JPS59175150U - semiconductor pressure transducer - Google Patents

semiconductor pressure transducer

Info

Publication number
JPS59175150U
JPS59175150U JP6906283U JP6906283U JPS59175150U JP S59175150 U JPS59175150 U JP S59175150U JP 6906283 U JP6906283 U JP 6906283U JP 6906283 U JP6906283 U JP 6906283U JP S59175150 U JPS59175150 U JP S59175150U
Authority
JP
Japan
Prior art keywords
pressure transducer
semiconductor pressure
circuit board
strain gauge
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6906283U
Other languages
Japanese (ja)
Inventor
実 高橋
御法川 斉
照美 仲沢
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP6906283U priority Critical patent/JPS59175150U/en
Publication of JPS59175150U publication Critical patent/JPS59175150U/en
Pending legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す上面図、第2図はその
断面構造図、第3図は加熱温度とワイヤボンディング強
度を示す図である。 1・・・歪ゲージ、4・・・シールドケース、5・・・
押し出し部、7・・・回路基板部、14・・・ハウジン
グ。
FIG. 1 is a top view showing an embodiment of the present invention, FIG. 2 is a cross-sectional structural view thereof, and FIG. 3 is a diagram showing heating temperature and wire bonding strength. 1... Strain gauge, 4... Shield case, 5...
Extrusion part, 7... Circuit board part, 14... Housing.

Claims (1)

【実用新案登録請求の範囲】 1 圧力を電気信号に変換する半導体歪ゲージ、該歪ゲ
ージの出力を増巾する回路基板部、および該回路基板部
を搭載する金属板およびプラスチックのハウジングより
構成される半導体圧力変換器において、前記金属板の一
部に押出し部を設け、前記歪ゲージを収納したことを特
徴とする半導体圧力変換器。 2 実用新案登録請求の範囲第1項において、前記金属
板を前記回路基板部のアース端子に電気的に接続したこ
とを特徴とする半導体圧力変換器。
[Claims for Utility Model Registration] 1. Consisting of a semiconductor strain gauge that converts pressure into an electrical signal, a circuit board section that amplifies the output of the strain gauge, and a metal plate and plastic housing on which the circuit board section is mounted. 1. A semiconductor pressure transducer characterized in that a part of the metal plate is provided with an extruded part to house the strain gauge. 2 Utility Model Registration The semiconductor pressure transducer according to claim 1, characterized in that the metal plate is electrically connected to a ground terminal of the circuit board section.
JP6906283U 1983-05-11 1983-05-11 semiconductor pressure transducer Pending JPS59175150U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6906283U JPS59175150U (en) 1983-05-11 1983-05-11 semiconductor pressure transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6906283U JPS59175150U (en) 1983-05-11 1983-05-11 semiconductor pressure transducer

Publications (1)

Publication Number Publication Date
JPS59175150U true JPS59175150U (en) 1984-11-22

Family

ID=30199224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6906283U Pending JPS59175150U (en) 1983-05-11 1983-05-11 semiconductor pressure transducer

Country Status (1)

Country Link
JP (1) JPS59175150U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013033038A (en) * 2011-08-01 2013-02-14 Sensata Technologies Inc Sensor system for differential pressure measurement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013033038A (en) * 2011-08-01 2013-02-14 Sensata Technologies Inc Sensor system for differential pressure measurement

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