JPS59150713A - Preheater - Google Patents

Preheater

Info

Publication number
JPS59150713A
JPS59150713A JP2059083A JP2059083A JPS59150713A JP S59150713 A JPS59150713 A JP S59150713A JP 2059083 A JP2059083 A JP 2059083A JP 2059083 A JP2059083 A JP 2059083A JP S59150713 A JPS59150713 A JP S59150713A
Authority
JP
Japan
Prior art keywords
preheated
electrode
resin tablets
preheater
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2059083A
Other languages
Japanese (ja)
Inventor
Yasumasa Noda
野田 康昌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2059083A priority Critical patent/JPS59150713A/en
Publication of JPS59150713A publication Critical patent/JPS59150713A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B13/00Conditioning or physical treatment of the material to be shaped
    • B29B13/02Conditioning or physical treatment of the material to be shaped by heating

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To insert resin tablets efficiently into molds by softening nothing but part of the resin tablets supplied to the molds with a heating electrode that takes temperature distribution with a specified inclination. CONSTITUTION:An upper electrode 23 and a lower electrode 24 are provided so that an inclination angle is made between their opposite ends. A plurality of resin tablets 25 to be preheated are preheated by a preheater 20 constructed in this manner. At a specified temperature gradient the resin tablets 25 can be preheated by the upper and the lower electrode 23, 24 that are made uneven in the opposite distance. As a result, in the preheating bodies 25, the lower portion in the pot of the mold is softened and the portion that comes in contact with an upper extruding plunger can be hardened. In this manner, air is not engulfed in the preheating bodies 25 of resin tablets in the mold and voids are prevented from occurring.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、プレヒータに関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a preheater.

〔発明の技術的′:苛景〕[Technical aspect of invention: A rough scene]

所定の半導体装置を製造するために、素子を樹脂タブレ
ットを用いて封止することが行われている。樹脂タブレ
ット?’Cよる素子の封止は、第1図に示す如きプレヒ
ータ音用いて、予め複数個の樹脂タブレット1を加熱し
、これをモールド型に供給することによシ行われている
。而して、樹脂タブレットlの予熱は、これを上下両1
11すから挾持する上型電極2とF型Ti’、極3間に
、電源部4から所定緻の通電を施すことにより行われて
いる。通電によって複数個の樹脂タブレットlは、全て
約80〜90℃に加熱される。
In order to manufacture a predetermined semiconductor device, an element is sealed using a resin tablet. Resin tablet? The sealing of the device with 'C is carried out by heating a plurality of resin tablets 1 in advance using a preheater sound as shown in FIG. 1, and supplying them to a mold. Therefore, to preheat the resin tablet l, place it on both the upper and lower sides.
This is carried out by applying a predetermined power supply from the power supply section 4 between the upper electrode 2, the F-type Ti', and the pole 3 which are held between the electrodes 11 and 11. All of the plurality of resin tablets 1 are heated to about 80 to 90° C. by energization.

〔背景技術の問題点〕[Problems with background technology]

而して、予熱された樹脂タブレット1をモールド型に供
給して素子の刺止を行うと、特にモールド型が大型のも
のである場合には、浴融した廚脂タブレッl−1中に気
泡が1昆入する。この、ため、素子に設けられたボンデ
ィング腺のオープン不良を招いたり、素子を封1卜した
樹脂封止体中にボイドが発生する。その結果、樹脂封市
製品に熱衝撃試験を施すと、所謂樹脂クラックを発生し
たシ、或は、ボンディング線のオープン不良を引き起こ
す確率が最小の場合でも約3チあった。溶融した樹脂タ
ブレット1への気泡の混入は、予熱されたモールド型の
ポット内に樹脂タブレットを投入し7て、プランジャー
をこれに向けて降下した際に、空気を巻き込むために起
きると考えられる。すなわち、樹脂タブレット1がプラ
ンジャーにて押圧されてくずれ、軟らかくなった除にポ
ットの内部にあった空気が樹脂クジレット1中にとり込
まれるものと考えられている。
Therefore, when the preheated resin tablet 1 is supplied to the mold and the element is attached, air bubbles may be formed in the bath-melted resin tablet 1-1, especially when the mold is large. 1 piece is included. This may lead to open defects in the bonding glands provided in the element, or voids may occur in the resin sealing body in which the element is sealed. As a result, when a thermal shock test was conducted on a resin-sealed product, the probability of causing so-called resin cracks or open bonding wire defects was about 3 at the minimum. The inclusion of air bubbles in the molten resin tablet 1 is thought to occur because air is drawn in when the resin tablet is placed in a preheated molded pot and the plunger is lowered towards it. . That is, it is thought that the resin tablet 1 is pressed by the plunger and breaks down, and the air that was inside the pot is taken into the resin tablet 1 even though it becomes soft.

〔発明の目的〕[Purpose of the invention]

本発明は、ボイドの発生を阻止したモールド成型を可能
にしたプレヒータ′を提供することをその目的とするも
のである。
SUMMARY OF THE INVENTION An object of the present invention is to provide a preheater that enables molding that prevents the generation of voids.

〔発明の概要〕[Summary of the invention]

本発明は、モールド型に供給する樹脂タブレットを所定
の傾きをもった温度分布に加熱するド成型を可能にした
プレヒータである。
The present invention is a preheater that enables molding by heating a resin tablet supplied to a mold to a temperature distribution with a predetermined slope.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例について図面を参照して説明する
Embodiments of the present invention will be described below with reference to the drawings.

第2図は、本発明の一実施例の概略構成を示j説明図で
ある。このプレヒータ20は、′電源部21と電極部2
2とで構成されている。電極部22は、上型電極23と
丁型電極24とで構成されている。上型電極23と丁ハ
シ電極24間には、被予熱体25である樹脂タブレット
の複数1向が設置されるようになっている。下型電極2
3と丁型電極24の対向間隔は、i投置された複数個の
被予熱体25に所定の勾配の下に予熱が施されるように
、両゛或極23,24の両端間で傾斜した状態に設定さ
れている。゛−1極部220下部に設けられた電源部2
1には、タイマー26と電流計27とが設けられている
。このタイマー26と電流計27により所定客層の通電
が、上型電極23と下型電極24に施されるようくなっ
ている。
FIG. 2 is an explanatory diagram showing a schematic configuration of an embodiment of the present invention. This preheater 20 has a power supply section 21 and an electrode section 2.
It is composed of 2. The electrode section 22 is composed of an upper electrode 23 and a D-shaped electrode 24. A plurality of resin tablets, which are objects to be preheated 25, are installed between the upper mold electrode 23 and the knife electrode 24. Lower electrode 2
The opposing interval between the poles 23 and 24 is inclined between both ends of the poles 23 and 24 so that the plurality of objects 25 to be preheated placed i are preheated at a predetermined gradient. is set to .゛-1 Power supply section 2 provided at the bottom of the pole section 220
1 is provided with a timer 26 and an ammeter 27. The timer 26 and ammeter 27 are used to energize the upper electrode 23 and lower electrode 24 for a predetermined customer group.

このように構成されたプレヒータ20によれば、複数個
の被予熱体25を、対向間隔を不均一にしだ上F両’@
、罹23 、24にて所定の温度勾配の下に予熱するこ
とができる。その結果、予熱された被予熱体25を図示
しないモールドノド1(のポット内に、その下方に位1
縦する部分を軟らかい状態にし、上方の部分であるプラ
ンジャーに接)牲するところを硬い状態にして供給でき
る。このため、プランジャーにてポット内の被予熱体2
5を封1ト部であるキャビティーに向け−て刊1し出し
た際に、被予熱体25中に空気が巻き込−まれるのを容
易に防止できる。従って、ボイドがなく、シかもボンデ
ィング線のオープン不良等のない高品質の樹脂封止°・
棟品を容易に得ることができる。
According to the preheater 20 configured in this way, the plurality of objects to be preheated 25 are arranged so that the opposing intervals are uneven, and
, 23 and 24 can be preheated under a predetermined temperature gradient. As a result, the preheated object 25 is placed in the pot of the mold nozzle 1 (not shown), and placed at a position below it.
It can be supplied with the vertical part in a soft state and the upper part, which is in contact with the plunger, in a hard state. For this reason, the object to be preheated 2 in the pot is heated using the plunger.
It is possible to easily prevent air from being drawn into the object 25 to be preheated when the sheet 1 is put out toward the cavity which is the sealing portion. Therefore, high quality resin sealing with no voids and no open defects in bonding wires.
Building products can be easily obtained.

なお、複数個の被予熱体25を所定の温に勾配で加熱す
る手段として、第3図に示す如く、上型電極23a・・
・23cを被予熱体25の数に応じて分割した。構造を
採用しても良い。
As a means for heating the plurality of objects 25 to be preheated to a predetermined temperature in a gradient manner, as shown in FIG. 3, upper electrodes 23a...
- 23c was divided according to the number of objects 25 to be preheated. structure may be adopted.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く、本発明に係るグレヒ、−タによれば
、ボイドの発生を阻止したモールド成型を容易に行うこ
とができるものである。
As explained above, according to the gray plate according to the present invention, molding can be easily performed while preventing the generation of voids.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、従来のプレヒータの概略構成を示す説明図、
第2図は、本発明の一実施例の概略構城を示す説明図、
第3図は、本発明の他の実施例の概略構成を示す説明図
である。
FIG. 1 is an explanatory diagram showing the schematic configuration of a conventional preheater;
FIG. 2 is an explanatory diagram showing a schematic structure of an embodiment of the present invention;
FIG. 3 is an explanatory diagram showing a schematic configuration of another embodiment of the present invention.

Claims (1)

【特許請求の範囲】 +11+u数個の被予熱体を上下両側から挾持する上型
「l:極及び丁ヘリ電極からなる電極部と、該電極部に
所定容量の通電を施す電源部とを具備するプレヒータに
おいて、各々の被予熱体に異なる′f′−N’、の通電
を施すように通電y、FQ(制御手段を設けたことを特
徴とするプレヒータ。 (2)通電容吐制御手段は、被予熱体に応じて上型電極
と゛ド型電極間の間隔を異にした構造にて構成されてい
る→よ請求の範囲第1項記戦のプレヒータ。 (3)通′亀容喰の制御手段は、上型電極を被予熱体に
対応して分割し−C構成されている特許請求の範囲81
41項記載のプレヒータ。
[Scope of Claims] +11+u An upper mold that holds several objects to be preheated from both upper and lower sides, and includes an electrode section consisting of a pole and a helical electrode, and a power supply section that applies a predetermined capacity of electricity to the electrode section. A preheater characterized in that a control means is provided for energization y, FQ (control means) so as to energize each object to be preheated at a different value of 'f'-N'. (2) The energization discharge control means is , the preheater according to claim 1 is constructed with a structure in which the spacing between the upper electrode and the lower electrode is varied depending on the object to be preheated. Claim 81, wherein the control means is configured by dividing the upper mold electrode corresponding to the object to be preheated.
The preheater according to item 41.
JP2059083A 1983-02-10 1983-02-10 Preheater Pending JPS59150713A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2059083A JPS59150713A (en) 1983-02-10 1983-02-10 Preheater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2059083A JPS59150713A (en) 1983-02-10 1983-02-10 Preheater

Publications (1)

Publication Number Publication Date
JPS59150713A true JPS59150713A (en) 1984-08-29

Family

ID=12031452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2059083A Pending JPS59150713A (en) 1983-02-10 1983-02-10 Preheater

Country Status (1)

Country Link
JP (1) JPS59150713A (en)

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