JPS59188901A - Resistance ink composition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resistive ink composition for producing a resin-based 2μ antibody used in various electronic circuits.

Conventional Structures and Problems Resin-based resistors have been widely used as fixed resistors or variable resistors. These conventional resistors have used thermosetting resin as the binder resin, so manufacturing the resistor requires high temperatures and a long time, and furthermore, when laminated on a paper-phenol resin substrate, etc., the substrate deteriorates. There are several problems, and improvements are desired.

OBJECTS OF THE INVENTION Therefore, it is an object of the present invention to provide a resistive ink composition for solving the above-mentioned problems associated with the production of conventional resin-based resistors. This object can be easily achieved by manufacturing a resistor by irradiating the resistive ink set x*'i with an electron beam, which will be described in detail below.

Structure of the Invention The resistive ink composition according to the present invention comprises an ammoniacal resol modified bisphenol A-formalin condensate as a binder resin, at least one acrylic group inside,
It is characterized by using a mixture of acrylic, methacrylic or allyl monomers or oligomers containing methacrylic or allyl groups.

Then, the mixture is mixed with metal powder, carbon black,
The ink produced by dividing a conventionally known conductive powder such as Daraphite and adding a solvent if necessary is applied onto a substrate, dried if necessary, and then irradiated with an electron beam. You can see e) K, excellent characteristics in a very short time'n
- It is possible to obtain a resistor.

The bisphenol A-formalin condensate described here is produced by reacting 1 mole of bisphenol A with 4 moles of formalin in the presence of an alkali catalyst, and is produced by reacting with a commercially available ammonia resol in an alcohol solution. You can make modified products.

As the monomer or oligomer to be mixed with the above-mentioned metamorphoses and products, those containing at least one acrylic group, methacrylic group, or allyl group can be used. Although these monomers or oligomers can be used alone, in many cases, it is easier to control the resistor characteristics by using a mixed system.

Examples of monomers or oligomers that can be used here: 10&:I1, methyl acrylate, ethyl acrylate, globyl acrylate, butyl acrylate, hydroquinethyl acrylate, 2-ethylhexyl acrylate, ethylene glycol diacrylate, Acrylic esters or oligoacrylates of primary or polyhydric alcohols such as methylolpropane triacrylate, pentaerythritol triacrylate, various Evoquin acrylates, various oligoester acrylates, various urethane acrylates, methyl methacrylate, ethyl methacrylate,
Methacrylic esters of primary or polyhydric alcohols such as propyl methacrylate, butyl methacrylate, hydroxyethyl meccrylate, 2-ethylhexyl methacrylate, diethylene glycol dimethacrylate, trimethylolpropane tritacrylate, allyl alcohol, diallyl ether, diallyl adipate, Diallyl slate, both terminal allylates of low molecular weight polyurethanes, etc. can be produced.

The mixing ratio of the modified bisphenol A-formalin condensate and the above monomer or oligomer can be arbitrarily selected depending on the required characteristics of the resistor.

As the conductive powder to be dispersed in these resin compositions,
Conventionally known materials can be used.

Examples include metal powder such as silver, copper, or an alloy thereof, metal oxide powder, metal carbide powder, metal nitride powder, metal boride powder, carbon flick, graphite, or a mixture thereof. The mixing ratio of the conductive powder and the above-described resin composition may be within a conventionally known range.

The binder resin composition and the conductive powder are mixed and kneaded by a known method, adding a solvent if necessary, and then applied onto a substrate.
After drying if necessary, the resistor is manufactured by irradiating it with an electron beam.

In particular, the obtained resistor is extremely hard, making it particularly desirable as a resistor for a variable resistor, which requires high wear resistance.

The present invention will now be described by way of examples.

<Example 1> -) To bisphenol - Formalin condensate modified product Temperature 1, stirrer, reflux condenser, suitable low F k In a four-low flask, 1 mol of bisphenol A and 4.5 mol of 38 formalin were added. Add 2.2 mol of 6N aqueous sodium hydroxide solution dropwise from the dropping funnel, making sure not to exceed 60'C.After dropping, react at 60±1℃ for 2 hours, then neutralize with 6N sulfuric acid aqueous solution. After washing with water and concentrating under reduced pressure, 85% is mainly composed of tetramethylolated bisphenol A.
Melting 'M' produces gold. To 9 parts by weight of this solution, 1 part by weight of ammonia resol and 2 parts by weight of n-propyl alcohol were added and completely dissolved, reacted for 30 minutes under reflux, concentrated under reduced pressure, and dissolved in ethanol to 60%
Make a solution.

b) Resistance ink above solution 50. i9, 5 g of diethylene glycol dimethacrylate (DEGM), 15 g of fine carbon powder, and 30 g of butylcarpitol were mixed and kneaded in a three-roll mill to produce a resistance ink. C) Resistor The above resistor ink was applied onto a paper-phenol substrate, dried, and then irradiated with an electron beam of 50 Mrad at an acceleration of 165 KV and a pressure of 7 L to produce a resistor.

Electron beam irradiation time 't'j: 0.2 seconds per 15 on.

Q: The resistor obtained here had a total area resistance value of about 0.7/, and was hard with a pencil hardness of 9H or more. The heat resistance and moisture resistance test results of this resistor and thermosetting resistance ink for comparison are shown in Table 1 below, along with other examples.

Below, conditions of other examples will be shown in which only the composition of the resistance ink in Example 1 is changed.

<Example 2> Modified product solution -50! j DEGM 25g Trimethylolpropane trimethacrylate-1-(TMP
M) 10g Carbon powder 30.9 <Example 3> Modified product solution 50g Evoquinoacrylate (manufactured by Osaka Organic ■, trade name Viscoat≠540) 0 g Carbon powder 309 Butylcalpitol 505+ <Example 4> Modified product solution 60g Urethane Acrylate [Product name manufactured by Nippon U-Pica ■ A C-
5802] 30g “rMPM Ag carbon powder 30g cyclohexanol 60g <Example 5> Modified product solution 609 Diallyl orthophthalate prepolymer [manufactured by Osaka Kendatsu ■,
Product name Dyne-Danop] 0 g TMPM 49 Carbon powder 30jj Isophorone 609 <Example 6> Modified product solution 36. j7 Oligoester acrylate [manufactured by Toagosei ■, trade name Aroninox M-8030] 49,! 7 Carbon powder 30.9 Isophorone 20 &<Example> Modified product solution 1.6 g Hexanediol diacrylate 3, OI Silver powder 40. og cyclohexanol 20.09 <Example 8> Modified product solution 11.6 g Hexanediol diacrylate 0 g Tin dioxide fine powder 40. oy 7 Clohexanol 40.09 Below Margin Table 1〉 (1) 85°C 1000 hours (2+40°C 95% RH 1000 hours Effects of the invention As can be seen from the Examples and Comparative Examples, the resistance ink according to the present invention By curing the m-oxide with electron beams to manufacture the entire resistor, it is possible to manufacture the resistor in an extremely short time, whereas conventionally it took several minutes or hours at high temperature, and the resistor characteristics are also the same as before. You can obtain a resistor with excellent quality, etc.
Industrial effectiveness is a dog.

Claims (1)

[Claims] An acrylic, methacrylic or allyl monomer or oligomer or a mixture thereof containing at least one acrylic, methacrylic or allyl group inside, and A resistive ink composition comprising conductive fine powder.