JPS58177927U - Molded capacitor - Google Patents

Molded capacitor

Info

Publication number
JPS58177927U
JPS58177927U JP7676082U JP7676082U JPS58177927U JP S58177927 U JPS58177927 U JP S58177927U JP 7676082 U JP7676082 U JP 7676082U JP 7676082 U JP7676082 U JP 7676082U JP S58177927 U JPS58177927 U JP S58177927U
Authority
JP
Japan
Prior art keywords
molded capacitor
molded
assembly
abstract
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7676082U
Other languages
Japanese (ja)
Inventor
靖雄 井上
板野　勝裕
米光　一英
Original Assignee
日新電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日新電機株式会社 filed Critical 日新電機株式会社
Priority to JP7676082U priority Critical patent/JPS58177927U/en
Publication of JPS58177927U publication Critical patent/JPS58177927U/en
Pending legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図はこの考案の一実施例を示し、第１図
は正面図、第２図は平面図である。第３図はこの考案の
他の実施例を示す斜視図である。 １：ソリッドコンデンサ、２：集合体、３：モ“−ルド
樹脂、４：放熱板。1 and 2 show an embodiment of this invention, with FIG. 1 being a front view and FIG. 2 being a plan view. FIG. 3 is a perspective view showing another embodiment of this invention. 1: solid capacitor, 2: aggregate, 3: mold resin, 4: heat sink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ソリッドコンデンサを複数個集合した集合体を、−モー
ルド樹脂でもってモールドし、その側面に放熱板を一体
に設けてなることを特徴とするモールド形コンデンサ。A molded capacitor characterized in that an assembly of a plurality of solid capacitors is molded with a molding resin, and a heat sink is integrally provided on the side surface of the assembly.
JP7676082U 1982-05-24 1982-05-24 Molded capacitor Pending JPS58177927U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7676082U JPS58177927U (en) 1982-05-24 1982-05-24 Molded capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7676082U JPS58177927U (en) 1982-05-24 1982-05-24 Molded capacitor

Publications (1)

Publication Number Publication Date
JPS58177927U true JPS58177927U (en) 1983-11-28

Family

ID=30086059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7676082U Pending JPS58177927U (en) 1982-05-24 1982-05-24 Molded capacitor

Country Status (1)

Country Link
JP (1) JPS58177927U (en)

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