JPS59197568A - スパツタリング用セラミツクスタ−ゲツト - Google Patents
スパツタリング用セラミツクスタ−ゲツトInfo
- Publication number
- JPS59197568A JPS59197568A JP7038783A JP7038783A JPS59197568A JP S59197568 A JPS59197568 A JP S59197568A JP 7038783 A JP7038783 A JP 7038783A JP 7038783 A JP7038783 A JP 7038783A JP S59197568 A JPS59197568 A JP S59197568A
- Authority
- JP
- Japan
- Prior art keywords
- target
- sputtering
- grooves
- groove
- cathode plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 32
- 239000000919 ceramic Substances 0.000 title claims abstract description 16
- 239000002245 particle Substances 0.000 claims 2
- 239000012528 membrane Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- -1 argon ions Chemical class 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000005291 magnetic effect Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 241000700159 Rattus Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7038783A JPS59197568A (ja) | 1983-04-21 | 1983-04-21 | スパツタリング用セラミツクスタ−ゲツト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7038783A JPS59197568A (ja) | 1983-04-21 | 1983-04-21 | スパツタリング用セラミツクスタ−ゲツト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59197568A true JPS59197568A (ja) | 1984-11-09 |
| JPS636626B2 JPS636626B2 (enrdf_load_stackoverflow) | 1988-02-10 |
Family
ID=13429977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7038783A Granted JPS59197568A (ja) | 1983-04-21 | 1983-04-21 | スパツタリング用セラミツクスタ−ゲツト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59197568A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63255356A (ja) * | 1987-04-10 | 1988-10-21 | Canon Electronics Inc | 薄膜形成方法 |
| EP1116800A4 (en) * | 1999-07-15 | 2004-09-08 | Nikko Materials Co Ltd | sputtering Target |
| JP2008255479A (ja) * | 2007-03-09 | 2008-10-23 | Mitsubishi Materials Corp | 蒸着材 |
-
1983
- 1983-04-21 JP JP7038783A patent/JPS59197568A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63255356A (ja) * | 1987-04-10 | 1988-10-21 | Canon Electronics Inc | 薄膜形成方法 |
| EP1116800A4 (en) * | 1999-07-15 | 2004-09-08 | Nikko Materials Co Ltd | sputtering Target |
| JP2008255479A (ja) * | 2007-03-09 | 2008-10-23 | Mitsubishi Materials Corp | 蒸着材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS636626B2 (enrdf_load_stackoverflow) | 1988-02-10 |
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