JPS59172205A - Method of producing resistor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a resistor for electronic components, and more particularly to a method for manufacturing a resin-based resistor made by dispersing conductive powder in an organic resin. It is.

Conventional configurations and their problems Hitherto, resistors for electronic components have been used either as a single resistor or in the form of a printed resistor, either as a fixed resistor or as a variable resistor.

These conventional resistors have mainly been manufactured by dispersing metal, carbon blank, or graphite powder in a thermosetting resin, along with an inorganic filler if necessary, and curing the resin by heating.

However, manufacturing these resistors requires high temperatures and a long time, and when the resistor is laminated on a phenolic resin substrate (a second-class organic substrate), the substrate deteriorates due to heating and the resistor characteristics deteriorate. It had the disadvantage of leading to deterioration.

Purpose of the Invention The present invention solves these conventional drawbacks, and aims to provide a method for manufacturing highly reliable resistors without requiring high temperatures and long periods of time as in the conventional method. It is.

Structure of the Invention In order to achieve this object, the present invention provides a resistor by irradiating a composition comprising conductive powder dispersed in an electron beam curable monomer or oligomer or a mixture thereof with an electron beam. It manufactures.

The above composition can be used alone as a resistor, but it can also be dissolved in a solvent and applied as a resistance ink, dried and then irradiated with electron beams. By adopting the resistor composition with the above composition, the curing time, which used to take at least several minutes to several hours for conventional thermosetting type resistors, can be completed with irradiation in less than 1 second, as described in the examples. This allows significant energy and space savings to be achieved, as well as improved resistor characteristics.

The electron beam curable monomer used in the present invention includes:
At least one acrylic group in the structure.

Compounds containing a methacrylic group or an allyl group may be mentioned. Specifically, various methacrylic acid esters such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, and hydroxyethyl methacrylate, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, and acrylic acid. Various acrylic esters such as hydroxychel, acrylic or methacrylic esters of polyhydric alcohols such as ethylene 5/ε-1 glycol, diethylene glycol, hexanediol, trimethylolpropane, pentaerythritol, allyl alcohol, diallyl adipate, diallyl phthalate, etc. Allyl compounds can be mentioned.

Examples of oligomers that can be cured with electron beams include so-called epoxy acrylate, which is produced by reacting epoxy groups in an epoxy resin with acrylic acid or methacrylic acid; Oligoester acrylate, oligoester methacrylate or oligoester arylate, urethane acrylate, urethane asolate, low polymerization degree diallyl phthalate resin, phenol-formaldehyde low condensate, low polymerization degree diallyl phthalate resin, having an acrylic group, methacrylic group or allyl group, Phenol-formaldehyde low condensate.

Examples include bisphenol-formaldehyde low condensates and derivatives thereof, low 1 polymers having a precipitated triazine structure, and derivatives thereof.

These monomers and oligomers can be used alone or in various combinations depending on the purpose.

As the conductive powder, conventionally known ones can be used. For example, silver powder, copper powder, other metal powders, metal silicides such as molybdenum silicide, gold oxides such as tin dioxide, metal carbides such as titanium carbide, metal nitrides such as titanium nitride, and various carbon blacks. There are powders such as graphite.

These conductive powders can be used individually, mixed in various ways, mixed with the monomers or oligomers mentioned above, kneaded, molded, added with a solvent and laminated on a substrate as an ink, and then irradiated with an electron beam to form a resistor. shall be.

Description of examples This will be explained below using specific examples.

(Example 1) Epoxy acrylate (reacted with 2 moles of acrylic acid and 1 mole of EVO 7 base resin obtained from 1 mole of bisphenol A and 2 moles of epichlorohydrin)
7og, carbon fine powder 30g and ethyl cellosolve so
, 9 were mixed and then kneaded in a three-roll mill to prepare a resistance ink. After applying this resistive ink to a paper-phenolic resin substrate (hereinafter referred to as baking board)-1- and drying it,
65 was irradiated with an electron beam of 10 Mrad at an acceleration voltage of 1 to produce a resistor. The time required to irradiate a length of 15 cm was 0.05 seconds.

The resistor obtained here has a sheet resistance value of about 1 Ω/hole, and a coefficient of 2.5 and -4 in a groove resistance test of 95% at 40°C and a heat resistance test of 1000 hours at 85°C, respectively.
, it showed only a 5% change.

For comparison, the thermosetting resistor (
When the same test was conducted for the phenolic resins (using phenolic resins), they showed changes of 5.5% and -4 and -5 factors, respectively.

(Example 2) 56 g of oligomer obtained by reacting 1 mole of bisphenol A with 2 moles of acrylic acid, 14 g of methyl methacrylate,
A resistance ink was prepared by thoroughly mixing and dispersing 30 g of carbon fine powder and methyl ethyl ketone 709 in a pot mill.

This resistance ink was applied on a plate, and after drying it was 5 Mrad.
A resistor was manufactured by irradiating it with an electron beam.

The resistor obtained here exhibited a resistance value of about 1.5 Ω/mouth, and showed changes of 1.6 and -9.7 in the moisture resistance and heat resistance tests, respectively.

(Example 3) 56 g of diallyl phthalate prepolymer, diallyl phthalate monomer 1a9, 30 g of carbon powder, and 50 g of isophorone were mixed and then kneaded in a three-roll mill to produce a resistance ink. This resistive ink was applied onto a baking plate, dried, and then irradiated with an electron beam of 50 Mrad to produce a resistor.

The resistor obtained here exhibited a resistance value of approximately 1 Ω/hole, and exhibited changes of -8.5% and 4.6% in heat resistance and moisture resistance tests, respectively.

(Example 4) In Example 3, pentaerythritol trimethacrylate 4 was used instead of diallylphthalate monomer 9
g and diethylene glycol dimethacrylate 10 g
When using 30 Mrad electron beam irradiation, a resistor having performance equivalent to that of Example 3 was obtained.

(Example 6) 100 g of bisphenol-formalin condensate derivative solution (described in Japanese Patent Publication No. 44-6308).

After mixing 10 g of bisphenol A diacrylate and 30 g of fine carbon powder, the mixture was kneaded in a three-roll mill to produce a resistance ink. The resistor made by applying this resistive ink on a baking plate, drying, and irradiating it with an electron beam of 50 Mrad has a resistance value of 5 o○ Ω/hole, shows a pencil hardness of 9H or more, and is extremely hard. It was a resistor. This resistor is moisture resistant.
The heat resistance test showed changes of 3.5% and -3.5%, respectively.

(Example 6) Resol type phenol-formalin condensate methanol 70
70g of related solution, 14g of hexanediol diacrylate
,) 50 g of ethyl cellosolve F was mixed with 7 g of limethylol propane meth 1° acrylate and 3 og of fine carbon powder, and kneaded in a three-roll mill to produce a resistance ink. A resistor made by applying this resistive ink on a baking plate, drying, and irradiating it with an electron beam of 50 Mrad had a resistance value of about 1 Ω/hole and a pencil hardness of 9H or more. This resistor has a resistance rating of 7.5 in the heat resistance test and a 5.5 in the heat resistance test.
It showed a change of 0% and -9.5%.

(Example 7) Triazine resin epoxy modified product (Mitsubishi Gas Chemical ■Product name BT-2160) 28g, oligoester acrylate (Toagosei Chemical ■Product name Aronix) 36g, N, N-
A resistance ink made by mixing 7 g of dimethylaminoethyl methacrylate, 30 g of fine carbon powder, and 50 g of cyclohexanone and kneading it in a three-roll mill was applied on a baking plate, dried, and then irradiated with an electron beam of 30 M r a d. The resistor had a resistance value of approximately 1 Ω/hole and was hard with a pencil hardness of 9H or more. This resistor has a moisture resistance test and a heat resistance test of 3.5%.

(Example 8) In Example 1, instead of carbon fine powder, an average diameter of 5μ was used.
graphite powder, and the electron beam irradiation amount was 20Mr.
In the case of ad, a resistor with a sheet resistance value of 3 and Ω/hole was obtained. This resistor has a moisture resistance test and a heat resistance test of 15% each.
, -3.0% change (Example 9) 20 g of epoxy acrylate, 80 g of silver powder, and 100 g of diethylene glycol dibutyl ether were mixed and kneaded in a three-roll mill to produce a resistance ink. This resistive ink was applied on a baking plate, dried, and then cured by electron irradiation at 50 Mrad to exhibit a resistance value of 0.1 Ω/hole, and could be used as a conductive ink.

(Example 1o) When tin dioxide powder with a diameter of 0.2 μm was used in place of silver powder in Example 8, the resistance value of Ω/mouth was shown in 5.

(Example 11) In Example 8, when titanium nitride powder with a diameter of 1 μm was used instead of silver powder, a resistance value of 60 Ω/mouth was shown. When titanium carbide was used, the resistance value was 15Ω/mouth.

(Example 13) In Example 8, when titanium boride having a diameter of III was used instead of silver powder, the resistance value was 25Ω/n7).

(Example 14) Urethane acrylate obtained by acrylating both ends of low polymerization degree polyurethane (Desoto Co., Ltd. trade name: Desolite: 5)
0% MEK solution) 140g, fine carbon powder 30. ! 9
and 60 g of cyclohexanone were mixed and kneaded in a three-roll mill to produce a resistance ink.

This resistive ink was applied onto a polyethylene terephthalate film with a thickness of 100μ, dried, and 30M r a d1.
A resistor was manufactured by irradiating it with an electron beam of 3 pages S. This resistor has excellent flexibility, has a resistance value of 20 Ω/mouth, and has a resistance of -10 and 0 in humidity and heat resistance tests, respectively.

It showed a change of 3.3%.

Effects of the Invention As is clear from the above explanation, according to the present invention, instead of a resin-based resistor, which has conventionally been only a thermosetting type,
By using a system in which conductive powder is dispersed in an electron beam-curable monomer, oligomer, or a mixture thereof and irradiating it with electron beams, it is possible to manufacture a resistor that is energy-saving, space-saving, and has excellent resistor characteristics. A manufacturing method can be obtained, which has great industrial effects.

Claims (6)

[Claims] (1) Manufacture of a resistor, characterized in that it is produced by irradiating a conductive composition made by dispersing conductive powder in an electron beam curable monomer, oligomer, or mixture thereof with an electron beam. Method. (2) According to claim 1, the conductive powder is a metal, metal silicide, metal oxide, metal carbide, metal nitride, carbon black, graphite alone or a mixture thereof. Method for manufacturing the resistor described. (3) At least one electron beam curable monomer is present in the structure.
The method for producing a resistor according to claim 1, wherein the resistor is a compound containing an acrylic group, a methacrylic group, or an allyl group, or a mixture thereof. (4) At least one oligomer that can be cured by electron beam is present in the structure.
2. The method for producing a resistor according to claim 1, wherein the resistor is a low polymer of a compound containing an acrylic group, a methacrylic group, or an aryol group, or a mixture thereof. (5) The resistor according to claim 1, wherein the electron beam curable oligomer is a phenol-formaldehyde low condensate, a bisphenol A-formalin low condensate, or a derivative thereof. Production method. (6) The method for manufacturing a resistor according to claim 1, wherein the electron beam curable oligomer is a low polymer having a triazine ring in its structure or a derivative thereof.