JPS59145038U - Chip parts supply device - Google Patents
Chip parts supply deviceInfo
- Publication number
- JPS59145038U JPS59145038U JP3884383U JP3884383U JPS59145038U JP S59145038 U JPS59145038 U JP S59145038U JP 3884383 U JP3884383 U JP 3884383U JP 3884383 U JP3884383 U JP 3884383U JP S59145038 U JPS59145038 U JP S59145038U
- Authority
- JP
- Japan
- Prior art keywords
- supply device
- parts supply
- chip parts
- chip components
- sealing tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、一般的なチップ部品の平面図、第２図は、チ
ップ部品収納テープの縦断面図、第３図は、この考案の
一実施例を示すチップ部品供給装置の要部概略構成図、
第４図はその要部斜視図である。
４．４．・・・チップ部品（７−７）、５，５．・・・
凹所、５ａ、 ５ａ、・・・凹所開口、６・・・テー
プ本体、７・・・封着テープ、１０・・・ガイド壁、１
２・・・スリット、Ａ・・・ワーク取り出し位置。FIG. 1 is a plan view of a typical chip component, FIG. 2 is a vertical cross-sectional view of a chip component storage tape, and FIG. 3 is a schematic configuration of the main parts of a chip component supply device showing an embodiment of this invention. figure,
FIG. 4 is a perspective view of the main part. 4.4. ...Chip parts (7-7), 5,5. ...
Recess, 5a, 5a... Recess opening, 6... Tape body, 7... Sealing tape, 10... Guide wall, 1
2...Slit, A...Workpiece take-out position.
Claims (1)
ーク収納凹所に収納し、凹所間ロヘ封着テープを封着し
て封入した収納テープより、チップ部品の固着基板等へ
前記封着テープを剥離してチップ部品を供給する装置に
おいて、ワーク取り出し位置に前記封着テープをしごい
て剥離するスリネトを有するガイド壁を設けたことを特
徴とするチップ部品供給装置。Chip components as workpieces are stored in a number of workpiece storage recesses provided in the tape body, and sealing tape is sealed between the recesses, and the sealing tape is applied to the substrate to which the chip components are fixed. What is claimed is: 1. A device for supplying chip components by peeling, characterized in that a guide wall having a slit for squeezing and peeling off the sealing tape is provided at a workpiece take-out position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3884383U JPS59145038U (en) | 1983-03-17 | 1983-03-17 | Chip parts supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3884383U JPS59145038U (en) | 1983-03-17 | 1983-03-17 | Chip parts supply device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59145038U true JPS59145038U (en) | 1984-09-28 |
Family
ID=30169509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3884383U Pending JPS59145038U (en) | 1983-03-17 | 1983-03-17 | Chip parts supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59145038U (en) |
-
1983
- 1983-03-17 JP JP3884383U patent/JPS59145038U/en active Pending
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