JPS59177947A - エポキシ樹脂封止型半導体装置 - Google Patents

エポキシ樹脂封止型半導体装置

Info

Publication number
JPS59177947A
JPS59177947A JP58051456A JP5145683A JPS59177947A JP S59177947 A JPS59177947 A JP S59177947A JP 58051456 A JP58051456 A JP 58051456A JP 5145683 A JP5145683 A JP 5145683A JP S59177947 A JPS59177947 A JP S59177947A
Authority
JP
Japan
Prior art keywords
epoxy resin
semiconductor device
resin
reaction mixture
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58051456A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0420268B2 (enrdf_load_stackoverflow
Inventor
Hirotoshi Iketani
池谷　裕俊
Michiya Azuma
東　道也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58051456A priority Critical patent/JPS59177947A/ja
Publication of JPS59177947A publication Critical patent/JPS59177947A/ja
Publication of JPH0420268B2 publication Critical patent/JPH0420268B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58051456A 1983-03-29 1983-03-29 エポキシ樹脂封止型半導体装置 Granted JPS59177947A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58051456A JPS59177947A (ja) 1983-03-29 1983-03-29 エポキシ樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58051456A JPS59177947A (ja) 1983-03-29 1983-03-29 エポキシ樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS59177947A true JPS59177947A (ja) 1984-10-08
JPH0420268B2 JPH0420268B2 (enrdf_load_stackoverflow) 1992-04-02

Family

ID=12887432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58051456A Granted JPS59177947A (ja) 1983-03-29 1983-03-29 エポキシ樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS59177947A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190418A (ja) * 1984-03-12 1985-09-27 Mitsubishi Electric Corp 半導体封止用液状エポキシ樹脂組成物
JPH021149A (ja) * 1988-06-09 1990-01-05 Toshiba Corp 樹脂封止型半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190418A (ja) * 1984-03-12 1985-09-27 Mitsubishi Electric Corp 半導体封止用液状エポキシ樹脂組成物
JPH021149A (ja) * 1988-06-09 1990-01-05 Toshiba Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPH0420268B2 (enrdf_load_stackoverflow) 1992-04-02

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