JPS59180853U - wire guide mechanism - Google Patents
wire guide mechanismInfo
- Publication number
- JPS59180853U JPS59180853U JP7656283U JP7656283U JPS59180853U JP S59180853 U JPS59180853 U JP S59180853U JP 7656283 U JP7656283 U JP 7656283U JP 7656283 U JP7656283 U JP 7656283U JP S59180853 U JPS59180853 U JP S59180853U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wire connection
- connection portion
- guide mechanism
- wire guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案に係るワイヤガイド機構の実施例を示すも
ので、第１図は本考案を適用したワイヤ ′接続装置の
要部を示す斜視図、第２図はワイヤガイド機構によるワ
イヤ位置決め要領を示す斜視図である。
図中、１はワイヤフィードツール、２は接合チップ、３
はワイヤガイド機構、４は半田付パッド ゛（ワ
イヤ接続部）、５はワイヤ、７は移動部材、８はワイヤ
保持部、９１ま溝である。The drawings show an embodiment of the wire guide mechanism according to the present invention. Fig. 1 is a perspective view showing the main parts of the wire connecting device to which the present invention is applied, and Fig. 2 shows the wire positioning procedure using the wire guide mechanism. FIG. In the figure, 1 is a wire feed tool, 2 is a joining tip, and 3
4 is a wire guide mechanism, 4 is a soldering pad (wire connection portion), 5 is a wire, 7 is a moving member, 8 is a wire holding portion, and 91 is a groove.
Claims (1)
該ワイヤ接続部上にワイヤフィードツールよりワイヤを
繰り出し、該ワイヤを、前記ワイヤ接続位置に対向して
進退可能に設けられた接合チップにより前記ワイヤ接続
部に抑圧、加熱して接続するワイヤ接続装置において、
前記ワイヤ接続位置のワイヤ接続部の中心線に沿って移
動可能な移動部材を設けて、該移動部材に、前記ワイヤ
フィードツールより繰り出されるワイヤを前記中心線上
に係脱可能に保持するワイヤ保持部を一体的に形成した
ことを特徴とするワイヤガイド機構。A wire connection portion on the substrate is positioned at a wire connection position, a wire is fed out onto the wire connection portion from a wire feed tool, and the wire is connected to the wire connection portion by a bonding tip provided so as to be movable back and forth in opposition to the wire connection position. In wire connection equipment that connects wires by pressing and heating them,
A wire holding section that includes a moving member that is movable along the center line of the wire connection portion at the wire connection position, and that the moving member detachably holds the wire fed out from the wire feed tool on the center line. A wire guide mechanism characterized by integrally forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7656283U JPS59180853U (en) | 1983-05-20 | 1983-05-20 | wire guide mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7656283U JPS59180853U (en) | 1983-05-20 | 1983-05-20 | wire guide mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59180853U true JPS59180853U (en) | 1984-12-03 |
Family
ID=30206607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7656283U Pending JPS59180853U (en) | 1983-05-20 | 1983-05-20 | wire guide mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59180853U (en) |
-
1983
- 1983-05-20 JP JP7656283U patent/JPS59180853U/en active Pending
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