JPS59187142U - Spool winding wire for bonding semiconductor devices - Google Patents

Spool winding wire for bonding semiconductor devices

Info

Publication number
JPS59187142U
JPS59187142U JP1983082141U JP8214183U JPS59187142U JP S59187142 U JPS59187142 U JP S59187142U JP 1983082141 U JP1983082141 U JP 1983082141U JP 8214183 U JP8214183 U JP 8214183U JP S59187142 U JPS59187142 U JP S59187142U
Authority
JP
Japan
Prior art keywords
semiconductor devices
winding
winding wire
bonding semiconductor
spool winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983082141U
Other languages
Japanese (ja)
Inventor
小泉　保
安助　忠雄
Original Assignee
田中電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 田中電子工業株式会社 filed Critical 田中電子工業株式会社
Priority to JP1983082141U priority Critical patent/JPS59187142U/en
Publication of JPS59187142U publication Critical patent/JPS59187142U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案スプール巻線の第１層巻込み状態を示し
た側面図、第２図は巻取完了状態の側面図、第３図はそ
の断面図、第４図は一部切欠せる斜視図である。 図中、Ａはスプール、Ｂは金線、ｂｌは整列巻部分、ｂ
２はクロス巻部分である。Figure 1 is a side view showing the first layer of the spool winding of the present invention, Figure 2 is a side view of the spool winding completed, Figure 3 is a cross-sectional view, and Figure 4 is partially cut away. FIG. In the figure, A is the spool, B is the gold wire, bl is the aligned winding part, b
2 is a cross-wound portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ホンディング用線を往側巻線と復側巻線とを交叉させて
スプールに巻込むクロス巻線形態において、巻線の第１
層ないし数層に整列巻部分を形成せしめた半導体素子の
ボンディング用線のスプール巻線。In the cross winding configuration in which the honding wire is wound onto the spool by crossing the outgoing winding and the incoming winding, the first
A spool winding wire for bonding wire for semiconductor devices in which aligned winding portions are formed in one layer or several layers.
JP1983082141U 1983-05-31 1983-05-31 Spool winding wire for bonding semiconductor devices Pending JPS59187142U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983082141U JPS59187142U (en) 1983-05-31 1983-05-31 Spool winding wire for bonding semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983082141U JPS59187142U (en) 1983-05-31 1983-05-31 Spool winding wire for bonding semiconductor devices

Publications (1)

Publication Number Publication Date
JPS59187142U true JPS59187142U (en) 1984-12-12

Family

ID=30212093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983082141U Pending JPS59187142U (en) 1983-05-31 1983-05-31 Spool winding wire for bonding semiconductor devices

Country Status (1)

Country Link
JP (1) JPS59187142U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952629B2 (en) * 1975-03-17 1984-12-20 クラフトヴェルク、ユニオン、アクチエンゲゼルシヤフト rotating rectifier

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952629B2 (en) * 1975-03-17 1984-12-20 クラフトヴェルク、ユニオン、アクチエンゲゼルシヤフト rotating rectifier

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