JPS5918695A - Lsi実装用基板とプリント板の組合せ装置 - Google Patents

Lsi実装用基板とプリント板の組合せ装置

Info

Publication number
JPS5918695A
JPS5918695A JP12675882A JP12675882A JPS5918695A JP S5918695 A JPS5918695 A JP S5918695A JP 12675882 A JP12675882 A JP 12675882A JP 12675882 A JP12675882 A JP 12675882A JP S5918695 A JPS5918695 A JP S5918695A
Authority
JP
Japan
Prior art keywords
circuit board
board
lsi
pad
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12675882A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0430200B2 (enrdf_load_stackoverflow
Inventor
薫 橋本
武彦 佐藤
祐司 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12675882A priority Critical patent/JPS5918695A/ja
Publication of JPS5918695A publication Critical patent/JPS5918695A/ja
Publication of JPH0430200B2 publication Critical patent/JPH0430200B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP12675882A 1982-07-22 1982-07-22 Lsi実装用基板とプリント板の組合せ装置 Granted JPS5918695A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12675882A JPS5918695A (ja) 1982-07-22 1982-07-22 Lsi実装用基板とプリント板の組合せ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12675882A JPS5918695A (ja) 1982-07-22 1982-07-22 Lsi実装用基板とプリント板の組合せ装置

Publications (2)

Publication Number Publication Date
JPS5918695A true JPS5918695A (ja) 1984-01-31
JPH0430200B2 JPH0430200B2 (enrdf_load_stackoverflow) 1992-05-21

Family

ID=14943187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12675882A Granted JPS5918695A (ja) 1982-07-22 1982-07-22 Lsi実装用基板とプリント板の組合せ装置

Country Status (1)

Country Link
JP (1) JPS5918695A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63191639U (enrdf_load_stackoverflow) * 1987-05-28 1988-12-09
JPH04234198A (ja) * 1990-10-30 1992-08-21 Internatl Business Mach Corp <Ibm> 多層回路装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542520A (en) * 1978-09-18 1980-03-25 Okamura Shokuhin Kogyo:Kk Overall tasty nourishing food

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542520A (en) * 1978-09-18 1980-03-25 Okamura Shokuhin Kogyo:Kk Overall tasty nourishing food

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63191639U (enrdf_load_stackoverflow) * 1987-05-28 1988-12-09
JPH04234198A (ja) * 1990-10-30 1992-08-21 Internatl Business Mach Corp <Ibm> 多層回路装置の製造方法

Also Published As

Publication number Publication date
JPH0430200B2 (enrdf_load_stackoverflow) 1992-05-21

Similar Documents

Publication Publication Date Title
EP0159593B1 (en) Electrical connector and method for making the same
US4937707A (en) Flexible carrier for an electronic device
US5973393A (en) Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits
US4184729A (en) Flexible connector cable
US4706165A (en) Multilayer circuit board
US4268956A (en) Method of fabricating an interconnection cable
US7773388B2 (en) Printed wiring board with component mounting pin and electronic device using the same
US6723927B1 (en) High-reliability interposer for low cost and high reliability applications
US8093712B2 (en) Monolithic molded flexible electronic assemblies without solder and methods for their manufacture
JPS5918695A (ja) Lsi実装用基板とプリント板の組合せ装置
GB2565453A (en) Flexible printed board
JP2538542B2 (ja) 電気的接続装置
JPH04223073A (ja) 電気的接続装置
KR19990029223A (ko) 반도체 장치 시험용 기판 및 반도체 장치 시험방법
JPS60116193A (ja) コネクタ
US6221459B1 (en) Controlling the heat expansion of electrical couplings
KR100707528B1 (ko) 데이터 캐리어 및 데이터 캐리어가 설치된 장치
CN116075074B (zh) 电路板及其制造方法
JPS58169996A (ja) 電気的接続装置
JP2734625B2 (ja) 多層配線基板の製造方法
EP0335420A2 (en) Electrical and mechanical joint construction between a printed wiring board and a lead pin
JP2007281253A (ja) 回路基板、それを用いた多層回路基板、モジュールおよびコネクタ構造
JPS598281A (ja) 加熱着脱形マイクロコネクタ
JPH0158836B2 (enrdf_load_stackoverflow)
JPS58125898A (ja) プリント配線板の接続方式