JPS5915509Y2 - 発光表示装置 - Google Patents

発光表示装置

Info

Publication number
JPS5915509Y2
JPS5915509Y2 JP1977176556U JP17655677U JPS5915509Y2 JP S5915509 Y2 JPS5915509 Y2 JP S5915509Y2 JP 1977176556 U JP1977176556 U JP 1977176556U JP 17655677 U JP17655677 U JP 17655677U JP S5915509 Y2 JPS5915509 Y2 JP S5915509Y2
Authority
JP
Japan
Prior art keywords
light emitting
substrate
emitting diode
wire
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977176556U
Other languages
English (en)
Japanese (ja)
Other versions
JPS54103761U (enExample
Inventor
勝 神野
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP1977176556U priority Critical patent/JPS5915509Y2/ja
Publication of JPS54103761U publication Critical patent/JPS54103761U/ja
Application granted granted Critical
Publication of JPS5915509Y2 publication Critical patent/JPS5915509Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1977176556U 1977-12-30 1977-12-30 発光表示装置 Expired JPS5915509Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977176556U JPS5915509Y2 (ja) 1977-12-30 1977-12-30 発光表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977176556U JPS5915509Y2 (ja) 1977-12-30 1977-12-30 発光表示装置

Publications (2)

Publication Number Publication Date
JPS54103761U JPS54103761U (enExample) 1979-07-21
JPS5915509Y2 true JPS5915509Y2 (ja) 1984-05-08

Family

ID=29185200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977176556U Expired JPS5915509Y2 (ja) 1977-12-30 1977-12-30 発光表示装置

Country Status (1)

Country Link
JP (1) JPS5915509Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6398887B2 (ja) * 2015-06-18 2018-10-03 豊田合成株式会社 発光装置の製造方法
WO2022054699A1 (ja) * 2020-09-14 2022-03-17 京セラ株式会社 表示装置および表示装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056199A (enExample) * 1973-09-14 1975-05-16
JPS5211784A (en) * 1975-07-17 1977-01-28 Matsushita Electric Ind Co Ltd Photo semiconductor device

Also Published As

Publication number Publication date
JPS54103761U (enExample) 1979-07-21

Similar Documents

Publication Publication Date Title
KR850007317A (ko) 미리 형성된 패터언을 가진 장치기판 장치-부착 점착제 트랜스퍼 장치
KR950007070A (ko) 반도체 디바이스 패키지 제조 방법
KR920007133A (ko) 표면 장착중에 균열을 방지하기 위한 집적 회로 디바이스 및 그 방법
KR910005416A (ko) 테이프 캐리어 및 그 장착방법 및 장치
KR960706192A (ko) 접착제 박판을 이용하는 다중칩 전자 패키지 모듈(Multi-chip electronic package module utilizing an adhesive sheet)
JPS5915509Y2 (ja) 発光表示装置
JP2514414B2 (ja) プリント基板に対する発光素子の樹脂封止構造
JPH0537028A (ja) Ｌｅｄ発光表示素子
KR890003025A (ko) 칩고정 테이프
US20090115926A1 (en) Display and method of making
JPH0346509Y2 (enExample)
JPS5768053A (en) Integrated circuit package
JPS6339736Y2 (enExample)
JPS62211Y2 (enExample)
JPH0744202B2 (ja) チップ実装方法
JPH0633181U (ja) 発光ダイオード表示装置
JPH0652833B2 (ja) 複写機用イレーサー
JPH03122484U (enExample)
JP3055810U (ja) ダイオード側面型バックライト装置
ATE237848T1 (de) Elektronische vorrichtung mit einer auf einem träger befestigten schaltung, und herstellungsverfahren
JPH0715289Y2 (ja) 配線固定具
JPH01115953U (enExample)
JPS5927076Y2 (ja) 部品取付装置
JP2549465Y2 (ja) 光プリントヘッド
JPS6041739Y2 (ja) 発光ダイオ−ド表示器