JPS59181076A - 低温自動テスタ− - Google Patents
低温自動テスタ−Info
- Publication number
- JPS59181076A JPS59181076A JP58053490A JP5349083A JPS59181076A JP S59181076 A JPS59181076 A JP S59181076A JP 58053490 A JP58053490 A JP 58053490A JP 5349083 A JP5349083 A JP 5349083A JP S59181076 A JPS59181076 A JP S59181076A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chamber
- tray
- cooling
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005259 measurement Methods 0.000 claims abstract description 37
- 239000001307 helium Substances 0.000 claims abstract description 31
- 229910052734 helium Inorganic materials 0.000 claims abstract description 31
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 239000007789 gas Substances 0.000 claims abstract description 15
- 235000012431 wafers Nutrition 0.000 claims description 76
- 238000007781 pre-processing Methods 0.000 claims description 10
- 238000012805 post-processing Methods 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 14
- 239000000523 sample Substances 0.000 abstract description 12
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 9
- 238000007689 inspection Methods 0.000 description 6
- 241000257465 Echinoidea Species 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58053490A JPS59181076A (ja) | 1983-03-31 | 1983-03-31 | 低温自動テスタ− |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58053490A JPS59181076A (ja) | 1983-03-31 | 1983-03-31 | 低温自動テスタ− |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59181076A true JPS59181076A (ja) | 1984-10-15 |
| JPS6359273B2 JPS6359273B2 (cg-RX-API-DMAC7.html) | 1988-11-18 |
Family
ID=12944277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58053490A Granted JPS59181076A (ja) | 1983-03-31 | 1983-03-31 | 低温自動テスタ− |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59181076A (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6370433A (ja) * | 1986-09-11 | 1988-03-30 | Tokyo Electron Ltd | プロ−ブ装置 |
| US6213636B1 (en) * | 1998-08-21 | 2001-04-10 | Winbond Electronics Corp. | Furnace for testing integrated circuits |
-
1983
- 1983-03-31 JP JP58053490A patent/JPS59181076A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6370433A (ja) * | 1986-09-11 | 1988-03-30 | Tokyo Electron Ltd | プロ−ブ装置 |
| US6213636B1 (en) * | 1998-08-21 | 2001-04-10 | Winbond Electronics Corp. | Furnace for testing integrated circuits |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6359273B2 (cg-RX-API-DMAC7.html) | 1988-11-18 |
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