JPS63174442U - - Google Patents

Info

Publication number
JPS63174442U
JPS63174442U JP1987027017U JP2701787U JPS63174442U JP S63174442 U JPS63174442 U JP S63174442U JP 1987027017 U JP1987027017 U JP 1987027017U JP 2701787 U JP2701787 U JP 2701787U JP S63174442 U JPS63174442 U JP S63174442U
Authority
JP
Japan
Prior art keywords
wire
spool
surface roughness
winding drum
wound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987027017U
Other languages
Japanese (ja)
Other versions
JPH0541549Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987027017U priority Critical patent/JPH0541549Y2/ja
Publication of JPS63174442U publication Critical patent/JPS63174442U/ja
Application granted granted Critical
Publication of JPH0541549Y2 publication Critical patent/JPH0541549Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第６図は本考案の一実施例を示す
図であつて、第１図はスプールを示す斜視図、第
２図はスプールにワイヤーを巻き付けた状態を示
す側面図、第３図ないし第５図はそれぞれ巻胴の
表面粗さとワイヤーがくずれる頻度との関係を示
す線図、第６図は巻胴の表面粗さとワイヤーが損
傷を受ける頻度との関係を示す線図である。 ３……巻胴、４……ワイヤー。 1 to 6 are views showing one embodiment of the present invention, in which FIG. 1 is a perspective view showing a spool, FIG. 2 is a side view showing a state in which the wire is wound around the spool, and FIG. 3 is a diagram showing an embodiment of the present invention. 5 to 5 are diagrams showing the relationship between the surface roughness of the winding drum and the frequency at which the wire breaks, and FIG. 6 is a diagram showing the relationship between the surface roughness of the winding drum and the frequency at which the wire is damaged. 3... Winding trunk, 4... Wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤーが巻き付けられる巻胴の表面粗さを０
．５〜２ａに設定してなることを特徴とする半導
体装置のボンデイングワイヤー用スプール。 The surface roughness of the winding drum around which the wire is wound is set to 0.
．． A spool for bonding wire for a semiconductor device, characterized in that the wire is set to 5 to 2a.
JP1987027017U 1987-02-25 1987-02-25 Expired - Lifetime JPH0541549Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987027017U JPH0541549Y2 (en) 1987-02-25 1987-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987027017U JPH0541549Y2 (en) 1987-02-25 1987-02-25

Publications (2)

Publication Number Publication Date
JPS63174442U true JPS63174442U (en) 1988-11-11
JPH0541549Y2 JPH0541549Y2 (en) 1993-10-20

Family

ID=30828654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987027017U Expired - Lifetime JPH0541549Y2 (en) 1987-02-25 1987-02-25

Country Status (1)

Country Link
JP (1) JPH0541549Y2 (en)

Also Published As

Publication number Publication date
JPH0541549Y2 (en) 1993-10-20

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