JPS59172749A - 半導体整流素子 - Google Patents

半導体整流素子

Info

Publication number
JPS59172749A
JPS59172749A JP58047061A JP4706183A JPS59172749A JP S59172749 A JPS59172749 A JP S59172749A JP 58047061 A JP58047061 A JP 58047061A JP 4706183 A JP4706183 A JP 4706183A JP S59172749 A JPS59172749 A JP S59172749A
Authority
JP
Japan
Prior art keywords
resin layer
rectifying element
layer
silicon
silicone resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58047061A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0121628B2 (https=
Inventor
Kazuyoshi Naito
内藤　一芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58047061A priority Critical patent/JPS59172749A/ja
Publication of JPS59172749A publication Critical patent/JPS59172749A/ja
Publication of JPH0121628B2 publication Critical patent/JPH0121628B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58047061A 1983-03-23 1983-03-23 半導体整流素子 Granted JPS59172749A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58047061A JPS59172749A (ja) 1983-03-23 1983-03-23 半導体整流素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58047061A JPS59172749A (ja) 1983-03-23 1983-03-23 半導体整流素子

Publications (2)

Publication Number Publication Date
JPS59172749A true JPS59172749A (ja) 1984-09-29
JPH0121628B2 JPH0121628B2 (https=) 1989-04-21

Family

ID=12764634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58047061A Granted JPS59172749A (ja) 1983-03-23 1983-03-23 半導体整流素子

Country Status (1)

Country Link
JP (1) JPS59172749A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04146655A (ja) * 1990-10-08 1992-05-20 Hitachi Ltd 半導体整流素子及びそれを使った全波整流装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS534867U (https=) * 1976-06-30 1978-01-17
JPS534866U (https=) * 1976-06-30 1978-01-17
JPS57115247U (https=) * 1981-01-10 1982-07-16

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS534867U (https=) * 1976-06-30 1978-01-17
JPS534866U (https=) * 1976-06-30 1978-01-17
JPS57115247U (https=) * 1981-01-10 1982-07-16

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04146655A (ja) * 1990-10-08 1992-05-20 Hitachi Ltd 半導体整流素子及びそれを使った全波整流装置
US5302856A (en) * 1990-10-08 1994-04-12 Hitachi, Ltd. Semiconductor rectifying device and full-wave rectifier fabricated using the same

Also Published As

Publication number Publication date
JPH0121628B2 (https=) 1989-04-21

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