JPS59193859U - Etching device - Google Patents

Etching device

Info

Publication number
JPS59193859U
JPS59193859U JP8666983U JP8666983U JPS59193859U JP S59193859 U JPS59193859 U JP S59193859U JP 8666983 U JP8666983 U JP 8666983U JP 8666983 U JP8666983 U JP 8666983U JP S59193859 U JPS59193859 U JP S59193859U
Authority
JP
Japan
Prior art keywords
etching
etched
spray nozzle
etching device
etches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8666983U
Other languages
Japanese (ja)
Inventor
山田　鎭浩
Original Assignee
株式会社　山田メツキ工業所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社　山田メツキ工業所 filed Critical 株式会社　山田メツキ工業所
Priority to JP8666983U priority Critical patent/JPS59193859U/en
Publication of JPS59193859U publication Critical patent/JPS59193859U/en
Pending legal-status Critical Current

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  • ing And Chemical Polishing (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の一実施例を示し、第１図は全体の概略構
成を示す縦断面図、第２図は噴射ノズルの縦断面図、第
３図は同底面図である。 図中、２は銅張積層板（被エツチング材）、１３は噴射
ノズル、１４は噴射口、１９は直流電源装置である。The drawings show an embodiment of the present invention, with FIG. 1 being a vertical sectional view showing the overall schematic configuration, FIG. 2 being a vertical sectional view of an injection nozzle, and FIG. 3 being a bottom view thereof. In the figure, 2 is a copper-clad laminate (material to be etched), 13 is an injection nozzle, 14 is an injection port, and 19 is a DC power supply device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 被エツチング材とこれをエツチングするエツチング液の
噴射ノズルとを相対的に移動させて該エツチング材の表
面をエツチングするものにおいて、前記噴射ノズルの噴
射口を前記被エツチング材の前記相対移動方向に対し略
直交するスリット状に定めると共に、前記被エツチング
材側が前記エツチング液に対して正となるよう電圧を印
加することを特徴とするエツチング装置。In a method for etching the surface of the etching material by relatively moving a material to be etched and a spray nozzle for etching liquid that etches the material, the jetting port of the spray nozzle is set relative to the direction of relative movement of the material to be etched. An etching apparatus characterized in that the slits are defined to be substantially orthogonal, and a voltage is applied so that the side of the material to be etched is positive with respect to the etching solution.
JP8666983U 1983-06-06 1983-06-06 Etching device Pending JPS59193859U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8666983U JPS59193859U (en) 1983-06-06 1983-06-06 Etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8666983U JPS59193859U (en) 1983-06-06 1983-06-06 Etching device

Publications (1)

Publication Number Publication Date
JPS59193859U true JPS59193859U (en) 1984-12-22

Family

ID=30216600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8666983U Pending JPS59193859U (en) 1983-06-06 1983-06-06 Etching device

Country Status (1)

Country Link
JP (1) JPS59193859U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004033384A1 (en) * 2002-10-11 2004-04-22 Hitachi Zosen Corporation Method and system for removing thin metal film
US7544283B2 (en) 2002-10-11 2009-06-09 Hitachi Zosen Corporation Method and apparatus for removing thin metal films

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004033384A1 (en) * 2002-10-11 2004-04-22 Hitachi Zosen Corporation Method and system for removing thin metal film
US7544283B2 (en) 2002-10-11 2009-06-09 Hitachi Zosen Corporation Method and apparatus for removing thin metal films

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