JPS59166446U

JPS59166446U - Semiconductor wafer holding container

Info

Publication number: JPS59166446U
Application number: JP6320983U
Authority: JP
Inventors: 貞森　「まさ」昭
Original assignee: 三菱電機株式会社
Priority date: 1983-04-25
Filing date: 1983-04-25
Publication date: 1984-11-08

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来の半導体ウェーハの保持容器の斜視図、第
２図はこの考案の一実施例による半導体ウェーハの保持
容器の斜視図である。７・・・半導体ウェーハ、１１・・・保持容器、１２゜
１３・・・側辺部、１４・・・仕切り部、１５．１６・
・・保持溝、１７・・・半導体ウェーハ。なお、図中同
一符号は同−又は相当部分を示す。補正　昭５８．　８．２４実用新案登録請求の範囲を次のように補正する。Ｏ実用新案登録請求の範囲両側辺部間の中間に双方間が異なる間隔に分ける位置に
仕切り部を形成してあり、この仕切り部の一方の面とこ
れに対向する上記一方の側辺部内面とにそれぞれ多数条
の立て方向の保持溝を設け、所定の直径の半導体ウェー
ハを多数枚収容するようにし、上記仕切り部の他方の面
とこれに対向する上記他方の側辺部内面とにそれぞれ多
数条の立て方向の保持溝を設け、上記半導体ウェーハと
は直径の異なる他の種の半導体ウェーハを多数枚収容す
るようにしたことを特徴とする半導体ウェーハの保持容
器。FIG. 1 is a perspective view of a conventional semiconductor wafer holding container, and FIG. 2 is a perspective view of a semiconductor wafer holding container according to an embodiment of this invention. 7... Semiconductor wafer, 11... Holding container, 12° 13... Side part, 14... Partition part, 15.16.
... Holding groove, 17... Semiconductor wafer. Note that the same reference numerals in the figures indicate the same or equivalent parts. Revised 1984. 8.24 The scope of claims for utility model registration shall be amended as follows. O Utility Model Registration Claims A partition is formed in the middle between both sides at a position that divides the sides into different intervals, and one surface of this partition and the inner surface of the one side opposite thereto. A large number of holding grooves in the vertical direction are provided in each of the partitions so as to accommodate a large number of semiconductor wafers of a predetermined diameter, and a plurality of holding grooves are provided in each of the other surfaces of the partition portion and the inner surface of the other side portion opposing thereto. 1. A holding container for semiconductor wafers, characterized in that a large number of holding grooves in the vertical direction are provided to accommodate a large number of semiconductor wafers of other types having different diameters from the semiconductor wafers described above.

Claims

[Scope of utility model registration request]

A partition portion is formed in the middle between both side portions at a position dividing the two sides at different intervals, and a plurality of strips are formed on one side of the partition portion and the inner surface of the one side portion opposing thereto. A holding groove in the vertical direction is provided to accommodate a large number of semiconductor wafers of a predetermined diameter, and a large number of grooves are provided on the other surface of the partition portion and the inner surface of the other side facing thereto, respectively, for holding the semiconductor wafers in the vertical direction. A holding container for semiconductor wafers, which is provided with a groove to accommodate a large number of semiconductor wafers of other types having different diameters from the semiconductor wafers described above.