JPS59208838A - Microwave plasma treating device - Google Patents

Microwave plasma treating device

Info

Publication number
JPS59208838A
JPS59208838A JP58084489A JP8448983A JPS59208838A JP S59208838 A JPS59208838 A JP S59208838A JP 58084489 A JP58084489 A JP 58084489A JP 8448983 A JP8448983 A JP 8448983A JP S59208838 A JPS59208838 A JP S59208838A
Authority
JP
Japan
Prior art keywords
sample
plasma
microwave
transmitting window
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58084489A
Other languages
Japanese (ja)
Other versions
JPH0247851B2 (en
Inventor
Shuzo Fujimura
藤村 修三
Toshimasa Kisa
木佐 俊正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58084489A priority Critical patent/JPS59208838A/en
Publication of JPS59208838A publication Critical patent/JPS59208838A/en
Publication of JPH0247851B2 publication Critical patent/JPH0247851B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357Generation remote from the workpiece, e.g. down-stream

Abstract

PURPOSE:To prevent damage due to the generation of heat of a microwave transmitting window, and to treat a sample stably by mounting the transmitting window where the amplitude of an electric field by a standing wave is minimized. CONSTITUTION:A sample 27 is placed on a sample stage 28, a sample treating chamber 21 is evacuated from an exhaust port 22, a microwave oscillator 31 is operated, microwaves are worked to a treating gas in a plasma generating chamber 24 through a wave guide and a transmitting window 30 to generate plasma, a plasma etching gas mainly comprising radicals is introduced into the sample treating chamber 21 from plasma ejecting holes 26, and the sample 27 is etched and treated. Since the microwave transmitting window 30 is mounted where the amplitude of an electric field by standing waves generated in the plasma generating chamber 24 is minimized at that time, the etching rate of the microwave transmitting window 30 consisting of a quartz board is reduced, the life of a device can be lengthened, trouble such as the seizure of an O ring 32 due to a temperature rise in the microwave transmitting window consisting of an alumina material is prevented, and the sample 27 can be treated stably by plasma.

Description

【発明の詳細な説明】 (a)  発明の技術分野 本発明はマイクロ波プラズマ処理装置の改良に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to improvements in microwave plasma processing equipment.

(b)  従来技術と問題点 従来プラズマ処理全行なう場合、たとえばシリコン基板
などの試料に損傷を与えないことや、試料の処理均一性
のため、たとえば第1図に示すようなプラズマ発生室と
試料処理室全所定のプラズマ噴出孔(シールド孔)を有
する遮蔽板によって分離されたマイクロ波プラズマ処理
装置が用いられているう 即ち同図において該試料処理室1のは排気口2を介して
真空忙排気され、該試料処理室1の上部には導波管6の
一部であるプラズマ発生室4が設けられている。該プラ
ズマ発生室4と前記試料処理室1の間に介在する遮蔽板
5(導波管の一部)は両室を分離するだめの隔壁となっ
ており、該憔、画板5には所定のプラズマ噴出孔6(シ
ールド孔)が複数個配設され画室が連通されている。前
記試料処理室1内には試料7を載置する試料ステージ8
が設けられている。又前記導波管の一部であるプラズマ
発生室4はその一部にガス導入口9が設けられ、マイク
ロ波透過室10を介してJIS規格寸法を有する前記導
波管6及びマイクロ波発振器11が図示したように連結
されている。尚マイクロ波透過窓10はプラズマ発生室
4の真空を保つために0リング12によって図示したよ
うに典空封止されておシ、一般に石英又はアルミナなど
の材質によって構成されている。
(b) Prior art and problems When performing conventional plasma processing, it is necessary to avoid damaging the sample, such as a silicon substrate, and to ensure uniform processing of the sample. A microwave plasma processing apparatus is used in which all of the processing chambers are separated by a shielding plate having a predetermined plasma ejection hole (shield hole). A plasma generation chamber 4, which is a part of a waveguide 6, is provided in the upper part of the sample processing chamber 1, which is evacuated. A shielding plate 5 (a part of the waveguide) interposed between the plasma generation chamber 4 and the sample processing chamber 1 serves as a partition wall to separate the two chambers. A plurality of plasma ejection holes 6 (shield holes) are provided to communicate with the compartments. Inside the sample processing chamber 1 is a sample stage 8 on which the sample 7 is placed.
is provided. Further, the plasma generation chamber 4, which is a part of the waveguide, is provided with a gas inlet 9 in a part thereof, and the waveguide 6 and the microwave oscillator 11 having JIS standard dimensions are passed through the microwave transmission chamber 10. are connected as shown. The microwave transmission window 10 is air-sealed with an O-ring 12 as shown in the figure to maintain a vacuum in the plasma generation chamber 4, and is generally made of a material such as quartz or alumina.

かかるように構成されたマイクロ波プラズマ処理装置を
用いて試料7をプラズマ処理する場合には前記試料7を
試料ステージ8上に載置し、排気口2より真空排気して
ガス導入口9よシ所望の処理ガス全導入してプラズマ発
生室4及び試料処理室1内を所定の真空度に々るように
調整する。次いでマイクロ波発振器11を作動して導波
管(JIS規格)及び透過窓10を介して2.45 G
Hgのマイクロ波全プラズマ発生室4内の処理ガスに作
用してプラズマ全発生し、ラジオ/vを主体としたプラ
ズマエツチングガスがプラズマ噴出孔6よ多試料処理室
内1に導入され前記試料7がエツチング処理される。
When plasma processing the sample 7 using the microwave plasma processing apparatus configured as described above, the sample 7 is placed on the sample stage 8, evacuated from the exhaust port 2, and then pumped through the gas inlet 9. All of the desired processing gases are introduced and the interiors of the plasma generation chamber 4 and sample processing chamber 1 are adjusted to a predetermined degree of vacuum. Next, the microwave oscillator 11 is activated to generate 2.45 G through the waveguide (JIS standard) and the transmission window 10.
The microwave of Hg acts on the processing gas in the plasma generation chamber 4 to generate a total plasma, and the plasma etching gas mainly composed of radio/v is introduced into the multi-sample processing chamber 1 through the plasma nozzle 6, and the sample 7 is Etched.

この場合導波管の一部であるプラズマ発生室内には図示
したように定在波Aが発生するが、従来の装置において
は此の定在波Aとマイクロ波透過窓IDk設ける位置に
ついて特に留意がなされておらず、そのために前記透過
窓10の定在波による発熱が一つの問題であった。即ち
透過窓10の発熱によってたとえば四弗化炭素(OF4
)などの処理ガスを用いる場合には石英などよシなる透
過窓のエツチングが促進さn装置の野分が短かくなるな
どの問題があり、又アルミナ材質の透過窓10′におい
ては処理ガスにエツチングはされないがマイクロ波の吸
収量が大きく高温になシ真空封止用のOリング12が焼
けつくなどの障害が起り問題でちった。
In this case, a standing wave A is generated in the plasma generation chamber, which is a part of the waveguide, as shown in the figure, but in conventional equipment, special attention must be paid to the location of this standing wave A and the microwave transmission window IDk. Therefore, heat generation due to standing waves in the transmission window 10 was a problem. That is, due to the heat generated by the transmission window 10, for example, carbon tetrafluoride (OF4
), etc., there is a problem that the etching of the transparent window made of quartz or other materials is promoted and the field of the device becomes short. Although it is not etched, it absorbs a large amount of microwaves and cannot be used at high temperatures, causing problems such as burning of the O-ring 12 for vacuum sealing.

(C)  発明の目的 本発明の目的はかかる問題点に鑑みなされたものでマイ
クロ波透過窓の発熱を極力少なくしうる構造にすること
によって従来装置に比べて安定して処理可能な長寿命の
マイクロ波プラズマ処理装置の提供にある。
(C) Purpose of the Invention The purpose of the present invention was made in view of the above-mentioned problems, and by creating a structure that can minimize the heat generation of the microwave transmission window, it is possible to provide a long-life device that can perform processing more stably than conventional devices. The present invention provides a microwave plasma processing device.

(d)  発明の構成 その目的全達成するため本発明はマイクロ数発生装置と
、該マイクロ波発生装置から延出された導波管と、該導
波管の一部をなし、且つマイクロ波透過窓が設けられた
プラズマ発生室と、該プラズマ発生室に接し、上記プラ
ズマ噴出孔を介して連通ずる試料処理室と全具備し、前
記マイクロ波透過窓が、定在波の電場の振幅が最小とな
る位置に設けられたこと全特徴とする。
(d) Structure of the Invention In order to achieve all of its objects, the present invention comprises a microwave generator, a waveguide extending from the microwave generator, and a microwave-transmitting device that is a part of the waveguide and that is transparent to microwaves. It is fully equipped with a plasma generation chamber provided with a window, and a sample processing chamber that is in contact with the plasma generation chamber and communicates with it through the plasma ejection hole, and the microwave transmission window has a minimum amplitude of the electric field of the standing wave. All features are that it is located in a position where

(e)  発明の実施例 以下本発明の実施例について図面全参照して説明する。(e) Examples of the invention Embodiments of the present invention will be described below with reference to all the drawings.

第2図は本発明の一実施例のマイクロ波プラズマ処理装
置の模式的概略構成図である。
FIG. 2 is a schematic diagram of a microwave plasma processing apparatus according to an embodiment of the present invention.

同図において21は試料処理室、22は排気口。In the figure, 21 is a sample processing chamber, and 22 is an exhaust port.

26はJIS規格寸法を有する導波管、24は導波’f
の一部であるプラズマ発生室、25は遮蔽板。
26 is a waveguide having JIS standard dimensions, 24 is a waveguide 'f
25 is a shielding plate.

26はプラズマ噴出孔(シールド孔)、27は試料、2
8は試料載置台、29はガス導入口、60はマイクロ波
透過窓、61はマイクロ波発生装置。
26 is a plasma ejection hole (shield hole), 27 is a sample, 2
8 is a sample mounting table, 29 is a gas inlet, 60 is a microwave transmission window, and 61 is a microwave generator.

62はOリングを示す。62 indicates an O-ring.

本発明の一実施例のマイクロ波プラズマ処理装置が従来
と異なる点は図示したようにマイクロ波透過窓60がプ
ラズマ発生室24に発生する定在波Bの電場の振幅が最
小となる位置に設けられた点にある。即ちプラズマ発生
室が導波管形状であるため、この時マイクロ波の定在波
の位相が計算θ できることからその電場振幅が理論上[]ff/31i
(完全 威反射を仮定した場合)にマイクロ波透過窓60を設け
ることによシ従来装置に比べてマイクロ波による発熱全
かなり低くすることが可能となった。
The difference between the microwave plasma processing apparatus according to the embodiment of the present invention and the conventional one is that, as shown in the figure, the microwave transmission window 60 is provided at a position where the amplitude of the electric field of the standing wave B generated in the plasma generation chamber 24 is minimized. It is at the point where That is, since the plasma generation chamber has a waveguide shape, the phase of the standing microwave wave can be calculated at this time, so the electric field amplitude is theoretically []ff/31i
By providing the microwave transmission window 60 (assuming perfect reflection), it has become possible to significantly reduce the amount of heat generated by microwaves compared to conventional devices.

その結果石英板よりなるマイクロ波透過窓30のエツチ
ングレートが軽減きれ装置の長寿命化が可能となシ、又
アルミナ材よシなるマイクロ波透過窓においては温度上
昇による0リンクろ2の睨きつきなどの障害が防止され
、安定して試料27のプラズマ処理が可能となった。
As a result, the etching rate of the microwave transmitting window 30 made of quartz plate can be reduced, making it possible to extend the life of the device.Also, in the case of a microwave transmitting window made of alumina, the 0-link filter 2 will not glare due to temperature rise. Problems such as these were prevented, and stable plasma processing of sample 27 became possible.

(f)  発明の詳細 な説明したごとく本発明によればマイクロ波透過窓を定
在波の電場の振幅が最小になる位置に設けたことにより
、従来装置に比べて透過窓の発熱による損傷を防止する
ことがi5J能となり、安定して試料処理を行なうこと
ができ、又製造の寿命をのばすことかり能となり、装置
保守の経費節減に効果があると同時に処理試料の品質向
上に効果がある。
(f) As described in detail, according to the present invention, by providing the microwave transmission window at a position where the amplitude of the electric field of the standing wave is minimized, damage to the transmission window due to heat generation is reduced compared to conventional devices. Prevention is the i5J function, and sample processing can be performed stably, and the production life can be extended, which is effective in reducing equipment maintenance costs and at the same time improving the quality of processed samples. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来装置の模式的概略構成図、第2図は本発明
の一実施例の模式的概略構成図である。 図において、1,21は試料処理室、2.23は導波管
、4.24はプラズマ発生室、6.26はプラズマ噴出
孔、7.27は試料、9.29はガヌ導入口袋ヤ0はマ
イクロ波透過窓、61は72 イクロ波発生装置、Ff、32はOリング、Bは定在波
を示す。 第1図 第2図 9
FIG. 1 is a schematic diagram of a conventional device, and FIG. 2 is a schematic diagram of an embodiment of the present invention. In the figure, 1 and 21 are sample processing chambers, 2.23 is a waveguide, 4.24 is a plasma generation chamber, 6.26 is a plasma ejection hole, 7.27 is a sample, and 9.29 is a Ganu inlet bag housing. 0 indicates a microwave transmission window, 61 indicates 72 a microwave generator, Ff, 32 indicates an O-ring, and B indicates a standing wave. Figure 1 Figure 2 Figure 9

Claims (1)

【特許請求の範囲】[Claims] マイクロ波発生装置と、該マイクロ波発生装置から延出
された導波管と、該導波管の一部をなし、且つマイクロ
波透過窓が設けられたプラズマ発生室と、該プラズマ発
生室に接し、上記プラズマ噴出孔を介して連通ずる試料
処理室と全具備し、前記マイクロ波透過窓が、定在波の
電場の振幅が最小となる位置に設けられたことを特徴と
するマイクロ波プラズマ処理装置。
A microwave generator, a waveguide extending from the microwave generator, a plasma generation chamber forming a part of the waveguide and provided with a microwave transmission window, and a plasma generation chamber in the plasma generation chamber. A microwave plasma, characterized in that it is completely equipped with a sample processing chamber that is in contact with the sample processing chamber and communicates with it via the plasma ejection hole, and the microwave transmission window is provided at a position where the amplitude of the electric field of the standing wave is minimized. Processing equipment.
JP58084489A 1983-05-13 1983-05-13 Microwave plasma treating device Granted JPS59208838A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58084489A JPS59208838A (en) 1983-05-13 1983-05-13 Microwave plasma treating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58084489A JPS59208838A (en) 1983-05-13 1983-05-13 Microwave plasma treating device

Publications (2)

Publication Number Publication Date
JPS59208838A true JPS59208838A (en) 1984-11-27
JPH0247851B2 JPH0247851B2 (en) 1990-10-23

Family

ID=13832063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58084489A Granted JPS59208838A (en) 1983-05-13 1983-05-13 Microwave plasma treating device

Country Status (1)

Country Link
JP (1) JPS59208838A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222638A (en) * 1986-03-20 1987-09-30 Fujitsu Ltd Microwave plasma processing unit
US5961775A (en) * 1987-08-19 1999-10-05 Fujitsu Limited Apparatus for removing organic resist from semiconductor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04192848A (en) * 1990-11-27 1992-07-13 Iwatsu Electric Co Ltd Incoming circuit of telephone equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222638A (en) * 1986-03-20 1987-09-30 Fujitsu Ltd Microwave plasma processing unit
JPH053735B2 (en) * 1986-03-20 1993-01-18 Fujitsu Ltd
US5961775A (en) * 1987-08-19 1999-10-05 Fujitsu Limited Apparatus for removing organic resist from semiconductor

Also Published As

Publication number Publication date
JPH0247851B2 (en) 1990-10-23

Similar Documents

Publication Publication Date Title
KR890002732B1 (en) Microwave plasma processing apparatus
US4987284A (en) Downstream microwave plasma processing apparatus having an improved coupling structure between microwave plasma
US6783629B2 (en) Plasma treatment apparatus with improved uniformity of treatment and method for improving uniformity of plasma treatment
KR960043012A (en) Plasma processing method and apparatus
JPH0729885A (en) Semiconductor manufacturing equipment and manufacture of semiconductor by use of same
EP0295083A3 (en) Apparatus and method for enhanced chemical processing in high pressure and atmospheric plasmas produced by high frequency electro-magnetic waves
USRE36224E (en) Microwave plasma processing process and apparatus
KR950034579A (en) Plasma treatment method and apparatus
JPS6245122A (en) Treater
EP0641150A4 (en) Process apparatus.
KR100479794B1 (en) Radial antenna and plasma processing apparatus comprising the same
JPS63155728A (en) Plasma processor
JPS59208838A (en) Microwave plasma treating device
JPH0352217B2 (en)
JPS5946031A (en) Plasma treating device
JPH09171900A (en) Plasma generating device
JP2967681B2 (en) Microwave plasma processing equipment
JPS63100186A (en) Microwave plasma treating device
JPS60223126A (en) Plasma treater
JPH10294199A (en) Microwave plasma processing device
JPS59231817A (en) Microwave plasma processing apparatus
JP2972507B2 (en) Microwave plasma processing equipment
JP2001044175A (en) Plasma processing apparatus
JPS6446916A (en) Vacuum thin-film formation device
JPS6015931A (en) Reactive ion etching process