JPS59161895A - プリント基板のスルーホールメッキ装置 - Google Patents

プリント基板のスルーホールメッキ装置

Info

Publication number
JPS59161895A
JPS59161895A JP3792983A JP3792983A JPS59161895A JP S59161895 A JPS59161895 A JP S59161895A JP 3792983 A JP3792983 A JP 3792983A JP 3792983 A JP3792983 A JP 3792983A JP S59161895 A JPS59161895 A JP S59161895A
Authority
JP
Japan
Prior art keywords
plating
tank
electroless copper
supply pipe
copper plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3792983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH047120B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
敏之 大西
篤 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plantex Ltd
PlantX Corp
Original Assignee
Plantex Ltd
PlantX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plantex Ltd, PlantX Corp filed Critical Plantex Ltd
Priority to JP3792983A priority Critical patent/JPS59161895A/ja
Publication of JPS59161895A publication Critical patent/JPS59161895A/ja
Publication of JPH047120B2 publication Critical patent/JPH047120B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP3792983A 1983-03-07 1983-03-07 プリント基板のスルーホールメッキ装置 Granted JPS59161895A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3792983A JPS59161895A (ja) 1983-03-07 1983-03-07 プリント基板のスルーホールメッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3792983A JPS59161895A (ja) 1983-03-07 1983-03-07 プリント基板のスルーホールメッキ装置

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP5393690A Division JPH0375378A (ja) 1990-03-06 1990-03-06 無電解メッキ槽のメッキ液循環装置
JP5393490A Division JPH0375377A (ja) 1990-03-06 1990-03-06 プリント基板のスルーホールメッキ装置
JP5393590A Division JPH0375376A (ja) 1990-03-06 1990-03-06 無電解メッキ槽のメッキ液循環装置

Publications (2)

Publication Number Publication Date
JPS59161895A true JPS59161895A (ja) 1984-09-12
JPH047120B2 JPH047120B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-02-07

Family

ID=12511241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3792983A Granted JPS59161895A (ja) 1983-03-07 1983-03-07 プリント基板のスルーホールメッキ装置

Country Status (1)

Country Link
JP (1) JPS59161895A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230883A (ja) * 1985-07-31 1987-02-09 Hitachi Condenser Co Ltd 液の昇温装置
JPH0375376A (ja) * 1990-03-06 1991-03-29 Purantetsukusu:Kk 無電解メッキ槽のメッキ液循環装置
JPH0375378A (ja) * 1990-03-06 1991-03-29 Purantetsukusu:Kk 無電解メッキ槽のメッキ液循環装置
JPH056829A (ja) * 1990-12-28 1993-01-14 Tokin Corp 薄型トランス
WO2006022133A1 (ja) * 2004-08-23 2006-03-02 Tokyo Electron Limited 無電解めっき装置
JP2011042832A (ja) * 2009-08-20 2011-03-03 Denso Corp 無電解めっき処理方法
JP2016188398A (ja) * 2015-03-30 2016-11-04 株式会社 コーア めっき槽装置
CN111448338A (zh) * 2017-11-30 2020-07-24 Ap&S国际股份有限公司 用于化学镀金属化至少一个工件的目标表面的设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57140870A (en) * 1981-11-09 1982-08-31 Canon Inc Controlling apparatus for concentration of plating solution

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57140870A (en) * 1981-11-09 1982-08-31 Canon Inc Controlling apparatus for concentration of plating solution

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230883A (ja) * 1985-07-31 1987-02-09 Hitachi Condenser Co Ltd 液の昇温装置
JPH0375376A (ja) * 1990-03-06 1991-03-29 Purantetsukusu:Kk 無電解メッキ槽のメッキ液循環装置
JPH0375378A (ja) * 1990-03-06 1991-03-29 Purantetsukusu:Kk 無電解メッキ槽のメッキ液循環装置
JPH056829A (ja) * 1990-12-28 1993-01-14 Tokin Corp 薄型トランス
WO2006022133A1 (ja) * 2004-08-23 2006-03-02 Tokyo Electron Limited 無電解めっき装置
JP2011042832A (ja) * 2009-08-20 2011-03-03 Denso Corp 無電解めっき処理方法
JP2016188398A (ja) * 2015-03-30 2016-11-04 株式会社 コーア めっき槽装置
CN111448338A (zh) * 2017-11-30 2020-07-24 Ap&S国际股份有限公司 用于化学镀金属化至少一个工件的目标表面的设备

Also Published As

Publication number Publication date
JPH047120B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-02-07

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