JPS592136U - mold die - Google Patents
mold dieInfo
- Publication number
- JPS592136U JPS592136U JP9691882U JP9691882U JPS592136U JP S592136 U JPS592136 U JP S592136U JP 9691882 U JP9691882 U JP 9691882U JP 9691882 U JP9691882 U JP 9691882U JP S592136 U JPS592136 U JP S592136U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- mold
- molded
- resin
- mold die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は一般的なパワートランジスタの断面図、第２図
はパワートランジスタを外部放熱板に取付けた図、第３
図は本考案によるモールド金型の断面図である。
１ａ・・・パワートランジスタの放熱面、２・・・放熱
板、５・・・モールド金型、６・・・樹脂注入口、８・
・・ピン（位置規制部材）。Figure 1 is a cross-sectional view of a typical power transistor, Figure 2 is a diagram of the power transistor attached to an external heat sink, and Figure 3 is a cross-sectional view of a typical power transistor.
The figure is a sectional view of a mold according to the present invention. 1a... Heat radiation surface of power transistor, 2... Heat sink, 5... Mold die, 6... Resin injection port, 8...
...Pin (position regulating member).
Claims (1)
を樹脂でモールトドするモールド金型において、モール
ド金型のキャビティ内にセットされた放熱板を基準とし
て該放熱板の前面側に樹脂注入口を、後面側に後方への
放熱板の動きを規制する位置規制部材をそれぞれ配設し
たことを特徴とするモールド金型。In a mold in which a heat sink is molded with resin close to the heat sink molded with resin during molding, a resin injection port is placed on the front side of the heat sink with reference to the heat sink set in the cavity of the mold. , a molding die characterized in that a position regulating member for regulating rearward movement of a heat dissipation plate is disposed on the rear side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9691882U JPS592136U (en) | 1982-06-28 | 1982-06-28 | mold die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9691882U JPS592136U (en) | 1982-06-28 | 1982-06-28 | mold die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS592136U true JPS592136U (en) | 1984-01-09 |
Family
ID=30230760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9691882U Pending JPS592136U (en) | 1982-06-28 | 1982-06-28 | mold die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS592136U (en) |
-
1982
- 1982-06-28 JP JP9691882U patent/JPS592136U/en active Pending
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