JPS59194416A - Laminated ceramic condenser - Google Patents
Laminated ceramic condenserInfo
- Publication number
- JPS59194416A JPS59194416A JP58068615A JP6861583A JPS59194416A JP S59194416 A JPS59194416 A JP S59194416A JP 58068615 A JP58068615 A JP 58068615A JP 6861583 A JP6861583 A JP 6861583A JP S59194416 A JPS59194416 A JP S59194416A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic capacitor
- laminated
- multilayer ceramic
- dielectric
- fine particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は積層セラミックコンデンサに関し、特に積層セ
ラミックコンデンサの誘電体シートの構成に関する。従
来、積層セラミックコンデンサは、第1図に示す如き内
部電極2を被着形成したセラミックの誘電体シート1を
内部電極2の端面露出部2aの向きが交互になるように
180°回転させた状態で複数枚を積層し、さらに、そ
の上下面に保護層となるセラミックの誘1に体シート1
′を複数枚積層して、全体を熱圧着して−i4\化し、
第2図に示す如きセラミックコンデンサ素体3を得て、
焼成した後その両端部に外形電極4を被着形成して製造
されている。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multilayer ceramic capacitor, and particularly to the structure of a dielectric sheet of a multilayer ceramic capacitor. Conventionally, a multilayer ceramic capacitor is manufactured by rotating a ceramic dielectric sheet 1 on which internal electrodes 2 are adhered, as shown in FIG. A plurality of sheets are laminated, and a body sheet 1 is placed on top and bottom of the ceramic layer 1 to serve as a protective layer.
' Laminated multiple sheets and heat-pressed the whole to -i4\,
A ceramic capacitor body 3 as shown in FIG. 2 was obtained,
After firing, external electrodes 4 are formed on both ends of the electrode.
かかる従来構造の積層セラミックコンデンサは、一般に
小型化φ薄形化を進めていくとセラミックコンデンサ素
体3の厚さが減少するだめの、機械的強度の低下jd避
けられない。したがってコンデンサ製造上の豊扱いに困
匂な面を生じ、歩留りの低下、すなわちコストアップに
つながる問題を有している。また、印刷配線板等に実装
する半田付けの際の、耐熱衝撃性も低下する問題も生じ
てくる。In general, in a multilayer ceramic capacitor having such a conventional structure, as the size and diameter of the capacitor are reduced, the thickness of the ceramic capacitor body 3 is reduced, which inevitably leads to a decrease in mechanical strength. Therefore, there is a problem in the production of capacitors, which leads to a decrease in yield and an increase in costs. Further, there arises the problem that the thermal shock resistance decreases during soldering when mounting on a printed wiring board or the like.
本発明の目的は、かかる従来問題を解決した積層セラミ
ックコンデンサを提供することにある。An object of the present invention is to provide a multilayer ceramic capacitor that solves the conventional problems.
本発明によれば、導′電性の内部電極を被着形成した誘
電体シートを複数枚交互!L積層し、さらにその上下面
に保護層となる誘電体シートを積層して熱圧着一体化し
fc積層セラミックコンデンサにおいて、保護層となる
誘電体シー ト中に高融点の微粒子を分散させたことを
特徴とする積層セラミックコンデンサが得られる。According to the present invention, a plurality of dielectric sheets each having a conductive internal electrode formed thereon are alternately formed! In FC multilayer ceramic capacitors, which are made by laminating L layers and then laminating dielectric sheets that serve as protective layers on the top and bottom surfaces and integrating them by thermocompression, fine particles with a high melting point are dispersed in the dielectric sheets that serve as the protective layers. A multilayer ceramic capacitor with characteristics can be obtained.
以下、本発明の一実鉋例を図面を参照して説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of a plane of the present invention will be described below with reference to the drawings.
第3図は、本発明の積層セラミックコンデンサの積層構
造を示す分解斜視図である。内部電極2を被着形成した
誘電体シート1の複数枚を内部電極2の端面2aが交互
になるように1800回転させて積層する。次に焼結ア
ルミナなどの高融点の゛微粒子をシート内に分散させた
誘電体シート11′を、上述のようYc積層した誘電体
シート1の上下面に1枚以上積層し、全体を熱圧溜し、
一体化する。FIG. 3 is an exploded perspective view showing the laminated structure of the laminated ceramic capacitor of the present invention. A plurality of dielectric sheets 1 having internal electrodes 2 formed thereon are laminated by rotating them 1800 times so that the end surfaces 2a of the internal electrodes 2 are alternated. Next, one or more dielectric sheets 11' in which fine particles with a high melting point such as sintered alumina are dispersed are laminated on the upper and lower surfaces of the Yc laminated dielectric sheet 1 as described above, and the whole is heated and pressed. Collect,
Unify.
とのように一体化形成したセラミックコンデンサ素体1
3は、第4図に示す如く表層近くの層に高融点の微粒子
が多数分散した状態となる。Ceramic capacitor body 1 integrally formed as shown in
In No. 3, as shown in FIG. 4, a large number of fine particles with a high melting point are dispersed in a layer near the surface layer.
従ってこのセラミックコンデンサ素体13を焼成すると
、扁誘点の微粒子が多数分散配置している表層部では、
誘電体7− ) 11’を構成するセラミンク誘電体の
粉末の焼結による収々6が介在する高・一点の微粒子に
より妨げられるために、15図に示す如く、表層部の収
縮12は中央部の収縮11よシも小さくなり、焼成後セ
ラミックコンデンサ素体13の表面層に圧縮応力Fが生
じ、圧縮応力のない子ラミックコンデンサ素体3罠比べ
て、曲げ変形などに対する琥械的強皮が向上する。Therefore, when this ceramic capacitor element body 13 is fired, in the surface layer where a large number of fine particles with an oblate attraction point are dispersed,
As shown in Fig. 15, the shrinkage 12 in the surface layer is caused by the sintering of the ceramic dielectric powder constituting the dielectric 7-) 11' due to the fine particles 6 intervening at a single point. The shrinkage 11 of the ceramic capacitor body 13 also becomes smaller, compressive stress F is generated in the surface layer of the ceramic capacitor element body 13 after firing, and the mechanical hardness against bending deformation is greater than that of the sub-ramic capacitor element body 3 which has no compressive stress. improves.
以上のように、本発明積層セラミノクコンデンサハ、従
来の積層セラミックコンデンサと比べて同一形状での機
械的強度が大きいため、小型化・薄形化した場合従来の
積層セラミックコンデンサはど機械的強度は低上せず、
製造上の取1汐いも容易なものとなシ、歩留シ向−F、
コストダウンに大きく寄与する。また、従来不可能であ
った領域の小型化・薄形化も可能となる利点を待ってい
る。As mentioned above, the multilayer ceramic capacitor of the present invention has greater mechanical strength in the same shape than the conventional multilayer ceramic capacitor, so when it is made smaller and thinner, the mechanical strength is higher than that of the conventional multilayer ceramic capacitor. does not decrease,
The manufacturing process will be easy, and the yield will be improved.
This greatly contributes to cost reduction. In addition, we are looking forward to the advantage of being able to make areas smaller and thinner, which was previously impossible.
なお、本発明で述べた高融点の微粒子の組成、大きさ等
は、使用するセラミック誘′亀体粉末の組成、あるいは
目的とする@度の向上などにより適宜決めるべきもので
あるのけもちろんでのる。It goes without saying that the composition, size, etc. of the high-melting-point fine particles mentioned in the present invention should be determined as appropriate depending on the composition of the ceramic dielectric powder used or the desired improvement in the degree of oxidation. Noru.
第1図は内部電極を被着形成したセラミック誘電体シー
トおよび保護層用のセラミック誘電体シートの平面図
。
第2図は従来の積層セラミックコンデンサの縦断面図。
第3図は、本発明一実施例の積層セラミックコンデンサ
の積層構造を示す斜視図。
第4図は本発明−実施例の積層セラミックコンデンサの
縦断面図。
第5図は、第4図の積層セラミックコンデンサ素体中に
みられる収縮および応力の模式図。
1 、 l’、 11’・・・・・・セラミック誘電体
シート、2・・・・・・内部電極、2a・・・・・・内
8電極の端面露出部、3.3′・・・・・・セラミック
コンデンサ素体、4・・・・・・外部電極、l、 、
l、・・・・・・収縮、F・・・・・・圧縮応力。
谷 7 図
z j 図
2 ? 図
め 4 図
亙
口◇F F仁コ
葛 5図Figure 1 is a plan view of a ceramic dielectric sheet with internal electrodes and a ceramic dielectric sheet for a protective layer. Figure 2 is a longitudinal cross-sectional view of a conventional multilayer ceramic capacitor. FIG. 3 is a perspective view showing a laminated structure of a laminated ceramic capacitor according to an embodiment of the present invention. FIG. 4 is a longitudinal sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention. FIG. 5 is a schematic diagram of shrinkage and stress observed in the multilayer ceramic capacitor body of FIG. 4. 1, l', 11'...Ceramic dielectric sheet, 2...Internal electrode, 2a...End face exposed portion of inner 8 electrodes, 3.3'... ...Ceramic capacitor element, 4...External electrode, l, ,
l,...shrinkage, F...compressive stress. Valley 7 Figure z j Figure 2 ? Figure 4 Figure 4 ◇F F Jinko Kuzu Figure 5
Claims (1)
に積層し、さらに、その上下面に保護層となる誘電体シ
ートを積層して一体化した積層セーyミックコンデンサ
において、前記保護層となる誘電体シート中に高融点の
微粒子を分散させたことを特徴とする積層セラミックコ
ンデンサ。In a multilayer seminic capacitor in which a plurality of dielectric sheets on which conductive internal electrodes are formed are alternately laminated, and dielectric sheets serving as protective layers are laminated and integrated on the upper and lower surfaces thereof, the protective layer and A multilayer ceramic capacitor characterized by having fine particles with a high melting point dispersed in a dielectric sheet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58068615A JPS59194416A (en) | 1983-04-19 | 1983-04-19 | Laminated ceramic condenser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58068615A JPS59194416A (en) | 1983-04-19 | 1983-04-19 | Laminated ceramic condenser |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59194416A true JPS59194416A (en) | 1984-11-05 |
Family
ID=13378837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58068615A Pending JPS59194416A (en) | 1983-04-19 | 1983-04-19 | Laminated ceramic condenser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59194416A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6371524U (en) * | 1986-10-28 | 1988-05-13 | ||
JP2003105900A (en) * | 2001-09-28 | 2003-04-09 | Kokuyo Co Ltd | Panel connecting structure and mobile partition |
JP2020167368A (en) * | 2018-10-30 | 2020-10-08 | Tdk株式会社 | Multilayer ceramic electronic component |
JP2020167367A (en) * | 2018-10-30 | 2020-10-08 | Tdk株式会社 | Multilayer ceramic electronic component |
-
1983
- 1983-04-19 JP JP58068615A patent/JPS59194416A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6371524U (en) * | 1986-10-28 | 1988-05-13 | ||
JPH0543462Y2 (en) * | 1986-10-28 | 1993-11-02 | ||
JP2003105900A (en) * | 2001-09-28 | 2003-04-09 | Kokuyo Co Ltd | Panel connecting structure and mobile partition |
JP2020167368A (en) * | 2018-10-30 | 2020-10-08 | Tdk株式会社 | Multilayer ceramic electronic component |
JP2020167367A (en) * | 2018-10-30 | 2020-10-08 | Tdk株式会社 | Multilayer ceramic electronic component |
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