JPS59145071U - IC land - Google Patents

IC land

Info

Publication number
JPS59145071U
JPS59145071U JP3946283U JP3946283U JPS59145071U JP S59145071 U JPS59145071 U JP S59145071U JP 3946283 U JP3946283 U JP 3946283U JP 3946283 U JP3946283 U JP 3946283U JP S59145071 U JPS59145071 U JP S59145071U
Authority
JP
Japan
Prior art keywords
land
recorded
board
electronic filing
divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3946283U
Other languages
Japanese (ja)
Inventor
保夫 高橋
田口 淳一郎
Original Assignee
日本ビクター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本ビクター株式会社 filed Critical 日本ビクター株式会社
Priority to JP3946283U priority Critical patent/JPS59145071U/en
Publication of JPS59145071U publication Critical patent/JPS59145071U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のIC用ランドの形状を示す図、第2図A
−Eは従来のランドへの半田の付着の様子を示す図、第
3図は本考案になるIC用ランドの形状を示す図、第4
図A−C本考案のランドへの半田の付着の様子を示す図
、第5図は半田がランドに付着する過程の様子を示す図
、第6図はガス抜けの様子を示す図である。 11・・・IC用ランド、12・・・基板、13・・・
半田。
Figure 1 shows the shape of a conventional IC land, Figure 2A
-E is a diagram showing how solder adheres to a conventional land, Figure 3 is a diagram showing the shape of an IC land according to the present invention, and Figure 4 is a diagram showing how solder adheres to a conventional land.
Figures A-C are diagrams showing how the solder adheres to the lands of the present invention, Figure 5 is a diagram showing how the solder adheres to the lands, and Figure 6 is a diagram showing how gas is released. 11... IC land, 12... Board, 13...
solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板に設ける長方形状のランドを長辺方向に少なくとせ
も2分割したIC用ランド。
An IC land in which a rectangular land provided on a board is divided into at least two parts in the long side direction.
JP3946283U 1983-03-18 1983-03-18 IC land Pending JPS59145071U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3946283U JPS59145071U (en) 1983-03-18 1983-03-18 IC land

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3946283U JPS59145071U (en) 1983-03-18 1983-03-18 IC land

Publications (1)

Publication Number Publication Date
JPS59145071U true JPS59145071U (en) 1984-09-28

Family

ID=30170107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3946283U Pending JPS59145071U (en) 1983-03-18 1983-03-18 IC land

Country Status (1)

Country Link
JP (1) JPS59145071U (en)

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