JPS59148400A - チツプ部品の取付装置 - Google Patents
チツプ部品の取付装置Info
- Publication number
- JPS59148400A JPS59148400A JP58021613A JP2161383A JPS59148400A JP S59148400 A JPS59148400 A JP S59148400A JP 58021613 A JP58021613 A JP 58021613A JP 2161383 A JP2161383 A JP 2161383A JP S59148400 A JPS59148400 A JP S59148400A
- Authority
- JP
- Japan
- Prior art keywords
- shutter
- chip component
- chip
- hopper
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000037431 insertion Effects 0.000 description 14
- 238000003780 insertion Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58021613A JPS59148400A (ja) | 1983-02-14 | 1983-02-14 | チツプ部品の取付装置 |
| KR1019830003215A KR880000937B1 (ko) | 1983-02-14 | 1983-07-14 | 칩부품의 취부 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58021613A JPS59148400A (ja) | 1983-02-14 | 1983-02-14 | チツプ部品の取付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59148400A true JPS59148400A (ja) | 1984-08-25 |
| JPH0155598B2 JPH0155598B2 (cg-RX-API-DMAC7.html) | 1989-11-27 |
Family
ID=12059889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58021613A Granted JPS59148400A (ja) | 1983-02-14 | 1983-02-14 | チツプ部品の取付装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS59148400A (cg-RX-API-DMAC7.html) |
| KR (1) | KR880000937B1 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10178297A (ja) * | 1996-12-17 | 1998-06-30 | Taiyo Yuden Co Ltd | 部品供給装置の部品取込機構 |
| CN117092492A (zh) * | 2023-10-18 | 2023-11-21 | 深圳市芯盛智能信息有限公司 | 用于北斗导航芯片的元件插接组件 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57100797A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
| JPS57100798A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
| JPS57100800A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
| JPS57100799A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
| JPS57125566U (cg-RX-API-DMAC7.html) * | 1981-01-29 | 1982-08-05 |
-
1983
- 1983-02-14 JP JP58021613A patent/JPS59148400A/ja active Granted
- 1983-07-14 KR KR1019830003215A patent/KR880000937B1/ko not_active Expired
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57100797A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
| JPS57100798A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
| JPS57100800A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
| JPS57100799A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
| JPS57125566U (cg-RX-API-DMAC7.html) * | 1981-01-29 | 1982-08-05 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10178297A (ja) * | 1996-12-17 | 1998-06-30 | Taiyo Yuden Co Ltd | 部品供給装置の部品取込機構 |
| CN117092492A (zh) * | 2023-10-18 | 2023-11-21 | 深圳市芯盛智能信息有限公司 | 用于北斗导航芯片的元件插接组件 |
| CN117092492B (zh) * | 2023-10-18 | 2024-01-09 | 深圳市芯盛智能信息有限公司 | 用于北斗导航芯片的元件插接组件 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR880000937B1 (ko) | 1988-05-31 |
| JPH0155598B2 (cg-RX-API-DMAC7.html) | 1989-11-27 |
| KR840009195A (ko) | 1984-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4127432A (en) | Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same | |
| US4451324A (en) | Apparatus for placing chip type circuit elements on a board | |
| US20080156518A1 (en) | Alignment and cutting of microelectronic substrates | |
| JPH01143210A (ja) | 電子部品チップ保持治具および電子部品チップ取扱い方法 | |
| JPS59148400A (ja) | チツプ部品の取付装置 | |
| US4336872A (en) | Apparatus for transferring parts or the like | |
| US6045653A (en) | Glue deposit device for power printed circuit board | |
| CN100369536C (zh) | 制造具有三维半导体芯片阵列安装面的电路板的方法和装置 | |
| US6405895B1 (en) | Arranging and supplying apparatus | |
| JPH0658999B2 (ja) | チップ状電子部品マウント方法及び装置 | |
| KR850001169B1 (ko) | 칩부품의 취부장치 | |
| KR850001902Y1 (ko) | 칩 부품의 취부장치 | |
| US20050072715A1 (en) | Self aligning tray and carrier apparatus | |
| JP7385413B2 (ja) | 部品整列装置、部品整列プレートおよび部品整列プレートの製造方法 | |
| CN120283301A (zh) | 焊料体处理工具及利用其的焊料体处理方法 | |
| ES368965A1 (es) | Metodo y aparato para introducir un revestimiento tubular en un agujero de reccion transversal circular en una planchade circuito impreso. | |
| JPS6242560Y2 (cg-RX-API-DMAC7.html) | ||
| US6315024B1 (en) | Manual electronic-part mounting apparatus and method | |
| JPH0340520B2 (cg-RX-API-DMAC7.html) | ||
| US4376339A (en) | Method and apparatus for orienting integrated circuit clips and sockets and assembling them into connector contacts | |
| KR830000298B1 (ko) | 전자부품 장착방법 | |
| JP4420219B2 (ja) | 電子部品の梱包箱及び電子部品の収納・取り出し装置 | |
| JP2531900Y2 (ja) | プリント基板収納ラック | |
| CN117423649B (zh) | 一种芯片封装全自动植球机及其植球方法 | |
| JP7768181B2 (ja) | 電子部品の製造装置及び製造方法 |