JPS59178799A - Housing with excellent electromagnetic wave shielding property or method of producing same member - Google Patents

Housing with excellent electromagnetic wave shielding property or method of producing same member

Info

Publication number
JPS59178799A
JPS59178799A JP5317683A JP5317683A JPS59178799A JP S59178799 A JPS59178799 A JP S59178799A JP 5317683 A JP5317683 A JP 5317683A JP 5317683 A JP5317683 A JP 5317683A JP S59178799 A JPS59178799 A JP S59178799A
Authority
JP
Japan
Prior art keywords
metal
laminate
housing
superplastic
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5317683A
Other languages
Japanese (ja)
Other versions
JPH0634475B2 (en
Inventor
梅園 和弘
三島 良治
松添 信行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Kasei Corp
Original Assignee
Mitsubishi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Kasei Corp filed Critical Mitsubishi Kasei Corp
Priority to JP58053176A priority Critical patent/JPH0634475B2/en
Publication of JPS59178799A publication Critical patent/JPS59178799A/en
Publication of JPH0634475B2 publication Critical patent/JPH0634475B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は電磁波シールド性に優れた筐体また5吸 はその部材の製造〃に関するものである。[Detailed description of the invention] The present invention features a housing with excellent electromagnetic shielding properties and a relates to the manufacture of the component.

近年、プラスチックの進歩に伴い、電子機器の筐体が従
来の板金製からプラスチック類に転換されつつある。然
し、これに伴い、電子機器から発生する電磁波が周囲の
電子機器に影響を与え、誤動作やノイズの原因となるよ
うになった。これはプラスチックが本質的に電気絶縁性
が犬きく、電磁波シールド能に乏しい為である。
In recent years, with the advancement of plastics, the housings of electronic devices are being replaced from conventional sheet metals to plastics. However, along with this, electromagnetic waves generated from electronic devices have affected surrounding electronic devices, causing malfunctions and noise. This is because plastic inherently has poor electrical insulation and poor electromagnetic shielding ability.

このようなプラスチック製筐体の欠点を改良する方法と
して、真空蒸着や溶射等により筐体の表面に金属層を形
成したり、導電性材料で筐体を塗装したりすることが提
案されている。これらはいずれも筐体に二次加工により
電磁波シールド能を付与する方法であり、生産性等の面
で有利な方法とは云い離い。
As a method to improve these drawbacks of plastic casings, it has been proposed to form a metal layer on the surface of the casing by vacuum deposition or thermal spraying, or to paint the casing with conductive material. . These are all methods of imparting electromagnetic shielding ability to the housing through secondary processing, and are far from being advantageous in terms of productivity.

本発明はプラスチックと同様に成形できる金属−プラス
チック積層板を用いることにより、二次加工を施さなく
ても電磁波シールド能を有する筐体またはその部材を製
造する方法を提供するものである。
The present invention provides a method for manufacturing a casing or a member thereof that has electromagnetic shielding ability without performing secondary processing by using a metal-plastic laminate that can be molded in the same manner as plastic.

すなわち、本発明の要旨は、熱可塑性合成樹脂とこの樹
脂の成形温度で超塑性能を示す金属との積層板を、塑性
加工により筐体まだその部拐に成形することを特僧とす
る電磁波シールド性に優れた筐体またはその部材の製造
法に存する。
That is, the gist of the present invention is to form a laminate of a thermoplastic synthetic resin and a metal that exhibits superplastic performance at the molding temperature of this resin into a casing by plastic processing. The present invention resides in a method for manufacturing a housing or its members with excellent shielding properties.

本発明について詳細に説明すると、本発明方法では熱可
塑性合成樹脂と超塑性能を有する金属との積層板を素材
として用いる。熱可塑性合成樹脂としては、ポリエチレ
ン、ポリプロピレン、ポリ塩化ビニルアクリロニトリル
ースチレン共重合体、アクリロニトリル−スチレン−ブ
タジェン共重合体等の付加重合体や、ポリブチレンテレ
フタレート等のポリエステル、ナイロン−6、ナイロン
−乙、乙等のポリアミド、ポリアミドイミド、ポリカー
ボネート等の縮合重合体のいずれをも用いることができ
る。製品に難燃性が要求される場合には、難燃剤を配合
しゃすいポリエステルやナイロン等を用いるのが好まし
い。超塑性能を有する金属としては、これと一体となっ
て積層板を構成する合成樹脂の成形温度で超塑性能を示
すものが用いられる。例えば積層される合成樹脂が、ポ
リエチレンであれば/ 00’Q前後、ポリブチレンテ
レフタレートやナイロン−6等であれば200C前後で
超塑性能を示す金属が用いられる。また2種類の樹脂を
積層する場合には、これらの樹脂だけからなる積層板の
成形温度で超塑性能を示す金属が用いられる。このよう
な金属としては pb−/り%Sn、Sn、2%Pb、
 Sn−Jg%Pb等の5n−Pb系合金、Sn−/%
Bi、5n−4%B11B土−!!%Sn 等の5n−
Bi系合金、Zn−0,2%Al、 Zn−0,’1%
A1等のZn−Al系合金、pl)−/、l’%C!d
等のPb−Cd  系合金、Cd−/&%Zn%Cd−
、!7%Zn等のC!d−Zn  系合金等があげられ
る。なか′でも好ましいのは 5n−Pb系合金である
。なお、本明細書において超塑性能を示すとは1.2o
o%以上の伸びを示すことを指す。好捷しくは成形温度
においてSOO係以上、特に1ooo4以上の伸びを示
す超塑性金属が用いられる。
To explain the present invention in detail, in the method of the present invention, a laminate of a thermoplastic synthetic resin and a metal having superplastic properties is used as a material. Examples of thermoplastic synthetic resins include addition polymers such as polyethylene, polypropylene, polyvinyl chloride acrylonitrile-styrene copolymer, acrylonitrile-styrene-butadiene copolymer, polyesters such as polybutylene terephthalate, nylon-6, and nylon-2. Any of condensation polymers such as polyamide, polyamideimide, polycarbonate, etc., can be used. When flame retardancy is required for the product, it is preferable to use polyester, nylon, etc. that are easily blended with a flame retardant. As the metal having superplastic performance, there is used a metal that exhibits superplastic performance at the molding temperature of the synthetic resin that forms the laminate together with the metal. For example, if the synthetic resin to be laminated is polyethylene, a metal exhibiting superplastic performance at around /00'Q is used, and if the synthetic resin is polybutylene terephthalate or nylon-6, a metal exhibiting superplastic performance at around 200C is used. Furthermore, when two types of resins are laminated, a metal is used that exhibits superplastic performance at the temperature at which a laminate made only of these resins is formed. Such metals include pb-/%Sn, Sn, 2%Pb,
5n-Pb alloy such as Sn-Jg%Pb, Sn-/%
Bi, 5n-4%B11B soil-! ! 5n- such as %Sn
Bi-based alloy, Zn-0,2%Al, Zn-0,'1%
Zn-Al alloy such as A1, pl)-/, l'%C! d
Pb-Cd alloys such as, Cd-/&%Zn%Cd-
,! 7% Zn etc. C! Examples include d-Zn alloys. Among them, 5n-Pb alloy is particularly preferred. In addition, in this specification, "exhibiting superplastic performance" means 1.2o
It refers to showing an elongation of 0% or more. Preferably, a superplastic metal is used which exhibits an elongation of at least the SOO coefficient, especially at least 1004, at the molding temperature.

積層板は、上記の如き超塑性能を有する金属板の片面ま
たは両面に前述の如き熱可塑性合成樹脂層を積層したも
のである。積層板の厚さは任意であるが、通常は/〜−
’a%特に2〜グ覗である。まだ、そのうちの金属板の
厚さは、成形加工時に積層板に要求される伸び、製品の
筺体に要求される電磁波シールド能により決定されるが
、通常は10〜100θμである。積層板中の金属板が
薄すぎると、積層板の塑性加工にき 際し金属板の伸びがこれに追随でηずに破断しやすい。
The laminate is made by laminating a thermoplastic synthetic resin layer as described above on one or both sides of a metal plate having superplastic properties as described above. The thickness of the laminate is arbitrary, but usually /~-
'a% Especially 2 ~ gu peep. However, the thickness of the metal plate is determined by the elongation required of the laminate during molding and the electromagnetic shielding ability required of the product casing, but is usually 10 to 100 θμ. If the metal plates in the laminate are too thin, the elongation of the metal plates will follow the plastic working of the laminate and the metal plates will easily break.

また金属板が厚くなるほど電磁波シールド能は向上する
。積層板の製造は公知の金属−合成樹脂積層板の製法に
準じて行なうことができる。例えば熱可塑性合成樹脂板
と金属板とを接着フィルムを介して重ね合せ、加熱加圧
して一体化させる。この際、所望ならば金属板の表面を
粗面化したり、合成樹脂板中に接着剤をねり込んでおい
てもよい。寸だ、コイルから連続的に繰出される金属板
上に押出機から接着剤と熱可塑性合成樹脂をシート状に
溶融押出して、次いで一対のローラー間を通過させて両
者を一体化させる連続法により積層板を製造することも
できる。このようにして製造される積層板は、通常、金
属板の片面寸だは両面に合成樹脂を積層した構造を有し
ているが、所望ならば他の構造とすることもできる。積
層板からの筐体またはその部材の製造は、公知の塑性加
工による熱可塑性合成樹脂板からの筐体また村その部材
の製造法に準じて行なうことができる。好ましくは雌型
の上面に成形温度に加熱された積層体を固定し、次いで
雌型と積層板とで形成される密閉空間を減圧にして積層
板を雌型の表面に密着させる真空成形法や、積層板に背
後から圧力を加えて積層板を雌型に密着させる加圧成形
法が用いられる。これらの方法によれば安価な雌型だけ
で成形することができる。
Further, the thicker the metal plate, the better the electromagnetic shielding ability. The laminate can be manufactured according to a known method for manufacturing metal-synthetic resin laminates. For example, a thermoplastic synthetic resin plate and a metal plate are stacked on top of each other with an adhesive film interposed therebetween, and heated and pressed to integrate them. At this time, if desired, the surface of the metal plate may be roughened or an adhesive may be applied to the synthetic resin plate. By a continuous method, adhesive and thermoplastic synthetic resin are melted and extruded from an extruder into a sheet onto a metal plate that is continuously fed out from a coil, and then passed between a pair of rollers to integrate the two. It is also possible to produce laminates. The laminate produced in this manner usually has a structure in which synthetic resin is laminated on one or both sides of a metal plate, but other structures may be used if desired. The casing or its members can be manufactured from a laminate according to a known method for manufacturing a casing or its members from a thermoplastic synthetic resin plate by plastic working. Preferably, a vacuum forming method is used in which a laminate heated to the molding temperature is fixed on the upper surface of the female mold, and then the pressure is reduced in the sealed space formed by the female mold and the laminate to bring the laminate into close contact with the surface of the female mold. A pressure molding method is used in which pressure is applied to the laminate from behind to bring the laminate into close contact with the female mold. According to these methods, molding can be performed using only an inexpensive female mold.

なお、超塑性金属の塑性変形速度は熱可塑性合成樹脂の
それよ幻も小さいので、積層板の加工速度は熱可塑性合
成樹脂板の加工速度よりも相当に小さくするのが好まし
い。若し加工速度が大きすぎると、積層板中の金属がこ
れに追随できずに破断するに至る。破断は筐体の隅角部
など大きく延伸される部分で発生しやすい。破断が生じ
ても、通常は破断が局部的であること、また通常は金属
が個々の破断片に完全に分割されずに破断片が相互に結
合して一体の金属板として存在するので、電磁波シール
ド能は殆虐ど損なわれることなく保持される。
Furthermore, since the plastic deformation rate of superplastic metal is much smaller than that of thermoplastic synthetic resin, it is preferable that the processing speed of the laminate is considerably lower than the processing speed of thermoplastic synthetic resin. If the processing speed is too high, the metal in the laminate will not be able to follow this speed and will break. Fractures tend to occur in areas that are stretched significantly, such as at the corners of the housing. Even if a fracture occurs, it is usually localized, and the metal is usually not completely divided into individual fragments, but the fragments are interconnected and exist as a single metal plate, so electromagnetic waves Shield ability is maintained almost unimpaired.

本発明方法によれば、電磁波シールド性に富む筐体を一
工程で容易に製造することができる。
According to the method of the present invention, a housing with excellent electromagnetic shielding properties can be easily manufactured in one step.

以下に実施例により本発明をさらに具体的に説明するが
、本発明はその要旨を超えない限り、以下の実施例に限
定されるものではない。
EXAMPLES The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited to the following Examples unless it exceeds the gist thereof.

実施例 カイダック(筒中プラスチック工業■製、アクリル変性
塩化ビニル樹脂板、厚さ/ mm )にADMER”J
F220!  (接着性フィルム、三井石油化学工業■
製品)を重ね、さらにその上に超塑性合金の圧延板(錫
と鉛との60二≠0の合金、厚さiooμ)を重ね、7
kg / cydの加圧下にi、:zoCで7分間、加
熱加圧して接着させ、積層板を得た。toxAox2/
rrrInで、上端縁および角をそれぞれ丸く形成した
凹部を有する金型に、1rocに加熱した上記の積層板
を金属面を上にして載置し、上面から圧空で加圧して積
層板を金型の凹部に密着させた。得られた成形品の樹脂
面の外観はカイダックそのものの成形品と全く変らなか
った。また成形品の金属面は、隅角部や底面の一部に亀
裂が発生したものもあったが、電磁波シールド能の点で
は何ら問題にならない程度のものであった。この亀裂は
圧空での加圧速度を調節することにより解消することが
できる。
Example: ADMER”J on Kaidak (manufactured by Tsutsunaka Plastic Industry ■, acrylic modified vinyl chloride resin plate, thickness/mm)
F220! (Adhesive film, Mitsui Petrochemical Industries ■
product), and on top of that, a rolled plate of superplastic alloy (602≠0 alloy of tin and lead, thickness iooμ),
A laminate was obtained by heating and pressurizing and adhering the material under a pressure of kg/cyd using i:zoC for 7 minutes. toxAox2/
Using rrrIn, place the above laminate heated to 1ROC with the metal side facing up in a mold having a concave portion with rounded upper edges and corners, and pressurize the laminate with compressed air from the top to mold the laminate. It was placed in close contact with the recess. The appearance of the resin surface of the obtained molded product was no different from that of the molded product of Kaidac itself. In addition, some of the metal surfaces of the molded products had cracks in the corners and parts of the bottom, but these did not cause any problems in terms of electromagnetic shielding ability. These cracks can be eliminated by adjusting the rate of pressurization with compressed air.

特許出願人 三菱゛化成工業株式会社 東プラ株式会社 代理 人 弁理士 長谷用   − ほか/名Patent applicant: Mitsubishi Chemical Industries, Ltd. Topura Co., Ltd. Representative Patent Attorney Hase - Others/names

Claims (3)

【特許請求の範囲】[Claims] (1)熱可塑性合成樹脂とこの樹脂の成形温度で超塑性
能を示す金属との積層板を、塑性加工により筐体または
その部材に成形することを特徴とする電磁波シールド性
に優れた筐体またはその部材の製造法。
(1) A casing with excellent electromagnetic shielding properties, characterized by forming the laminate of a thermoplastic synthetic resin and a metal that exhibits superplastic performance at the molding temperature of this resin into the casing or its components through plastic processing. or the manufacturing method of its parts.
(2)塑性加工法として真空成形法または加圧成形法を
用いることを特徴とする特許請求の範囲第1項記載の方
法。
(2) The method according to claim 1, wherein a vacuum forming method or a pressure forming method is used as the plastic working method.
(3)超塑性能を有する金属として錫−鉛系の超塑性合
金を用いることを特徴とする特許請求の範囲第1項せた
け第2項記載の方法。
(3) The method according to claim 1, item 2, characterized in that a tin-lead based superplastic alloy is used as the metal having superplastic properties.
JP58053176A 1983-03-29 1983-03-29 Manufacturing method of housing or its member excellent in electromagnetic wave shielding Expired - Lifetime JPH0634475B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58053176A JPH0634475B2 (en) 1983-03-29 1983-03-29 Manufacturing method of housing or its member excellent in electromagnetic wave shielding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58053176A JPH0634475B2 (en) 1983-03-29 1983-03-29 Manufacturing method of housing or its member excellent in electromagnetic wave shielding

Publications (2)

Publication Number Publication Date
JPS59178799A true JPS59178799A (en) 1984-10-11
JPH0634475B2 JPH0634475B2 (en) 1994-05-02

Family

ID=12935549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58053176A Expired - Lifetime JPH0634475B2 (en) 1983-03-29 1983-03-29 Manufacturing method of housing or its member excellent in electromagnetic wave shielding

Country Status (1)

Country Link
JP (1) JPH0634475B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320898A (en) * 1986-07-14 1988-01-28 オリエント時計株式会社 Electromagnetic shielded cubicle and manufacture of the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613780A (en) * 1979-07-16 1981-02-10 Fujitsu Ltd Preparation of semiconductor device
JPS5791600A (en) * 1980-11-29 1982-06-07 Asahi Dow Ltd Synthetic resin housing with electromagnetic shieldability
JPS58195499U (en) * 1982-06-21 1983-12-26 東洋アルミニウム株式会社 Conductive filler for electromagnetic shielding material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613780A (en) * 1979-07-16 1981-02-10 Fujitsu Ltd Preparation of semiconductor device
JPS5791600A (en) * 1980-11-29 1982-06-07 Asahi Dow Ltd Synthetic resin housing with electromagnetic shieldability
JPS58195499U (en) * 1982-06-21 1983-12-26 東洋アルミニウム株式会社 Conductive filler for electromagnetic shielding material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320898A (en) * 1986-07-14 1988-01-28 オリエント時計株式会社 Electromagnetic shielded cubicle and manufacture of the same

Also Published As

Publication number Publication date
JPH0634475B2 (en) 1994-05-02

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