JPS5917505Y2 - automatic soldering equipment - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an automatic soldering device that has both flat type and jet type functions and enables accurate soldering work.

Conventionally, there are two types of automatic soldering devices: flat type and jet type.

In the plane dip type, the body of a printed wiring board or the like to be soldered is taped almost parallel to the surface of the molten solder, while in the jet type, the molten solder is applied to the body of the soldered body. It is designed to spray water into the air in a wave-like manner.

However, in flat tip type products, the flux applied in the process immediately before the dipping process is vaporized because it is rapidly heated during the dipping process, and this vaporized gas melts into the soldered substrate. There is a problem in that the residual gas escapes between the solder and the solder, and this residual gas repels the solder, often resulting in soldering defects.

On the other hand, with the jet type, the wave width is generally narrow relative to the substrate to be soldered, so it is impossible to uniformly heat the substrate at the same time, and the molten solder flows over the surface of the substrate. Because of this, soldering using solder bridges or so-called "icicles" has the disadvantage that defects are likely to occur, and none of the above methods have high reliability. It was impossible to solder it.

Here, the present invention attempts to provide an automatic soldering device capable of solving the above-mentioned problems.

The present invention will be explained below based on the embodiments shown in the drawings. In the attached drawings, reference numeral 1 represents a solder tank,
A solder partition plate 2 is installed horizontally near an intermediate position in the depth direction.

Further, a molten solder push-up plate 3 is erected at a position slightly to the left of the center of the solder tank 1 in the figure and above the solder partition plate 2 described above.

The upper end surface of this molten solder push-up plate 3 is tapered to facilitate the flow of molten solder, as shown in the figure.

Next, a solder stirring roller 4 is rotatably disposed on the left side of the molten solder pushing-up plate 3 in the figure, and stirring rollers 5a and 5b are disposed on the right side.

Incidentally, each of the above stirring rollers 4. A large number of suitable plate-like protrusions are attached to 5a and 5b in order to increase the stirring or transfer function of the melting X7 or 6.

Reference numeral 7 represents a surface oxide removing material, and 7' represents a surface oxide removal port.

The automatic soldering device according to the embodiment of the present invention is constructed as described above, and operates as follows when performing soldering.

First, the solder bath 1 is appropriately heated to bring the solder in the solder bath 1 into a molten state.

In this state, the stirring roller 4 and each stirring auxiliary roller 5a,
5b is driven and rotated, the molten solder 6 flows in a predetermined direction in the solder bath 1 as shown by the arrow in the figure, and this molten solder 6 strongly hits the molten solder push-up plate 3 and moves upward. This molten solder pushing up plate 3 is pushed up.
A wavy mound 6' of molten solder 6 is formed on the upper part of the molten solder 6.

Next, the molten solder 6 that has passed through the molten solder push-up plate 3 is further pulled in a predetermined direction by stirring auxiliary rollers 5a and 5b, and the surface of the molten solder 6 is moved to remove surface oxidation generated on the surface. The material is directed towards the surface oxide removal lower '.

As a result, surface oxides are removed from the required surface portion of the molten solder 6 that includes the wave-like raised portion 6', and the surface is always maintained in a clean state.

The surface oxides gathered on the surface oxide removal lower' are removed as appropriate, but the molten solder 6 is removed by the surface oxide removal material 7.
After the impurities have been removed, the solder passes through the solder partition plate 2 and flows toward the stirring roller 4.

Furthermore, since the molten solder 6 is maintained in a sufficiently agitated state during this circulation process, separation into both Sn and Pb components is similarly prevented.

Then, while keeping it in a clean state as described above, dip the printed wiring board, etc., which is the body 8 to be soldered, using an appropriate means from the diagonally left side in the figure toward the wavy raised portion 6'. Let it start.

At this time, the molten solder 6 in the wave-shaped raised portion 6' first comes into contact with the soldering body 8 from a part of the tip end of the dip, as in the case of the conventional jet type, and the soldering occurs due to vaporization of the flux. The gas component escapes through the left side of the diagram, which is in a non-contact state, and evaporates.

Therefore, the problem that this gas escapes and remains between the soldering body 8 and the molten solder 6 does not occur.

Next, the soldering body 8 is further pushed forward, and the entire surface of the soldering body 8 on the side to be soldered is tapped on the surface of the molten solder 6.

As a result, the parts to be soldered are uniformly heated at the same time, and when the solder is pulled up, no bridging or "icicles" occur, and the molten solder 6 has a cleaning effect on the required surface part and prevents separation into Sn and PB. Accurate soldering work is done in conjunction with the action.

By appropriately adjusting the distance between each roller 4, 5a, 5b and the surface position of the molten solder, the soldered object can be made into various sizes and shapes, such as a body 8 with lead wires etc. protruding long below the board. It can also be made compatible with

As detailed above, according to the present invention, a solder partition plate is installed horizontally at an appropriate depth in the solder bath, and a molten solder pushing plate is erected above the solder partition plate, and the molten solder is A stirring roller is installed on one side of the push-up plate, and an auxiliary stirring roller is installed on the other side, and the rotation of these rollers in the same direction circulates the molten solder around the solder partition plate. The surface of the molten solder is kept in a constantly moving state, and a wavy molten solder mound is also formed on the upper part of the molten solder push-up plate, and the soldered body is removed from this molten solder mound. Since the tip is started, the gas generated by the vaporization of the flux will not escape between the body of the solder and the molten solder, and the required amount of molten solder, including the molten solder mounds mentioned above, will not remain between the solder body and the molten solder. The surface area is kept clean at all times by removing surface oxides, and the solder itself is prevented from separating into Sn and Pb components, so the above effects combine to produce a solder that is always accurate and highly reliable. It exhibits an extremely excellent practical effect in that it can be used as an adhesive.

BRIEF DESCRIPTION OF THE DRAWINGS The figure is a partially cutaway side view of an automatic soldering device according to an embodiment of the present invention. 1: Solder bath, 2: Solder partition plate, 3: Molten solder push-up plate, 4: Stirring roller, 5a, 5b: Stirring auxiliary roller,
6: Molten solder, 6': Wave-shaped raised portion, 7: Surface oxide removal material, 7' Surface oxide removal opening, 8: Body to be soldered.

Claims (1)

[Scope of utility model registration request] A solder partition plate is placed horizontally at an appropriate depth in the solder bath, and a molten solder pushing plate is set upright on top of this solder partition plate, and a stirring roller is placed on one side of this molten solder pushing plate. The rotation of this stirring roller causes the molten solder to flow towards the molten solder pushing up plate, and an auxiliary stirring roller is disposed on the other side of the molten solder pushing up plate. The stirring auxiliary roller is rotated in the same direction as the stirring roller to circulate the molten solder around the solder partition plate and form a wavy molten solder ridge above the molten solder push-up plate. An automatic soldering device characterized by: