JPS5998645U - wire bonding equipment - Google Patents

wire bonding equipment

Info

Publication number
JPS5998645U
JPS5998645U JP19467482U JP19467482U JPS5998645U JP S5998645 U JPS5998645 U JP S5998645U JP 19467482 U JP19467482 U JP 19467482U JP 19467482 U JP19467482 U JP 19467482U JP S5998645 U JPS5998645 U JP S5998645U
Authority
JP
Japan
Prior art keywords
wire bonding
bonding equipment
wire
clamp part
brake
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19467482U
Other languages
Japanese (ja)
Inventor
照亨 富沢
Original Assignee
三洋電機株式会社
東京三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 東京三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP19467482U priority Critical patent/JPS5998645U/en
Publication of JPS5998645U publication Critical patent/JPS5998645U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のワイヤーボンディング装置を説明する側
面図、第２図は本考案によるワイヤーポンディジグ装置
を説明する側面図である。 １１はワイヤー、１２はワイヤー供給源、１３はブレー
キ部、１４はガイド部、１５はクランプ部、１６はキャ
ピラリチップ、１７は揺動アームである。FIG. 1 is a side view illustrating a conventional wire bonding device, and FIG. 2 is a side view illustrating a wire bonding device according to the present invention. 11 is a wire, 12 is a wire supply source, 13 is a brake section, 14 is a guide section, 15 is a clamp section, 16 is a capillary tip, and 17 is a swing arm.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤー供給源から供給されたワイヤーをブレーキ部お
よびクランプ部を通してキャピラリチップまで延在させ
たワイヤーボンディング装置に於いて、前記ブレーキ部
とクランプ部とを同一体に取付は連動して上下させるこ
とを特徴とするワイヤーボンディング装置。A wire bonding device in which a wire supplied from a wire supply source is extended to a capillary chip through a brake part and a clamp part, characterized in that the brake part and the clamp part are attached to the same body and are moved up and down in conjunction with each other. wire bonding equipment.
JP19467482U 1982-12-21 1982-12-21 wire bonding equipment Pending JPS5998645U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19467482U JPS5998645U (en) 1982-12-21 1982-12-21 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19467482U JPS5998645U (en) 1982-12-21 1982-12-21 wire bonding equipment

Publications (1)

Publication Number Publication Date
JPS5998645U true JPS5998645U (en) 1984-07-04

Family

ID=30418367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19467482U Pending JPS5998645U (en) 1982-12-21 1982-12-21 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS5998645U (en)

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