JPS59159947U - 半導体装置の製造装置 - Google Patents

半導体装置の製造装置

Info

Publication number
JPS59159947U
JPS59159947U JP5393583U JP5393583U JPS59159947U JP S59159947 U JPS59159947 U JP S59159947U JP 5393583 U JP5393583 U JP 5393583U JP 5393583 U JP5393583 U JP 5393583U JP S59159947 U JPS59159947 U JP S59159947U
Authority
JP
Japan
Prior art keywords
semiconductor device
device manufacturing
block body
manufacturing equipment
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5393583U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0140198Y2 (enrdf_load_stackoverflow
Inventor
敏弘 森本
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP5393583U priority Critical patent/JPS59159947U/ja
Publication of JPS59159947U publication Critical patent/JPS59159947U/ja
Application granted granted Critical
Publication of JPH0140198Y2 publication Critical patent/JPH0140198Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP5393583U 1983-04-11 1983-04-11 半導体装置の製造装置 Granted JPS59159947U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5393583U JPS59159947U (ja) 1983-04-11 1983-04-11 半導体装置の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5393583U JPS59159947U (ja) 1983-04-11 1983-04-11 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JPS59159947U true JPS59159947U (ja) 1984-10-26
JPH0140198Y2 JPH0140198Y2 (enrdf_load_stackoverflow) 1989-12-01

Family

ID=30184287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5393583U Granted JPS59159947U (ja) 1983-04-11 1983-04-11 半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JPS59159947U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63202928A (ja) * 1987-02-18 1988-08-22 Mitsubishi Electric Corp 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63202928A (ja) * 1987-02-18 1988-08-22 Mitsubishi Electric Corp 半導体製造装置

Also Published As

Publication number Publication date
JPH0140198Y2 (enrdf_load_stackoverflow) 1989-12-01

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