JPS59196119A - ばり取り装置 - Google Patents

ばり取り装置

Info

Publication number
JPS59196119A
JPS59196119A JP58070645A JP7064583A JPS59196119A JP S59196119 A JPS59196119 A JP S59196119A JP 58070645 A JP58070645 A JP 58070645A JP 7064583 A JP7064583 A JP 7064583A JP S59196119 A JPS59196119 A JP S59196119A
Authority
JP
Japan
Prior art keywords
scraper
flash
scrapers
semiconductor device
boss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58070645A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0425088B2 (https=
Inventor
Katsuichi Inagaki
稲垣　勝一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IDEYA KK
Original Assignee
IDEYA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IDEYA KK filed Critical IDEYA KK
Priority to JP58070645A priority Critical patent/JPS59196119A/ja
Publication of JPS59196119A publication Critical patent/JPS59196119A/ja
Publication of JPH0425088B2 publication Critical patent/JPH0425088B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/02—Deburring or deflashing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/045—Cleaning

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)
JP58070645A 1983-04-21 1983-04-21 ばり取り装置 Granted JPS59196119A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58070645A JPS59196119A (ja) 1983-04-21 1983-04-21 ばり取り装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58070645A JPS59196119A (ja) 1983-04-21 1983-04-21 ばり取り装置

Publications (2)

Publication Number Publication Date
JPS59196119A true JPS59196119A (ja) 1984-11-07
JPH0425088B2 JPH0425088B2 (https=) 1992-04-28

Family

ID=13437589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58070645A Granted JPS59196119A (ja) 1983-04-21 1983-04-21 ばり取り装置

Country Status (1)

Country Link
JP (1) JPS59196119A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6629880B1 (en) * 2000-12-14 2003-10-07 National Semiconductor Corporation Rotary mechanical buffing method for deflashing of molded integrated circuit packages
CN110576225A (zh) * 2019-09-25 2019-12-17 赣州经纬科技股份有限公司 一种去除毛刺设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5620169U (https=) * 1979-07-24 1981-02-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5620169U (https=) * 1979-07-24 1981-02-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6629880B1 (en) * 2000-12-14 2003-10-07 National Semiconductor Corporation Rotary mechanical buffing method for deflashing of molded integrated circuit packages
CN110576225A (zh) * 2019-09-25 2019-12-17 赣州经纬科技股份有限公司 一种去除毛刺设备

Also Published As

Publication number Publication date
JPH0425088B2 (https=) 1992-04-28

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