JPS59172383U - Semiconductor device testing equipment - Google Patents
Semiconductor device testing equipmentInfo
- Publication number
- JPS59172383U JPS59172383U JP6720583U JP6720583U JPS59172383U JP S59172383 U JPS59172383 U JP S59172383U JP 6720583 U JP6720583 U JP 6720583U JP 6720583 U JP6720583 U JP 6720583U JP S59172383 U JPS59172383 U JP S59172383U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- testing equipment
- device testing
- fins
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は半導体素子の高温ブロッキング試験の回路構成
図である。第２図は従来構造の素子取り付はソケットを
示す斜視図である。第３図ａ、 ｂ。
Ｃはそれぞれ本考案の一実施例の素子取り付はソケット
およびそのフィン開閉状態を示す斜視図である。
１・・・・・・供試乎導体素子、１ａ・・・・・・素子
リード、２・・・・・・電源、３・・・・・・過電流検
出時運断器（ヒユーズ等）、４・・・・・・電流制限用
抵抗、５・・・・・・高温槽、６・・・・・・素子取り
付はソケット、７・・・・・・フィン。FIG. 1 is a circuit configuration diagram for a high temperature blocking test of a semiconductor device. FIG. 2 is a perspective view showing a socket for mounting an element in a conventional structure. Figure 3 a, b. C is a perspective view showing an element mounting socket and its fins in an open/closed state according to an embodiment of the present invention. 1... Conductor element under test, 1a... Element lead, 2... Power supply, 3... Disconnector when detecting overcurrent (fuse, etc.) , 4... Resistor for current limiting, 5... High temperature tank, 6... Socket for mounting the element, 7... Fin.
Claims (1)
いて、前記半導体素子を取り付けるソケット部分に複数
枚のフィンを備えたことを特徴とする半導体素子試験装
置。What is claimed is: 1. An electrical characteristic testing device for a semiconductor device having a lead wire, characterized in that a socket portion to which the semiconductor device is attached is provided with a plurality of fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6720583U JPS59172383U (en) | 1983-05-04 | 1983-05-04 | Semiconductor device testing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6720583U JPS59172383U (en) | 1983-05-04 | 1983-05-04 | Semiconductor device testing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59172383U true JPS59172383U (en) | 1984-11-17 |
Family
ID=30197402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6720583U Pending JPS59172383U (en) | 1983-05-04 | 1983-05-04 | Semiconductor device testing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59172383U (en) |
-
1983
- 1983-05-04 JP JP6720583U patent/JPS59172383U/en active Pending
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