に同一パターンを確実に形成することができ
る。したがって、印刷工程における工程時間の短縮化が
計れ、段取シがよく々るという利点がある。As explained above, according to the present invention, since the reversing device, which has a chuck part for holding the semiconductor device and a rotating part for rotating the chuck part and moves forward and backward with respect to the stage, is attached to the side of the stage, the supply process The same pattern can be reliably formed on multiple surfaces of one semiconductor device without repeating the process. Therefore, there are advantages in that the process time in the printing process can be shortened and setups can be made more frequently.
第1図は従来の半導体装置用印刷装置を示す斜視図、第
2図は本発明に係る半導体装置用印刷装置の一実施例を
示す斜視図である。
(1)・・・・半導体装置、(21・・・・基板、(3
)・・・・ステージ、(4)・・・・マスク、(5)・
・・・パターン孔、(力・・・・スキージ、(9)・・
・・反転装置、(101・・・・チャック部、(lII
・・・・アクチュエータ。
代理人 大 岩 増 雄FIG. 1 is a perspective view showing a conventional printing apparatus for semiconductor devices, and FIG. 2 is a perspective view showing an embodiment of the printing apparatus for semiconductor devices according to the present invention. (1)... Semiconductor device, (21... Substrate, (3
)・・・Stage, (4)・・・Mask, (5)・
...Pattern hole, (force...squeegee, (9)...
... Reversing device, (101... Chuck part, (lII
...actuator. Agent Masuo Oiwa
Claims (1)
たパターン孔よシ前記半導体装置用の基板上に印刷液を
供給してパターンを形成するスキージとを備えた半導体
装置用印刷装置において、前記ステージ上の半導体装置
を保持するチャック部と、このチャック部を回転する回
転部とを有し前記ステージに対し進退する反転装置をス
テージの側方に付設したことを特徴とする半導体装置用
印刷装置。A printing apparatus for a semiconductor device, comprising a stage on which a semiconductor device is placed, and a squeegee that supplies a printing liquid to a substrate for the semiconductor device to form a pattern through a pattern hole formed in a mask. Printing for semiconductor devices, characterized in that a reversing device, which has a chuck part that holds the semiconductor device on the stage and a rotating part that rotates the chuck part, and which moves forward and backward with respect to the stage, is attached to the side of the stage. Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8953683A JPS59214293A (en) | 1983-05-20 | 1983-05-20 | Printing device for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8953683A JPS59214293A (en) | 1983-05-20 | 1983-05-20 | Printing device for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59214293A true JPS59214293A (en) | 1984-12-04 |
JPH0363234B2 JPH0363234B2 (en) | 1991-09-30 |
Family
ID=13973532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8953683A Granted JPS59214293A (en) | 1983-05-20 | 1983-05-20 | Printing device for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59214293A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63194390A (en) * | 1987-02-07 | 1988-08-11 | 株式会社 電子技研 | Apparatus for forming film of electronic circuit substrate |
JPS63194393A (en) * | 1987-02-07 | 1988-08-11 | 株式会社電子技研 | Method and apparatus for forming film of electronic circuit substrate |
JPS63194389A (en) * | 1987-02-07 | 1988-08-11 | 株式会社 電子技研 | Apparatus for forming film of electronic circuit substrate |
JPS63194768A (en) * | 1987-02-07 | 1988-08-11 | Denshi Giken:Kk | Coated film forming device for electronic circuit board |
JP2015057828A (en) * | 2007-09-03 | 2015-03-26 | エイエスエム アッセンブリー システムズ スウィツァーランド ジーエムビーエイチ | Workpiece processing system and method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5734391A (en) * | 1980-08-09 | 1982-02-24 | Matsushita Electric Ind Co Ltd | Device for automatically inverting printed board |
-
1983
- 1983-05-20 JP JP8953683A patent/JPS59214293A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5734391A (en) * | 1980-08-09 | 1982-02-24 | Matsushita Electric Ind Co Ltd | Device for automatically inverting printed board |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63194390A (en) * | 1987-02-07 | 1988-08-11 | 株式会社 電子技研 | Apparatus for forming film of electronic circuit substrate |
JPS63194393A (en) * | 1987-02-07 | 1988-08-11 | 株式会社電子技研 | Method and apparatus for forming film of electronic circuit substrate |
JPS63194389A (en) * | 1987-02-07 | 1988-08-11 | 株式会社 電子技研 | Apparatus for forming film of electronic circuit substrate |
JPS63194768A (en) * | 1987-02-07 | 1988-08-11 | Denshi Giken:Kk | Coated film forming device for electronic circuit board |
JPH0469835B2 (en) * | 1987-02-07 | 1992-11-09 | Denshi Giken Kk | |
JPH0529158B2 (en) * | 1987-02-07 | 1993-04-28 | Denshi Giken Kk | |
JP2015057828A (en) * | 2007-09-03 | 2015-03-26 | エイエスエム アッセンブリー システムズ スウィツァーランド ジーエムビーエイチ | Workpiece processing system and method |
US10682848B2 (en) | 2007-09-03 | 2020-06-16 | Asm Assembly Systems Singapore Pte. Ltd. | Workpiece processing system and method |
Also Published As
Publication number | Publication date |
---|---|
JPH0363234B2 (en) | 1991-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0812960B2 (en) | Substrate work holder | |
JPH10322100A (en) | Method for positioning printed board | |
JPS59214293A (en) | Printing device for semiconductor device | |
JPH06155708A (en) | Conductor pattern printer for printed board | |
JPH05131609A (en) | Solder paste printing machine | |
JPS62145894A (en) | Coater | |
JP3796828B2 (en) | Substrate dividing method and substrate dividing apparatus | |
JP3520460B2 (en) | Screen printing machine | |
KR0135936Y1 (en) | Apparatus for inverting supply of pcb | |
JP3456764B2 (en) | Printed wiring board and its soldering method | |
JP3038963B2 (en) | Component mounting device and component mounting method | |
JP2594566B2 (en) | Electronic component transfer device | |
JP2921704B2 (en) | Screen printing machine | |
JPS62123793A (en) | Printed circuit board aligner | |
JP2549549Y2 (en) | Autoloader unit for laser beam machine | |
JP2730191B2 (en) | Electronic component insertion device | |
JPH06140798A (en) | Electronic component inserter | |
JPH1022699A (en) | Board mounting method | |
JPH0464296A (en) | Board holding and securing device | |
JPH04122093A (en) | Paste transfer method and transfer jig | |
JPH0731597Y2 (en) | Parts transfer unit | |
JPH01220888A (en) | Screen printing method | |
JPH11274798A (en) | Substrate-transporting apparatus | |
JPH09129678A (en) | Method for mounting conductive ball | |
JPH03268500A (en) | Supporting device for electronic circuit board |