JPS59149637U

JPS59149637U - Microwave integrated circuit device

Info

Publication number: JPS59149637U
Application number: JP4224183U
Authority: JP
Inventors: 池水　洋
Original assignee: 日本電気株式会社
Priority date: 1983-03-24
Filing date: 1983-03-24
Publication date: 1984-10-06

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図Ａは従来のＭＩＣを示す平面図、第１図Ｂは第１
図Ａの断面図、第２図Ａ１第２図Ｂは従来技術のＭＩＣ
とプリント基板との取付状態を説明する断面図、第３図
は本考案の実施例のＭＩＣの平面図、第４図は本考案の
ＭＩＣの部分拡大した断面図、第５図は第３図のＭＩＣ
と基板とを詳細に示した断面図、第６図は本考案の他の
実施例のＭＩＣ部分を示す斜視図である。尚図において
、１・・・ＭＩＣ（マイクロ波集積回路装置）、２・・
・プリント基板、３・・・金具、４・・・ネジ、５，２
５・・・リード穴、６．１２・・・リード、７．７’　
・・・ガス状フ゛ラックス、１１・・・突起アース面、
１３・・・貫通穴、１５・・・入出力リード突起部、１
６・・・溝、２１・・・半田付面、２２・・・プリント
基板部品面、２３・・・プリント基板の回路パターン、
２４・・・プリント基板アース面。Ｆｙ４図　　　　　　　　　／１２とFigure 1A is a plan view showing a conventional MIC, and Figure 1B is a top view of a conventional MIC.
Cross-sectional view of Figure A, Figure 2 A1 Figure 2 B is the conventional MIC
FIG. 3 is a plan view of the MIC according to the embodiment of the present invention, FIG. 4 is a partially enlarged cross-sectional view of the MIC of the present invention, and FIG. 5 is the diagram shown in FIG. MIC of
FIG. 6 is a cross-sectional view showing the MIC portion and the substrate in detail, and FIG. 6 is a perspective view showing the MIC portion of another embodiment of the present invention. In the figure, 1...MIC (microwave integrated circuit device), 2...
・Printed circuit board, 3...Metal fittings, 4...Screws, 5,2
5...Lead hole, 6.12...Lead, 7.7'
...Gaseous flux, 11...Protruding ground surface,
13... Through hole, 15... Input/output lead protrusion, 1
6... Groove, 21... Soldering surface, 22... Printed circuit board component surface, 23... Circuit pattern of printed circuit board,
24...Printed circuit board ground surface. Fy4 diagram / 1 2 and

Claims

[Scope of utility model registration request]

In a microwave integrated circuit device having an input/output lead on a bottom surface, the bottom surface around the input/output lead protrudes from the other bottom surface, and the protruding portion has a shape orthogonal to the input/output lead. A microwave integrated circuit device characterized by having a through hole or groove.