JPS59204267A - Thin film reading device - Google Patents
Thin film reading deviceInfo
- Publication number
- JPS59204267A JPS59204267A JP58079021A JP7902183A JPS59204267A JP S59204267 A JPS59204267 A JP S59204267A JP 58079021 A JP58079021 A JP 58079021A JP 7902183 A JP7902183 A JP 7902183A JP S59204267 A JPS59204267 A JP S59204267A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- layer
- thin film
- substrate
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title description 14
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 229910021417 amorphous silicon Inorganic materials 0.000 abstract description 9
- 230000002950 deficient Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 30
- 239000011651 chromium Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 12
- 229910052804 chromium Inorganic materials 0.000 description 12
- 239000010408 film Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 150000003376 silicon Chemical class 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000000197 pyrolysis Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/09—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/095—Devices sensitive to infrared, visible or ultraviolet radiation comprising amorphous semiconductors
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は薄膜読取シ装置にかかシ、特に、イメージセン
サ等に用いられるサンドイッチ構造の長尺薄膜読取り装
置に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a thin film reading device, and more particularly to a long thin film reading device having a sandwich structure used in image sensors and the like.
〈従来技術〉
従来、ファクシミリ等の入力部に用いられる原稿読取シ
装置としては、C0D1 フォトダイオードアレイ等の
半導体イメージセンサが主であったが、これらの装置に
おいては、通常絹小光学系を用いる為、光路長が長くな
シ、これは装装置の小型化をはばむ理由となっていた。<Prior art> Conventionally, semiconductor image sensors such as C0D1 photodiode arrays have been the main source of document reading devices used in input sections of facsimile machines, etc., but these devices usually use small optical systems. Therefore, the optical path length is long, which is a reason that prevents miniaturization of the mounting device.
最近、装置の小型化をはかるために、光導電体としての
非晶質シリコンを、金属電極及び透明電極で挾持したサ
ンドイッチ構造の長尺薄膜読取り装置が提案されている
。Recently, in order to reduce the size of the device, a long thin film reader having a sandwich structure in which amorphous silicon as a photoconductor is sandwiched between a metal electrode and a transparent electrode has been proposed.
この長尺薄膜読取シ装置は、第1図に平面図、第2図に
第1図のA−A断面図を示す如く、絶縁基板1上に、ビ
ットに対応して、1列に形成された金属・電極2と、こ
れらの金属電極2を曖うように形成された非晶質シリコ
ン層3と、この非晶質シリコン層3上に全面にわたって
一体的に形成された透明電極5とよシ構成されるもので
ある。As shown in FIG. 1 as a plan view and as shown in FIG. 2 as a cross-sectional view taken along line A-A in FIG. metal electrodes 2, an amorphous silicon layer 3 formed so as to cover these metal electrodes 2, and a transparent electrode 5 integrally formed over the entire surface of the amorphous silicon layer 3. It is composed of
この長尺薄膜読取シ装置においては、通常、絶縁基板1
上に、アルミニウム(A/ ) 、クロム(Cr)、金
(Au )等の薄膜を着膜したのち、フォトリソグラフ
ィ等を用いて、数100〜数1000オングストローム
(X)の膜厚の金属電極2を形成し、次いで蒸着、プラ
ズマ熱分解成長法(プラズマCVD)、ス・ぐツタ法等
により、非晶質シリコン層が着膜される。In this long thin film reading device, usually an insulating substrate 1
After depositing a thin film of aluminum (A), chromium (Cr), gold (Au), etc. on top, a metal electrode 2 with a film thickness of several hundred to several thousand angstroms (X) is formed using photolithography or the like. is formed, and then an amorphous silicon layer is deposited by vapor deposition, plasma pyrolysis growth (plasma CVD), sintering method, or the like.
しかしながら、この非晶質シリコン層は下部の金属電極
2の端部段差部分において、部分的に薄くなったり、膜
質か弱くなったりする為、金属電極と上部の透明電極と
の間に電圧を印加した時、ピンホール等によるリークに
起因して、この段差部分で、絶縁破壊が生じ、欠陥ビッ
トを生じ易いという欠点があった。また、これを防ぐた
めに、金属電極2の膜厚を小さくして段差を小さくする
という方法も考えられているが、この方法では、金属電
極自体に、断線、ピンホール等の欠陥が発生し易いとい
う欠点があった。However, this amorphous silicon layer becomes partially thinner or has a weaker film quality at the step part at the end of the lower metal electrode 2, so it is difficult to apply a voltage between the metal electrode and the upper transparent electrode. However, due to leakage caused by pinholes or the like, dielectric breakdown occurs at this stepped portion, which tends to cause defective bits. Additionally, in order to prevent this, a method has been considered in which the film thickness of the metal electrode 2 is reduced to reduce the step difference, but with this method, defects such as disconnections and pinholes are likely to occur in the metal electrode itself. There was a drawback.
〈発明の目的〉
本発明は、前記実情に鑑みてなされたもので、欠陥ビッ
トの発生率が小さく、信頼性の高い薄膜読取シ装置を提
供することを目的とする。<Object of the Invention> The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a highly reliable thin film reading device with a low incidence of defective bits.
〈発明の構成〉
本発明は、基板上に所定のパターンで形成された第1電
極と第2電極とによって光導電体層か挟持されてなるサ
ンドイワナ構造の薄hr tj/n取り装置において、
前記光導電体層を前記第1電極の先端よシもやや退いて
形成し、前方の残余部には絶縁層を形成すると共に、前
記第2屯極をl−1IJ記ぶも1准極の電極幅よシも小
さい幅をもつように・セターニングすることによシ、セ
/す部すなわち、前記第1電極と第2電極とで囲まれた
部分においては、光導電体層が前記第1電極の段差忙横
切ることのないようにし、光導電体層のピンホール等に
よるリークの発生を抑制しようとするものである、。<Structure of the Invention> The present invention provides a thin hr tj/n removing device having a sand char structure in which a photoconductor layer is sandwiched between a first electrode and a second electrode formed in a predetermined pattern on a substrate.
The photoconductor layer is formed slightly away from the tip of the first electrode, and an insulating layer is formed on the remaining portion in front, and the second ion pole is written as 1-1IJ, and 1 quasi-pole is formed. By setering the photoconductor layer so that it has a smaller width than the electrode width, the photoconductor layer in the center area, that is, the area surrounded by the first electrode and the second electrode, is This is intended to prevent leakage caused by pinholes or the like in the photoconductor layer by preventing the electrode from crossing the step.
基板上に最初に形成される第1電極としてケユI用常、
金属電極が用いられ、次いで形成さ・れる光導電体層を
介して、この上に形成される第2′屯+Thとしては透
明電極が用いられる。Key I is commonly used as the first electrode that is initially formed on the substrate.
A metal electrode is used, and a transparent electrode is used as the second layer +Th formed thereon via a photoconductor layer that is subsequently formed.
また、基板側から光照射がなされるような特殊な場合は
、第1電極としては透明電極か用いられ、第2電極とし
ては金属電極等が用いられる。いずれの場合も、基板上
に形成される第1電極の形状に対応して、光導・屯体層
、及び第2電極の形状を決定することにより、第1電極
の形状による段差に起因して、この上に形成される光導
電体層上に表われる膜の不均一部が、センサ部に含まれ
るのを避けようとするものである。In a special case where light is irradiated from the substrate side, a transparent electrode is used as the first electrode, and a metal electrode or the like is used as the second electrode. In either case, by determining the shapes of the light guide/casing layer and the second electrode in accordance with the shape of the first electrode formed on the substrate, it is possible to eliminate the difference in level due to the shape of the first electrode. This is intended to prevent uneven portions of the film appearing on the photoconductor layer formed thereon from being included in the sensor section.
〈実施例〉
次に、本発明実施例の長尺薄膜読取シ装置について、図
面を参照しつつ説明する。<Example> Next, a long thin film reading device according to an example of the present invention will be described with reference to the drawings.
本発明実施例の長尺薄膜読取り装置は、第3図に平面図
、第4図にそのB−B断面図を示すように、絶縁性のガ
ラス基板lの表面の一長辺側から、所定形状に形成され
た被数個のクロム(Cr )電極2と、このクロム電極
2の先端かられずかに退いた位置で、クロム電極2を横
切るように形成された非晶質水素化シリコン層3と、こ
の非晶質水素化シリコン層3上にわずかな重なシ部を形
成しつつ、前記基板上にかけて形成された酸化シリコン
層4と、前記クロム電極の形成された長辺と対向する一
長辺側から、前記クロム電極の1つ1つに、非晶質水素
化シリコン層3を介して対向するように櫛状に形成され
た酸化インジウム錫+1&1 (ITOH’A)からな
る共通の透明電極5とより構成されている。As shown in FIG. 3 as a plan view and as shown in FIG. A number of chromium (Cr) electrodes 2 formed in a shape, and an amorphous silicon hydride layer 3 formed across the chromium electrode 2 at a position slightly set back from the tip of the chromium electrode 2. Then, while forming a slight overlapping portion on this amorphous hydrogenated silicon layer 3, the silicon oxide layer 4 formed over the substrate and the side facing the long side on which the chromium electrode is formed are formed. A common transparent layer made of indium tin oxide +1&1 (ITOH'A) formed in a comb shape so as to face each of the chromium electrodes from the long side with the amorphous silicon hydride layer 3 interposed therebetween. It is composed of an electrode 5.
この透明電極の電極幅はクロム電極の幅よシも小さく形
成される。The width of this transparent electrode is smaller than that of the chromium electrode.
次に、本発明実施例の長尺薄膜読取り装置の製造方法を
説明する。Next, a method of manufacturing a long thin film reading device according to an embodiment of the present invention will be explained.
まず、絶縁性のガラス基板1上に、電子ビーム蒸着法に
よって膜厚3000オングストローム(X)のクロム薄
膜を着膜し、フォトリングラフィによって、ビットに対
応するセンサ部を有する複数個のクロム電極を形成する
。First, a 3000 angstrom (X) thin chromium film is deposited on an insulating glass substrate 1 by electron beam evaporation, and a plurality of chromium electrodes each having a sensor portion corresponding to a bit are formed by photolithography. Form.
次いで、所定形状に形成された金属製の治具を基板表面
の所定位置に密着して配置し、これをマスクとしてプラ
ズマ熱分解法によって、非晶質水素化シリコン層3を前
記クロム電極2の先端よりわずかに退くように、帯状に
倉膜する。このとき使用するガスはモノシラン(SiH
4)、でメリ、基板温度250℃、放電圧力0.4トー
ル(Toor )、′籠極一基板間距離40覇、高周波
電力20W1ガス流量20標準cc分(SCCM)の条
件で約1μmの非晶質水素化シリコン層3を形成する。Next, a metal jig formed into a predetermined shape is placed in close contact with a predetermined position on the substrate surface, and using this as a mask, the amorphous silicon hydride layer 3 is formed on the chromium electrode 2 by plasma pyrolysis. The membrane is band-shaped, slightly receding from the tip. The gas used at this time is monosilane (SiH
4) Under the following conditions, a substrate temperature of 250°C, a discharge pressure of 0.4 Torr, a distance between the cage electrode and the substrate of 40 mm, a high frequency power of 20 W, a gas flow rate of 20 standard cc min (SCCM), and a non-conductor of approximately 1 μm. A crystalline hydrogenated silicon layer 3 is formed.
更に、所定形状に形成された金4yの治具を基板表面の
所定位置に密着して配置し、これをマスクとして、プラ
ズマ熱分解法によシ、酸化シリコン(SiO2’)膜4
を、前記非晶質水素化シリコン層3にわずかに重なるよ
うに形成する。このとき使用するガスは、モノシラ/(
5xH4)十酸化窒素(N20)の混合ガスであシ、基
板温度250℃、放電圧力I Toor、電極一基板間
距離40調、高周波電力100W、ガス流量としては5
iH45SCCM、N20250 SCCMの条件で5
000Xの厚さに着膜する。Furthermore, a gold jig 4y formed into a predetermined shape is placed in close contact with a predetermined position on the substrate surface, and using this as a mask, a silicon oxide (SiO2') film 4 is formed by plasma pyrolysis.
is formed so as to slightly overlap the amorphous hydrogenated silicon layer 3. The gas used at this time is monosil/(
5xH4) Deca oxide (N20) mixed gas, substrate temperature 250℃, discharge pressure IToor, electrode-to-substrate distance 40mm, high frequency power 100W, gas flow rate 5
5 under the conditions of iH45SCCM, N20250 SCCM
A film is deposited to a thickness of 000X.
最後に、透明電極5としてI To薄膜をDCスパッタ
リング法により全面に800X着膜する。そしてフォト
リングラフィによって、櫛状の透明電極5を形成する。Finally, as a transparent electrode 5, an I2To thin film is deposited at 800X on the entire surface by DC sputtering. A comb-shaped transparent electrode 5 is then formed by photolithography.
このようにして形成された長尺薄膜読取り装置の直流電
圧−電流特性f、第5図に示す。ここで縦軸を電流(A
/ctn2)、横軸をバイアス電圧(V)とする。Aは
100ルクス(1lux )の光照射を行ったときの光
電流の特性曲線、Bi”l:暗電流の特性曲線である。The DC voltage-current characteristic f of the elongated thin film reader thus formed is shown in FIG. Here, the vertical axis is the current (A
/ctn2), and the horizontal axis is the bias voltage (V). A is a characteristic curve of photocurrent when irradiated with light of 100 lux (1 lux), Bi''l is a characteristic curve of dark current.
図から明らかなように、光[(+、流は暗電流の105
倍であシ、良好な特性を有している。As is clear from the figure, the light [(+, current is 105 of the dark current
It has good characteristics as it is double sided.
また、非晶質水素化シリコン層はセンサ部すなわち、ク
ロム電極と透明電極とで挾まれた部分においては、段差
を有することなく平坦でありかつクロム電極の先端段差
部においては絶縁層が介在している為、との長尺薄膜読
取り4=1においては段差の上で層が薄くなったり、ピ
ンホールか発生したりすることによるリークの発生によ
って、欠陥ビットを生じることなく、信頼性が旨い。In addition, the amorphous hydrogenated silicon layer is flat without any step in the sensor part, that is, the part sandwiched between the chromium electrode and the transparent electrode, and an insulating layer is interposed in the step part at the tip of the chromium electrode. Because of this, when reading a long thin film with 4=1, there will be no defective bits due to leakage caused by the thinning of the layer on the step or the formation of pinholes, resulting in excellent reliability. .
実施例においては、絶縁膜としての版化シリコン膜4を
非晶質水素化シリコン層3−Hにわずかに重なるよう、
に形成したが、境界部における断面が互いに密着するよ
うに形成すれば、車な9部分を形成しなくても良いこと
は言うまでもない。In the embodiment, the printed silicon film 4 as an insulating film is formed so as to slightly overlap the amorphous hydrogenated silicon layer 3-H.
However, it goes without saying that if the cross-sections at the boundary portions are formed in close contact with each other, it is not necessary to form nine parts.
甘た、絶縁膜としては、実施例の数比シリコン膜の他、
窒化シリコンff’A、PSG 腰(phosph。As an insulating film, in addition to the silicon film in the example,
Silicon nitrideff'A, PSG phosph.
5ilicate glass )ポリイミド樹脂等の
使用もロエ能である。It is also possible to use polyimide resin (5ilicate glass), etc.
更に、実施例においては、上方から光が照射される場合
における構成を説明したが、下方の基板側から光が照射
される場合は透光性の絶縁基板を用いると共に、第1電
極を透明電極とし、第2′尾極を金属′電極とすればよ
い。Furthermore, in the embodiment, a configuration in which light is irradiated from above has been described, but when light is irradiated from the lower substrate side, a translucent insulating substrate is used and the first electrode is a transparent electrode. The second ′′ tail electrode may be a metal′ electrode.
〈効果〉
以上A説明してきたよう、に、本発明によれば、センサ
部すなわぢ、第1電極と第2電極とで囲まれた光導′心
体層の実効部分においては、光導電体層が平坦に形成さ
れるため、均質で良好な層構造となし侍、欠陥ピットの
発生が抑制され、信頼性の高い薄j換読取シ装置ρが提
供される。<Effects> As explained above, according to the present invention, in the sensor section, that is, in the effective part of the photoconductor core layer surrounded by the first electrode and the second electrode, the photoconductor Since the layers are formed flat, a homogeneous and good layer structure and the occurrence of defects and defective pits are suppressed, thereby providing a highly reliable thin J conversion reading device ρ.
第1財1は、従来の長尺薄膜読取シ装置の平面図、第2
図は、第1図のA−A断面図、
第3図は、本発明実施例の長尺薄膜読取シ装置の平面図
、
第4図は、第3図のB−B断面図、
第5図は、本発明実施例の長尺薄膜読取り装置の電流−
電圧特性を示す図である。
l・・・絶縁基板、2・・・金属電極、3・・・光碑屯
体層、4・・・絶縁体層、5・・・透明電極、A・・・
光′rI−5流の特性曲線、B・・・暗電流の特性曲線
。
第3図
第4図
(V)The first item 1 is a plan view of a conventional long thin film reader;
The figures are a sectional view taken along the line AA in FIG. The figure shows the current of a long thin film reader according to an embodiment of the present invention.
FIG. 3 is a diagram showing voltage characteristics. l... Insulating substrate, 2... Metal electrode, 3... Optical monument layer, 4... Insulator layer, 5... Transparent electrode, A...
Characteristic curve of light'rI-5 current, B...Characteristic curve of dark current. Figure 3 Figure 4 (V)
Claims (2)
の第1電極上に、この第1電極の先端よシもわずかに退
いて形成された光導電体層と、この光導電体層に隣接し
て形成され、少なくともこの第1電極の先端部を覆う絶
縁層と、前記第1電極に対向し、前記光導電体層上に延
びて形成され、前記第1電極の幅よりも小さい電極幅を
有する櫛状の第2電極とを具えだことを特徴とする薄膜
読取シ装置。(1) A plurality of first electrodes formed on an insulating substrate, a photoconductor layer formed on the first electrodes with the tip of the first electrodes slightly recessed, and a photoconductor layer formed on the first electrodes, an insulating layer formed adjacent to the photoconductor layer and covering at least the tip of the first electrode; and a comb-shaped second electrode having a small electrode width.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58079021A JPS59204267A (en) | 1983-05-06 | 1983-05-06 | Thin film reading device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58079021A JPS59204267A (en) | 1983-05-06 | 1983-05-06 | Thin film reading device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59204267A true JPS59204267A (en) | 1984-11-19 |
Family
ID=13678283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58079021A Pending JPS59204267A (en) | 1983-05-06 | 1983-05-06 | Thin film reading device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59204267A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63199458A (en) * | 1987-02-16 | 1988-08-17 | Hitachi Ltd | Light-receiving device and one-dimensional image sensor using this device and manufacture of said device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56135979A (en) * | 1980-03-28 | 1981-10-23 | Canon Inc | Photosensing element |
JPS5738062A (en) * | 1980-08-18 | 1982-03-02 | Ricoh Co Ltd | Input and output device |
JPS57197855A (en) * | 1981-05-29 | 1982-12-04 | Hitachi Ltd | Thin-film diode array |
-
1983
- 1983-05-06 JP JP58079021A patent/JPS59204267A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56135979A (en) * | 1980-03-28 | 1981-10-23 | Canon Inc | Photosensing element |
JPS5738062A (en) * | 1980-08-18 | 1982-03-02 | Ricoh Co Ltd | Input and output device |
JPS57197855A (en) * | 1981-05-29 | 1982-12-04 | Hitachi Ltd | Thin-film diode array |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63199458A (en) * | 1987-02-16 | 1988-08-17 | Hitachi Ltd | Light-receiving device and one-dimensional image sensor using this device and manufacture of said device |
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