JPS59181696A - Semiconductor device and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical field of the invention The present invention provides a method for mounting semiconductor elements and the like on a multilayer printed circuit board,
The present invention relates to a half-I-key body device suitable for high-density packaging and a method for manufacturing the same.

(2) Background of the technology In order to package semiconductor devices with high density and miniaturize electronic equipment, electronic components such as multiple semiconductor integrated circuit elements and capacitors are mounted on printed circuit boards with multilayer wiring. Modifications are underway.

(3) Prior art and problems As such a mumosur semiconductor device, there are 1
A structure as shown in jL US No. 1 is being considered. In the figure, 1 is a printed circuit board, 2 is a plastic chip gear carrier (hereinafter referred to as a chip carrier), 3 is a capacitor, and 4 is a lead pin.

In FIG. 1, a printed circuit board 1 is a multilayer printed circuit board with multiple wiring layers provided inside, and a nap carrier 2 and a capacitor 3 are mounted on its surface.
Electrode pads 5 are formed for connection by J-ri or the like. Further, the lead pin 4 is connected to the printed circuit board 1 by the lead pin 11.
An ε pattern 6 is formed and connected to it, for example, by half BJ (=J).

FIG. 2132 is a side view of the semiconductor device, in which the solder-covered state of the chip carrier 2 glue-f'' 2a is exaggeratedly shown (note that 2b indicates solder in the figure), and the lead pin 4 is used to sandwich the printed circuit board 1. As shown in Fig. 3, this connecting part is formed by bending the bifurcated part 4a punched out of the medium heat part 4b into a horizontal shape (hereinafter, this shaped lead pin 4 will be referred to as a clamp leat). FIG. 2 shows a state in which a chip carrier is attached to only one side of the printed circuit board 1.

Further, in a printed circuit board, only a through hole or a through hole can be formed, so a through hole cannot be formed in the portion indicated by the reference numeral 7. Therefore, it is not possible to form internal wiring in the area, and the space cannot be used effectively.

(4) Object of the Invention The present invention solves the above-mentioned conventional problems and aims to provide a semiconductor device and a method for manufacturing the same, in which lead pins can be joined without taking up extra space.

(5) Structure and object of the invention According to the present invention, there is provided a multilayer printed circuit board having a conductor bat for semi-dedicated elements on its surface and a wiring board inside, and The multilayer printed circuit board has a plurality of semiconductor elements mounted on the board and a plurality of lead pins attached to the side surface of the multilayer printed circuit board. A conductor bat electrically connected to the wiring layer is formed, and the lead pin is attached to the conductor pad.
A semiconductor device characterized in that
It has a conductor butt for mounting the body element, and has a wiring layer 1 inside.
a multilayer printed circuit board, a plurality of semiconductor elements mounted on the multilayer printed circuit board, and a plurality of lead pins attached to the side surface of the multilayer printed circuit board; 4. Manufacture of a '4-pier device, in which four parts are formed, a conductive pad electrically connected to the wiring j- is formed in the recessed part, and the lead pin is taken in and imprinted on the conductive pad. A method,
forming conductor butts for a plurality of sets of the semiconductor elements on a multilayer printed circuit board; forming a through hole at the position of the lead pin of the multilayer printed circuit board; A step of forming a conductor pattern for attaching the lead pin on the inner wall surface of the N through-hole, and a step of cutting and separating the multilayer printed circuit board into a plurality of pieces so as to divide each through-hole into two, and separation. This is achieved by providing a method for manufacturing a semiconductor device, which is characterized in that it includes a step of attaching a mounting pin and the semiconductor element to each multilayer printed circuit board.

(6) Examples of the invention Embodiments of the present invention will be explained in detail below with reference to the drawings.

FIG. 4 is a partially cutaway plan view of a semiconductor device for explaining an embodiment of the present invention, in which a printed circuit board 11 made of, for example, glass evoquin or paper phenol, is provided with multilayer wiring.
For example, a lead mounting portion having a circular MJ-shaped inner wall side 1 shown by reference numeral 15 in FIG. It should be noted that part 15 of the leat attachment is plated, and numbers 14 and 12 and 13 indicate a 1000-knob carrier and a capacitor, respectively.

FIG. 6(a) is a perspective view of a lead pin 17I (1) connected to the printed circuit board 11, and the lead pin 14 is connected to the pin 14a for mounting the semiconductor device on another large printed board, It consists of a joint part 14b that is soldered to the mounting part 15, and both parts are bent at right angles to each other, and the joint part Mb is connected to the reed part (the bent part 1
It is curved to match the wall shape of 5.

”2 The lead pin is connected to the printed circuit board 11 through a jig (not shown) for positioning.
1" method without soaking. In addition, 1 print base 1 throw
The element 4A is not limited to the above-mentioned glass evoquin or paper fuconol, but may be any other material as long as it can be plated.

FIG. 7 is a partial plan view of a printed circuit board showing another embodiment of the present invention, in which a recessed lead attachment portion 17 shown in FIG. 8 is formed on the side wall of the printed circuit board 11.

In this case, the lead pin 16 to be joined has the shape shown in FIG. 6(b), and the lead pin 16 is connected to the pin portion 16.
a and a joint portion 16b which is bent at a right angle. In the lead pin 16 having the above configuration, the width of the pin portion 16a and the width of the joint portion 16b do not necessarily have to be the same, as shown in FIG. 2(C).

However, it is preferable that the width of the joint portion 16b is formed to match the width of the REET attachment portion 17.

Since the embodiment of the present invention is a semiconductor device having the above-described configuration,
Pudding 1 without the extra space turning into a mess like in the past
- The substrate surface can be used for approximately 9Jl.

ff Figure 19 is a diagram for explaining the manufacturing method of the pudding l-substrate 11, and in the same figure, 21 is the pudding!・The material of the board, 22 indicates the printed circuit board. Referring to the same figure,
Form the print pattern of multiple (nine in the figure) printed circuit boards 22 on the printed circuit board 1, and then attach the lead to the material 21. A iii-shaped through hole 23a or a prismatic through ball 23b is formed.

The through balls 2:3a and o:23h are formed so that one half of the shape is located on one print g&22, and the other half is located on the adjacent print board.

Note that in the case of the adjacent end which is not treated as a printed board, it is formed in the same manner so that only half of the through ball (through ball 23a or 231) is located on the printed board 22.

Next, the through balls 23a and 23b are plated using a conventional technique. This plating is performed, for example, by performing electroless nitriding and then solder plating through a ball. After plating, wires 25, 2
The printed circuit board 22 is cut along the line 6 using a "C" cutter to form a printed circuit board 22 as shown in FIG.

FIG. 10 is a diagram for explaining the printed base 1 and 22 formed by the method described in ``2''. tv
ilr ilij diagram. Leat take-off part 24a
The walls of 24b and 24b are plated as described above. The cylindrical base 1 is cut 22 along the line 27, and the cut piece is used as shown in FIG.

The shape of the through ball of the printed circuit board 22 shown in FIG. The shape of the joint is also formed to match that. In addition, in the above-mentioned method, through balls are formed on both sides of the printed circuit board 22, but it is also possible to form through balls of the same shape on both sides. Needless to say, it's a good thing.

Another embodiment of the present invention is shown in the plan view of FIG. In the illustrated embodiment, a flat package 32 is mounted on the printer 1-substrate 3j. The recess 33 and Q ret pin 34 are formed in the same manner as in the embodiment of the present invention described above. Figure 12 (al is Xll in Figure 11)
- It is a sectional view along Hl alligator.

In the modified example of the embodiment shown in FIGS. 11 and 12 (al), one pudding 31
Mount it on both sides, not on one side. Figure 12 [
b) is a cross-sectional view similar to FIG.
This is effective against the Riot Density Tensou.

(7) According to the present invention, as explained in detail, extra space can be saved in a semiconductor device in which printed circuit boards, printers, printers, and other electronic components are mounted. A method for manufacturing a printed circuit board that can be eliminated and used for free space, and the pudding!・Since it is possible to provide semiconductor devices using the 1K substrate, there is a great deal of improvement in the productivity of printed JS boards and in the implementation of semiconductor devices.

[Brief explanation of drawings]

Figure 1 shows a semiconductor device K”11 using a conventional printed circuit board.
Oblique? Mln 1, t132 Figures ta+ and tb+ t-; Fig. 3 is a side view of the semiconductor device for protection; Fig. 3 is a perspective view of the joint part of Crumbly 1; Fig. 4 is a semiconductor device according to the present invention.
ii+”, flat curve diagram, Figure 5 is the lead bin taken 1
FIG. 6 is an enlarged perspective view of the recessed portion, FIG. 7 is a perspective view of the lead pin according to the present invention, FIG. , 8th
Figure 9 is an enlarged perspective view of the lead pin attachment part, Figure 9 is a diagram for explaining the method of manufacturing a printed circuit board according to the present invention, and Figure 10 is a diagram for explaining the printed circuit board. 1 is a plan view, the same figure (BL is a sectional view, FIG. -X
A sectional view taken along the line ll, FIG. 12 (bl is a sectional view similar to FIG. 2 (+4) showing a modification of the embodiment of FIG. 11. to groups 1 and 2.12-
Plus snack chip carrier, 2a-reet, 2b-solder, 3.13-capacitor, d,
14,16.34-Leat pin, 5-electrode panod,
6-Lead connection pattern, 15, i, 7.24a, 24b, 33---Lead connection i=t LJ-Nl! , 21-Printed circuit board material, 23
a, 23b - Through hole, 32 - Fuller, connect to topaso case OQ () q) (.) Fig. 10, A L, A Fig. 11 Fig. 12 Fig. 4 (b)

Claims (2)

[Claims] (1) The surface has conductor pads for mounting semiconductor elements, and J
", a multilayer printed circuit board with a wiring layer on the inner side, a plurality of semiconductor elements mounted on the multilayer pre-cut board, and a plurality of semiconductor elements mounted on the side surface of the multilayer printed circuit board. A plurality of four parts are formed on the side surface of the multilayer printed circuit board, and a conductor bat electrically connected to the wiring j- is formed in the recess,
A semiconductor device characterized in that the 'J-tobin is attached to the conductor bat. (2) Has a conductor butt for mounting semiconductor elements on the surface;
A multilayer printed circuit board 1 to a board having a wiring layer therein, and a plurality of semiconductor elements mounted on the multilayer cylinder board,
a plurality of glue pins attached to the side surface of the multilayer printed circuit board, a plurality of recesses are formed in the side surface of the multilayer printed circuit board, and electrically connected to the wiring 1=i in the four parts. A method for manufacturing a semiconductor device, in which conductor pads are formed, and lead pins are attached to the conductor bats. The mounting of the lead pins on the multilayer printed circuit board includes a step of forming a through hole at a position, a step of forming a conductive film for the lead pin receiving &J on the inner wall surface of the through hole, and a step of forming a conductive film for the lead pin in each of the through holes. It is characterized by comprising the steps of: cutting and separating the multilayer printed circuit board into several pieces so as to divide it into two; and attaching the IJ-top pin and the semiconductor element to each of the separated multilayer printed circuit boards 1 to 1. A method for manufacturing a semiconductor device.