JPH0247851B2 - - Google Patents

Info

Publication number
JPH0247851B2
JPH0247851B2 JP58084489A JP8448983A JPH0247851B2 JP H0247851 B2 JPH0247851 B2 JP H0247851B2 JP 58084489 A JP58084489 A JP 58084489A JP 8448983 A JP8448983 A JP 8448983A JP H0247851 B2 JPH0247851 B2 JP H0247851B2
Authority
JP
Japan
Prior art keywords
plasma
microwave
transmission window
waveguide
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58084489A
Other languages
Japanese (ja)
Other versions
JPS59208838A (en
Inventor
Shuzo Fujimura
Toshimasa Kisa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58084489A priority Critical patent/JPS59208838A/en
Publication of JPS59208838A publication Critical patent/JPS59208838A/en
Publication of JPH0247851B2 publication Critical patent/JPH0247851B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357Generation remote from the workpiece, e.g. down-stream

Description

【発明の詳細な説明】 (a)発明の技術分野 本発明はマイクロ波プラズマ処理装置の改良に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to improvements in microwave plasma processing equipment.

(b) 従来技術と問題点 従来プラズマ処理を行なう場合、たとえばシリ
コン基板などの試料に損傷を与えないことや、試
料の処理均一性のため、たとえば第1図に示すよ
うなプラズマ発生室と試料処理室を所定のプラズ
マ噴出孔(シールド孔)を有する遮蔽板によつて
分離されたマイクロ波プラズマ処理装置が用いら
れている。
(b) Prior art and problems When conventional plasma processing is performed, it is necessary to avoid damaging samples such as silicon substrates and to ensure uniformity of sample processing. A microwave plasma processing apparatus is used in which a processing chamber is separated by a shielding plate having predetermined plasma ejection holes (shield holes).

即ち同図において該試料処理室1のは排気口2
を介して真空に排気され、該試料処理室1の上部
には導波管3の一部であるプラズマ発生室4が設
けられている。該プラズマ発生室4と前記試料処
理室1の間に介在する遮蔽板5(導波管の一部)
は両室を分離するための隔壁となつており、該遮
蔽板5には所定のプラズマ噴出孔6(シールド
孔)が複数個配設され両室が連通されている。前
記試料処理室1内には試料7を載置する試料ステ
ージ8が設けられている。又前記導波管の一部で
あるプラズマ発生室4はその一部にガス導入口9
が設けられ、マイクロ波透過室10を介してJIS
規格寸法を有する前記導波管3及びマイクロ波発
振器11が図示したように連結されている。尚マ
イクロ波透過窓10はプラズマ発生室4の真空を
保つためにOリング12によつて図示したように
真空封止されており、一般に石英又はアルミナな
どの材質によつて構成されている。
That is, in the same figure, the sample processing chamber 1 has an exhaust port 2.
The sample processing chamber 1 is evacuated to a vacuum via the plasma chamber 1, and a plasma generation chamber 4, which is a part of the waveguide 3, is provided in the upper part of the sample processing chamber 1. A shielding plate 5 (part of a waveguide) interposed between the plasma generation chamber 4 and the sample processing chamber 1
serves as a partition wall for separating the two chambers, and a plurality of predetermined plasma ejection holes 6 (shield holes) are provided in the shielding plate 5 to communicate the two chambers. A sample stage 8 on which a sample 7 is placed is provided within the sample processing chamber 1 . Further, the plasma generation chamber 4, which is a part of the waveguide, has a gas inlet 9 in a part thereof.
is provided, and the JIS
The waveguide 3 and the microwave oscillator 11 having standard dimensions are connected as shown. The microwave transmission window 10 is vacuum sealed with an O-ring 12 as shown in the figure in order to maintain a vacuum in the plasma generation chamber 4, and is generally made of a material such as quartz or alumina.

かかるように構成されたマイクロ波プラズマ処
理装置を用いて試料7をプラズマ処理する場合に
は前記試料7を試料ステージ8上に載置し、排気
口2より真空排気してガス導入口9より所望の処
理ガスを導入してプラズマ発生室4及び試料処理
室1内を所定の真空度になるように調整する。次
いでマイクロ波発振器11を作動して導波管
(JIS規格)及び透過窓10を介して2.45GHgのマ
イクロ波をプラズマ発生室4内の処理ガスに作用
してプラズマを発生し、ラジカルを主体としたプ
ラズマエツチングガスがプラズマ噴出孔6より試
料処理室内1に導入され前記試料7がエツチング
処理される。
When the sample 7 is subjected to plasma processing using the microwave plasma processing apparatus configured as described above, the sample 7 is placed on the sample stage 8, evacuated through the exhaust port 2, and the desired amount is extracted through the gas inlet 9. A processing gas is introduced to adjust the inside of the plasma generation chamber 4 and the sample processing chamber 1 to a predetermined degree of vacuum. Next, the microwave oscillator 11 is activated to apply microwaves of 2.45 GHg to the processing gas in the plasma generation chamber 4 through the waveguide (JIS standard) and the transmission window 10 to generate plasma, which mainly consists of radicals. The plasma etching gas is introduced into the sample processing chamber 1 through the plasma jet hole 6, and the sample 7 is etched.

この場合導波管の一部であるプラズマ発生室内
には図示したように定在波Aが発生するが、従来
の装置においては此の定在波Aとマイクロ波透過
窓10を設ける位置について特に留意がなされて
おらず、そのために前記透過窓10の定在波によ
る発熱が一つの問題であつた。即ち透過窓10の
発熱によつてたとえば四弗化炭素(CF4)などの
処理ガスを用いる場合には石英などよりなる透過
窓のエツチングが促進され装置の寿命が短かくな
るなどの問題があり、又アルミナ材質の透過窓1
0においては処理ガスにエツチングはされないが
マイクロ波の吸収量が大きく高温になり真空封止
用のOリング12が焼けつくなどの障害が起り問
題であつた。
In this case, a standing wave A is generated in the plasma generation chamber, which is a part of the waveguide, as shown in the figure, but in the conventional device, this standing wave A and the position where the microwave transmission window 10 is provided are particularly limited. This was not taken into consideration, and as a result, heat generation due to standing waves in the transmission window 10 was a problem. That is, when a processing gas such as carbon tetrafluoride (CF 4 ) is used due to heat generated by the transmission window 10, etching of the transmission window made of quartz or the like is accelerated, resulting in problems such as shortening of the life of the device. , and a transparent window 1 made of alumina material.
At 0, etching is not caused by the processing gas, but the amount of microwave absorption is large and the temperature rises, causing problems such as burning of the O-ring 12 for vacuum sealing.

(c) 発明の目的 本発明の目的はかかる問題点に鑑みなされたも
のでマイクロ波透過窓の発熱を極力少なくしうる
構造にすることによつて従来装置に比べて安定し
て処理可能な長寿命のマイクロ波プラズマ処理装
置の提供にある。
(c) Purpose of the Invention The purpose of the present invention was made in view of the above-mentioned problems, and by creating a structure that can minimize the heat generation of the microwave transmission window, it is possible to provide a long-distance processing device that can be processed more stably than conventional devices. Our goal is to provide microwave plasma processing equipment with a long service life.

(d) 発明の構成 その目的を達成するため本発明はマイクロ波発
生装置と、該マイクロ波発生装置から延出された
導波管と、該導波管の一部をなし、且つマイクロ
波透過窓が設けられたプラズマ発生室と、該プラ
ズマ発生室に接し、上記プラズマ噴出孔を介して
連通する試料処理室とを具備し、前記マイクロ波
透過窓が、定在波の電場の振幅が最小となる位置
に設けられたことを特徴とする。
(d) Structure of the Invention In order to achieve the object, the present invention includes a microwave generator, a waveguide extending from the microwave generator, and a microwave transmitting device that is a part of the waveguide and that is transparent to microwaves. It comprises a plasma generation chamber provided with a window, and a sample processing chamber that is in contact with the plasma generation chamber and communicates with it through the plasma ejection hole, and the microwave transmission window is arranged so that the amplitude of the electric field of the standing wave is minimized. It is characterized by being installed in a position where

(e) 発明の実施例 以下本発明の実施例について図面を参照して説
明する。第2図は本発明の一実施例のマイクロ波
プラズマ処理装置の模式的概略構成図である。
(e) Embodiments of the invention Examples of the invention will be described below with reference to the drawings. FIG. 2 is a schematic diagram of a microwave plasma processing apparatus according to an embodiment of the present invention.

同図において21は試料処理室、22は排気
口、23はJIS規格寸法を有する導波管、24は
導波管の一部であるプラズマ発生室、25は遮蔽
板、26はプラズマ噴出孔(シールド孔)、27
は試料、28は試料載置台、29はガス導入口、
30はマイクロ波透過窓、31はマイクロ波発生
装置、32はOリングを示す。
In the figure, 21 is a sample processing chamber, 22 is an exhaust port, 23 is a waveguide having JIS standard dimensions, 24 is a plasma generation chamber which is a part of the waveguide, 25 is a shielding plate, and 26 is a plasma ejection hole ( shield hole), 27
is the sample, 28 is the sample mounting table, 29 is the gas inlet,
30 is a microwave transmission window, 31 is a microwave generator, and 32 is an O-ring.

本発明の一実施例のマイクロ波プラズマ処理装
置が従来と異なる点は図示したようにマイクロ波
透過窓30がプラズマ発生室24に発生する定在
波Bの電場の振幅が最小となる位置に設けられた
点にある。即ちプラズマ発生室が導波管形状であ
るため、この時マイクロ波の定在波の位相が計算
できることからその電場振幅が理論上0の所(完
全反射を仮定した場合)にマイクロ波透過窓30
を設けることにより従来装置に比べてマイクロ波
による発熱をかなり低くすることが可能となつ
た。その結果石英板よりなるマイクロ波透過窓3
0のエツチングレートが軽減され装置の長寿命化
が可能となり、又アルミナ材よりなるマイクロ波
透過窓においては温度上昇によるOリング32の
焼きつきなどの障害が防止され、安定して試料2
7のプラズマ処理が可能となつた。
The difference between the microwave plasma processing apparatus according to the embodiment of the present invention and the conventional one is that, as shown in the figure, the microwave transmission window 30 is provided at a position where the amplitude of the electric field of the standing wave B generated in the plasma generation chamber 24 is minimized. It is at the point where That is, since the plasma generation chamber has a waveguide shape, the phase of the microwave standing wave can be calculated, so the microwave transmission window 30 is placed where the electric field amplitude is theoretically 0 (assuming complete reflection).
By providing this, it has become possible to significantly reduce heat generation due to microwaves compared to conventional devices. As a result, a microwave transmitting window 3 made of a quartz plate
The etching rate of 0 is reduced, making it possible to extend the life of the device, and the microwave transmission window made of alumina prevents problems such as seizure of the O-ring 32 due to temperature rise, allowing stable etching of sample 2.
7 plasma processing is now possible.

(f) 発明の効果 以上説明したごとく本発明によればマイクロ波
透過窓を定在波の電場の振幅が最小になる位置に
設けたことにより、従来装置に比べて透過窓の発
熱による損傷を防止することが可能となり、安定
して試料処理を行なうことができ、又製造の寿命
をのばすことが可能となり、装置保守の経費節減
に効果があると同時に処理試料の品質向上に効果
がある。
(f) Effects of the Invention As explained above, according to the present invention, by providing the microwave transmission window at a position where the amplitude of the electric field of the standing wave is minimized, damage to the transmission window due to heat generation is reduced compared to conventional devices. This makes it possible to perform stable sample processing and extend the life of the product, which is effective in reducing equipment maintenance costs and at the same time improving the quality of processed samples.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来装置の模式的概略構成図、第2図
は本発明の一実施例の模式的概略構成図である。 図において、1,21は試料処理室、3,23
は導波管、4,24はプラズマ発生室、6,26
はプラズマ噴出孔、7,27は試料、9,29は
ガス導入口、10,30はマイクロ波透過窓、3
1はマイクロ波発生装置、12,32はOリン
グ、Bは定在波を示す。
FIG. 1 is a schematic diagram of a conventional device, and FIG. 2 is a schematic diagram of an embodiment of the present invention. In the figure, 1 and 21 are sample processing chambers, 3 and 23
is a waveguide, 4, 24 is a plasma generation chamber, 6, 26
is a plasma ejection hole, 7 and 27 are samples, 9 and 29 are gas inlet ports, 10 and 30 are microwave transmission windows, 3
1 is a microwave generator, 12 and 32 are O-rings, and B is a standing wave.

Claims (1)

【特許請求の範囲】[Claims] 1 マイクロ波発生装置と、該マイクロ波発生装
置から延出された導波管と、該導波管の一部をな
し、且つマイクロ波透過窓が設けられたプラズマ
発生室と、該プラズマ発生室に接し、上記プラズ
マ噴出孔を介して連通する試料処理室とを具備
し、前記マイクロ波透過窓が、定在波の電場の振
幅が最小となる位置に設けられたことを特徴とす
るマイクロ波プラズマ処理装置。
1. A microwave generator, a waveguide extending from the microwave generator, a plasma generation chamber that forms part of the waveguide and is provided with a microwave transmission window, and the plasma generation chamber. and a sample processing chamber that is in contact with and communicates with through the plasma ejection hole, and wherein the microwave transmission window is provided at a position where the amplitude of the electric field of the standing wave is minimized. Plasma processing equipment.
JP58084489A 1983-05-13 1983-05-13 Microwave plasma treating device Granted JPS59208838A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58084489A JPS59208838A (en) 1983-05-13 1983-05-13 Microwave plasma treating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58084489A JPS59208838A (en) 1983-05-13 1983-05-13 Microwave plasma treating device

Publications (2)

Publication Number Publication Date
JPS59208838A JPS59208838A (en) 1984-11-27
JPH0247851B2 true JPH0247851B2 (en) 1990-10-23

Family

ID=13832063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58084489A Granted JPS59208838A (en) 1983-05-13 1983-05-13 Microwave plasma treating device

Country Status (1)

Country Link
JP (1) JPS59208838A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04192848A (en) * 1990-11-27 1992-07-13 Iwatsu Electric Co Ltd Incoming circuit of telephone equipment

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222638A (en) * 1986-03-20 1987-09-30 Fujitsu Ltd Microwave plasma processing unit
JPH0777211B2 (en) * 1987-08-19 1995-08-16 富士通株式会社 Ashing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04192848A (en) * 1990-11-27 1992-07-13 Iwatsu Electric Co Ltd Incoming circuit of telephone equipment

Also Published As

Publication number Publication date
JPS59208838A (en) 1984-11-27

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