JPS59149931A - Production of thin metallic film - Google Patents

Abstract

PURPOSE:To produce a thin metallic film without thermal deformation or heat decomposition, by laying a polymer on the thin metallic film side of a polymer base, moving this along the periphery of a cylindrical can under application of a potential difference between the thin metallic film and the can and forming a thin metallic film on the other side by vacuum metallizing. CONSTITUTION:A polymer base 9 having one surface coated with a thin metallic film A is moved in the direction of an arrow while the film A is in contact with a metallic roller 7. A voltage is applied between the metallic roller 7 and the cylindrical can 2 by a power source 8. Numerals 11 and 12 indicate metallic rollers. Numerals 13 and 14 indicate feed and take-up rollers for polymer film 10. A metal is evaporated from an evaporation source 5 to form a thin metallic film C on the base 9. The base 9 moves while it is in stable contact with the cylindrical can 2 by an electrostatic attractive force, so that the thin metallic film can be formed without thermal deformation or heat decomposition.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a metal thin film, which involves forming a metal thin film on a substrate made of a polymeric material.

Conventional structure and its problems The best method for forming a thin metal film on a substrate made of polymeric material by vacuum evaporation is to deposit it while the substrate is running along the circumferential surface of a cylindrical can. ing. FIG. 1 schematically shows the internal structure of a vacuum evaporation apparatus using such a method.

A substrate 1 made of a polymeric material runs along the circumferential side of a cylindrical can 2 in the direction of the arrow. An evaporation source 5 is placed on this substrate 1.
A thin metal film is formed. 3 and 4 are a supply roll and a take-up roll for the substrate 1, respectively. When depositing a metal thin film on a substrate made of a polymeric material using such a vacuum evaporation apparatus, if the metal thin film is thin and has a thickness of several hundred angstroms or less, the thin film can be stably formed; When forming a film with a thickness of 800 mm or more at a high deposition rate of several 100 mm or more, thermal deformation or thermal decomposition of the substrate may occur due to radiant heat from the evaporation source, condensation heat of evaporated atoms, etc., making it difficult to achieve stable evaporation. A film cannot be obtained. When a metal thin film is deposited only on one surface of a single substrate made of a polymeric material, the above problem can be solved by creating a potential difference between the metal thin film and the cylindrical can. An example of this will be explained using FIG.

A substrate 6 made of a polymeric material on which a metal thin film B having a thickness of several tens of degrees or less is deposited on one surface thereof is
runs in contact with metal rollers 7. A voltage is applied between the metal roller 2 and the cylindrical can 2 which is grounded by a power source 8. In this way, electrostatic attraction is generated between the substrate 6 and the cylindrical can 2, and the substrate 6 sticks to the cylindrical can.

When the thin film material is evaporated from the evaporation source 5 under tension to form the metal thin film C on the substrate 6, the radiant heat from the evaporation source and the condensation heat of the evaporated atoms are diffused into the cylindrical can 2.
No thermal deformation or thermal decomposition of the substrate occurs. If the substrate 6 is not sufficiently adhered to the can 2, the amount of heat diffusion will be small and the substrate will be thermally damaged.

In the example described above, a thin metal film is deposited on one surface of a substrate made of a polymer material, and there is no metal film on the other surface, but a thin metal film has already been formed on one surface. The above method cannot be used when a thin metal film is further deposited on the other surface of the substrate made of a polymeric material. In other words, it is not possible to stick the substrate to the cylindrical can by electrostatic force, and thermal deformation and thermal decomposition occur when vapor deposition is performed using the conventional method.Object of the InventionThe present invention uses a vacuum vapor deposition method to An object of the present invention is to provide a method for forming a metal thin film on the other surface of a substrate made of a polymeric material on which a metal thin film is formed on one surface without causing thermal deformation or thermal decomposition of the substrate. .

Structure of the Invention The present invention is directed to a substrate made of a polymeric material, which is formed into a metal thin film on one surface, running along the circumferential side of a cylindrical can.
When forming the metal thin film C by vacuum evaporation method, a film made of a polymeric material is layered and run on the metal thin film A side of the substrate, and the metal thin film A or the pot metal thin film C and the above This is a method for manufacturing a metal thin film characterized by creating a one-potential difference between the metal film and the metal film. , it is possible to immerse metal thin films.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to FIGS. 3 and 4. FIG. 3 is a diagram showing an example of the inside of a vacuum evaporation apparatus for carrying out the method of the present invention, and the same parts as in FIGS. 1 and 2 are designated by the same numbers.

A substrate 9 made of a polymeric material having a metal thin film formed on one surface thereof runs in the direction of the arrow in contact with a gold bias roller 7 over the metal thin film. A low pressure is applied between the metal roller 7 and the cylindrical can 2 by a power source 8. 1
1.12 is a metal roller, and the substrate 9 and the film 10 made of a polymeric material are superimposed on each other by the roller 12;
Enter the cylindrical can 2 as it is. 13 and 14 are a supply roll and a take-up roll for the film 1o made of the above-mentioned polymeric material, respectively. FIG. 4 schematically shows an enlarged view of how the substrate 9 and the film 10 overlap and are in contact with the cylindrical can 2. 16 is a substrate made of a polymer material on which metal thin films are formed on both sides; 16 is a metal thin film A117;
is a metal thin film C, and the portion being evaporated by the evaporation source 5 is shown. Using the apparatus shown in FIG. 3, we conducted an experiment with the voltage of the power source 8 ranging from 60 to 260 V, and found that the board 9 stuck stably to the circular can 2 due to electrostatic attraction. It has become clear that metal thin films can be produced without thermal deformation or thermal decomposition. As a power source for applying voltage to the metal thin film, in Fig. 3 (d) a DC power source is shown, but an AC power source may also be used. Even if there is a metal thin film B between them, there will be no adverse effect.In addition, although the voltage is applied to the metal thin film A in Fig. 3, it may be applied to the metal thin film C, or it can be applied to both films. You may do so.

Next, specific examples of the present invention will be described.

In a vacuum evaporation apparatus having the basic configuration shown in Fig. 3,
A Co--Cr alloy film with a thickness of 200 μm was formed on both sides of a polyethylene terephthalate substrate with a thickness of 40 μm. First, a Co-Cr alloy film as the metal thin film A is deposited by a conventional method, and then a Co=Cr alloy film as the metal thin film C is deposited by the method of the present invention. During vapor deposition, a polyethylene terephthalate film with a film thickness of 16) tm was used as a 1° film made of a polymeric material, and the voltage of the power source 8 applied to the metal thin film A was 80 cm. The produced film was very stable, and no thermal deformation, thermal decomposition, cracks, etc. were observed. On the other hand, when a co=Cr alloy film as a thin metal Bc was deposited without applying a voltage, the polyethylene terephthalate substrate was thermally decomposed and holes were formed in some parts.

Effects of the Invention As described in (2), according to the present invention, a substrate can be attached to a cylindrical can during vapor deposition, and as a result, a stable metal thin film without thermal deformation or thermal decomposition can be provided.

[Brief explanation of the drawing]

1 and 2 are principle diagrams showing an outline of the inside of a conventional vacuum evaporation apparatus, and FIG. 4
The figure is an enlarged view schematically enlarging a part of FIG. 3. 2...Cylindrical can, 8...Power source for applying voltage to the substrate, 9...Polymer material with metal thin film A formed on one surface A substrate consisting of;
10...Film made of polymeric material, 16...
...Metal thin film A117 River...Metal thin film cQ Name of agent: Patent attorney Toshi Nakao (Male) Haga 1st person
Figure wa. . Kuninaka 5 ■ [Hi 6 Suspension 3 Figure 4

Claims (1)

[Claims] A thin metal film C is applied directly or via a thin metal film B to the other surface of a substrate made of a polymeric material on which a thin metal film A is formed on one surface, which is running along the circumferential side of a cylindrical can. When forming by a vacuum evaporation method, a film made of a polymeric material is layered and run on the metal thin film A side of the substrate, and a potential difference is created between the metal thin film A or the metal thin film C and the can. A method for producing a metal thin film, characterized by: