JPS59137188A - Ultrasonic welding method - Google Patents

Ultrasonic welding method

Info

Publication number
JPS59137188A
JPS59137188A JP989483A JP989483A JPS59137188A JP S59137188 A JPS59137188 A JP S59137188A JP 989483 A JP989483 A JP 989483A JP 989483 A JP989483 A JP 989483A JP S59137188 A JPS59137188 A JP S59137188A
Authority
JP
Japan
Prior art keywords
joining
materials
ultrasonic
softened
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP989483A
Other languages
Japanese (ja)
Inventor
Toshiaki Miyazaki
宮崎 俊秋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP989483A priority Critical patent/JPS59137188A/en
Publication of JPS59137188A publication Critical patent/JPS59137188A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE:To prevent formation of flash and to accomplish stably joining with high accuracy by forming the one friction area of joining materials smaller than the other friction area and subjecting the materials to ultrasonic welding. CONSTITUTION:Many pieces of ruggedness are provided by pressing, etc. on the surface to be joined of a joining material 8 which is harder or has a higher softening point than a joining material 7. The material 8 is fixed on an anvil 6, and the material 7 is superposed on the surface to be joined, then load is exerted thereon in the direction of an arrow 9. The high frequency current generated from an ultrasonic oscillator 1 is coverted to ultrasonic oscillation by an oscillator 2 and the oscillation is induced in the direction of an arrow 5 in a tip 4 via a horn 3 thereby subjecting the materials 7, 8 to friction press welding. The peak 8a in the projecting part on the top surface of the material 8 slides in contact with the material 7 and generates high heat. Said point is softened by said heat and the material 7 is softened as well as its temp. rises. The softened material flows into the space 10 in the recess thus forming the stable and secure joint surface along the rugged surface with good thermal efficiency without generating any flash.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は超音波溶接の信頼性向上並びに適用材料の範囲
を拡大を可能とする技術に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a technique that makes it possible to improve the reliability of ultrasonic welding and expand the range of applicable materials.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

金属材料などを接合する方法の一つとして、超音波溶接
法がある。従来の方法を第1図の溶接装置の構成図によ
り説明すると、超音波発振器1から発生する高周波電流
を振動子2にて超音波振動:二変換し、ホーン3を介し
てチップ4に振動を矢印5の方向に起すととも(−、チ
ップ4とアンビル6との間に接合材料7及び8をはさん
で荷重を矢印9の方向に加えて超音波振動で摩擦圧接す
るものである。このとき接合材料7とテップ4の間およ
び接合材F18とアンビル6の間で相対スベリな起こさ
ないようにすれば、接合材料7及び8間で摩擦発熱がお
こる。この発熱によって接合材料7及び8は局部的に高
温になり、材料の塑性流動が起こりやすくなるとともに
金属原子の相互拡散が起こりやすくなり接合材料間の固
相接合が行こなわれる。この際接合状態を左右する重要
な要件の一つとして接合材料7及び8の間の圧力がある
Ultrasonic welding is one of the methods for joining metal materials and the like. The conventional method will be explained with reference to the configuration diagram of a welding device shown in FIG. The joint material 7 and 8 are sandwiched between the tip 4 and the anvil 6, a load is applied in the direction of the arrow 9, and friction welding is performed using ultrasonic vibration. If relative slippage is prevented between the bonding material 7 and the step 4 and between the bonding material F18 and the anvil 6, frictional heat generation will occur between the bonding materials 7 and 8. Due to this heat generation, the bonding materials 7 and 8 will Localized high temperatures make it easier for plastic flow of the material to occur, as well as interdiffusion of metal atoms, resulting in solid-phase bonding between the bonding materials.One of the important requirements that influences the bonding state at this time. As such, there is a pressure between the bonding materials 7 and 8.

この圧力が小さすぎる場合は接合材料7及び8の接触部
全面の接合が得られ難く、接合強度のバラツキが大きい
。全面接合を得るには相互の面圧を大きくする必要があ
る。しかしながら血圧を大きくした場合接合材接合材料
7の接合面での摩擦による温度上昇により接触面での減
耗が大きく、ノ(すとなって接合材料7の周囲に)1ミ
出し、材料自体の損失の他、パリ取り作業等が必要とな
り実使用上の障害となる。また接合材料同志に硬度ある
いは軟化温度が異なる場合、軟らかい接合材料よりパリ
が大きくでる現象を生じる。さらに接合材料が大きくな
れば、必要な面圧を維持するため(二は、加振力が大き
くなり、当然振動子2の容量(二よって接合可能な材料
の大きさが制限される欠点があった。
If this pressure is too small, it will be difficult to bond the entire surface of the contact area between the bonding materials 7 and 8, and the bonding strength will vary greatly. To obtain full-surface bonding, it is necessary to increase the mutual surface pressure. However, when the blood pressure is increased, the wear of the contact surface is large due to the temperature rise due to friction at the joint surface of the joint material 7, and the leakage (around the joint material 7) is increased, resulting in loss of the material itself. In addition, deburring work, etc. is required, which poses an obstacle in actual use. Furthermore, if the hardness or softening temperature of the bonding materials differs, a phenomenon occurs in which the cracks are larger than those of the softer bonding materials. Furthermore, if the welding material becomes larger, the excitation force will increase in order to maintain the necessary surface pressure (2), and of course the capacity of the vibrator 2 (2) will limit the size of the material that can be welded. Ta.

〔発明の目的〕[Purpose of the invention]

本発明は上記(二鑑みなされたもので)(ν収りを必要
とせず、かつ接合強度にバラツキの少ない超音波溶接寸
法を提供することにある。
The present invention has been made in view of the above-mentioned considerations (2) and aims to provide ultrasonic welding dimensions that do not require ν convergence and have less variation in bonding strength.

〔発明の概要〕[Summary of the invention]

接合材料を超音波振動と圧力を加えて溶接するに際し、
接合材料の一方で硬度が高く、若しくは軟化温度が高い
側の表面に当接面積を他方より小さくするため凹凸を形
成して溶接時の面圧を高くして溶接効率を高y忌接部に
パリを発生させない超音波溶接方法。
When welding materials by applying ultrasonic vibration and pressure,
In order to make the contact area smaller than the other surface on the surface of the joining material, which has a higher hardness or a higher softening temperature, unevenness is formed to increase the surface pressure during welding and increase welding efficiency to the high y resistance contact area. Ultrasonic welding method that does not generate paris.

〔発明の実施例〕[Embodiments of the invention]

本発明につき一実施例の図面により説明する。 The present invention will be explained with reference to the drawings of one embodiment.

第2図は溶接要部の拡大断面図で、接合材料7よりも硬
い、又は軟化点の高い材料8の被接合面(=多数の凹凸
を設ける。この凹凸は工作性からプレス加工によるのが
よい。凹凸のピッチおよび凹部の底8bから凸部の頂点
8aの高さあるいは隣接する凸部により囲まれる空間1
0の大きさ、凸部の頂点8aの大きさ等凹凸の諸元は限
定しないが、期待する接合強度、バラツキの安定度、パ
リの発生量を勘案して決める。
Fig. 2 is an enlarged cross-sectional view of the main part of the weld, and shows the surface to be joined of a material 8 which is harder than the joining material 7 or has a higher softening point (= many irregularities are provided. From the viewpoint of workability, these irregularities are formed by press working. Good. The pitch of the unevenness and the height from the bottom 8b of the concave part to the apex 8a of the convex part or the space 1 surrounded by the adjacent convex parts
The specifications of the unevenness, such as the size of the 0 and the size of the apex 8a of the convex portion, are not limited, but are determined by taking into consideration the expected bonding strength, stability of variation, and amount of paris.

次に本発明の溶接過程を説明する。チップ4を加圧し、
超音波入力によりホーン3の振動を開始すると接合材料
7と接合材料8の凸部の頂点8aが摩擦を開始し、その
接触部は発熱する。この発熱現象が急峻である程熱放散
時間が少なく接触部の温度上昇が局部的であると同時に
より高温になる。
Next, the welding process of the present invention will be explained. Pressurize the chip 4,
When the horn 3 starts to vibrate due to ultrasonic input, the apexes 8a of the convex portions of the bonding material 7 and the bonding material 8 begin to rub, and the contact portion generates heat. The steeper this heat generation phenomenon is, the less time there is for heat dissipation, and the temperature rise at the contact portion is localized and at the same time becomes higher.

このため接合材料7と接合材料8の頂点8aの小さな接
触面積のみで接触するため、ホーン3により伝えられた
超音波エネルギーの接合材料8の頂点8aと対応する接
合材料7の接触面への入熱密度は、従来よりも大きくな
り発熱はその小さな接触部に集中し、頂点8aと接合材
料7の相対する接触摺動部は従来より急速に温度が上昇
し、より高い温度に至る。この時接合材料8の頂点8a
の方が接合材料7の摩擦部より高温に成り、接合材$4
7とともにそれより高い軟化点をもつ接合材料8も頂点
8aにおいて軟化に至る。この熱の集中効果(二より超
音波加振入力が継続されるにつれ頂点8aから急速に接
合材料8の凸部全般に軟化が進行し接合部材7と接合材
料8とが接合される。この進行の際接合材料8より低い
軟化点をもつ接合材料7は接合材料8の谷部に流れ込み
接合材料8の凹凸に沿った接合部を形成する。凹凸の接
合部は接合境界面が従来の平面境界面に比べ大きいため
、強度の絶対値も大きな値が得られる。高熱効率のため
材料全体の温度上昇は小さ〈従来よりも材料の圧縮量は
小さい。軟化点の低い接合材料は軟化点の高い接合材ネ
4の凹部へ流れ込み相対的に従来の方法よりもパリとし
て接合部以外へ流出する量が少い利点を有する。また熱
効率が良いことから溶接装置が同じならば材質が同じで
あれば熱効率のアンプ分だけ大きな接触面積が接合可能
であるし、厚い板め溶接が可能である。また、溶接材料
の大きさが同じならばより高い温度を要する材料の溶接
が可能となる。
Therefore, since the bonding material 7 and the bonding material 8 are in contact with each other only through a small contact area of the apex 8a, the ultrasonic energy transmitted by the horn 3 is input to the contact surface of the bonding material 7 corresponding to the apex 8a of the bonding material 8. The heat density is greater than in the past, and heat generation is concentrated in the small contact area, and the temperature of the opposing sliding contact area between the apex 8a and the bonding material 7 rises more rapidly than in the past, reaching a higher temperature. At this time, the vertex 8a of the joining material 8
becomes hotter than the friction part of the bonding material 7, and the bonding material $4
7 as well as the bonding material 8, which has a higher softening point, also softens at the apex 8a. As the ultrasonic excitation input continues, the convex portion of the bonding material 8 rapidly softens from the apex 8a, and the bonding member 7 and the bonding material 8 are bonded. At this time, the bonding material 7, which has a softening point lower than that of the bonding material 8, flows into the valleys of the bonding material 8 and forms a bond along the unevenness of the bonding material 8.In the uneven bonding, the bonding interface is different from the conventional planar boundary. Since it is larger than the surface, a large absolute value of strength can be obtained.The temperature rise of the entire material is small due to high thermal efficiency.The amount of compression of the material is smaller than before.Bonding materials with a low softening point have a high softening point. The welding material flows into the concave part of the welding material 4 and has the advantage that the amount flowing out outside the joint is relatively smaller than that of the conventional method.Also, it has good thermal efficiency, so if the welding equipment is the same and the material is the same, It is possible to weld a larger contact area by the amplifier of thermal efficiency, and it is possible to weld thick plates.Also, if the size of the welding material is the same, it is possible to weld materials that require a higher temperature.

なお、他の変形例として第3図は凹凸をリング状;二第
4図はゴバン目状突起としたもので上記と同様の効果が
得られる。
In addition, as other modified examples, FIG. 3 shows the unevenness in a ring shape, and FIG.

〔発明の効果〕〔Effect of the invention〕

以上本発明によれば、従来困難であった硬度の異なる材
料の接合も容易に可能となるほか、パリの少ない溶接を
行こなうことが出来る。また超音波溶接装置の能力が拡
大活用される効果がある。
As described above, according to the present invention, it is now possible to easily join materials with different hardnesses, which has been difficult in the past, and it is also possible to perform welding with less flash. It also has the effect of expanding the capabilities of ultrasonic welding equipment.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の超音波溶接装置の構成図、第2図は本発
明の一実施例を示す溶接要部拡大断面図、第3図および
第4図は本発明の他の変形例を示す突起部平面図である
。 1・・・超音波発振器   2・・・振動子3・・・ホ
ーン      4・・・テップ5・・・振動方向  
   6・・・アンビル7.8・・・接合材料   8
a・・・凹部の頂点8b・・・突部の底部    9・
・・加圧方向10・・・空間。
Fig. 1 is a configuration diagram of a conventional ultrasonic welding device, Fig. 2 is an enlarged cross-sectional view of the main welding part showing one embodiment of the present invention, and Figs. 3 and 4 show other modifications of the present invention. FIG. 3 is a plan view of a protrusion. 1... Ultrasonic oscillator 2... Vibrator 3... Horn 4... Step 5... Vibration direction
6...Anvil 7.8...Joining material 8
a...Apex of the recess 8b...Bottom of the protrusion 9.
...Pressure direction 10...Space.

Claims (2)

【特許請求の範囲】[Claims] (1)接合材料に超音波振動を励起して、接合材料間の
局部発熱によって接合を行う際、接合材料の一方の摩擦
面積が他方の摩擦面積より小さくしたことを特徴とする
超音波溶接方法。
(1) An ultrasonic welding method characterized in that when joining is performed by local heat generation between the joining materials by exciting ultrasonic vibrations in the joining materials, the friction area of one side of the joining materials is made smaller than the friction area of the other. .
(2)接合材料の軟化温度の高い側若しくは硬度の高い
側の接合材料の摩擦面に摩擦面積が小さくなるよう調整
した特許請求の範囲第1項記載の超音波溶接方法。
(2) The ultrasonic welding method according to claim 1, wherein the friction area is adjusted to be smaller on the friction surface of the joining material on the side where the softening temperature of the joining material is higher or the side where the joining material is higher in hardness.
JP989483A 1983-01-26 1983-01-26 Ultrasonic welding method Pending JPS59137188A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP989483A JPS59137188A (en) 1983-01-26 1983-01-26 Ultrasonic welding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP989483A JPS59137188A (en) 1983-01-26 1983-01-26 Ultrasonic welding method

Publications (1)

Publication Number Publication Date
JPS59137188A true JPS59137188A (en) 1984-08-07

Family

ID=11732829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP989483A Pending JPS59137188A (en) 1983-01-26 1983-01-26 Ultrasonic welding method

Country Status (1)

Country Link
JP (1) JPS59137188A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013000792A (en) * 2011-06-21 2013-01-07 Seidensha Electronics Co Ltd Ultrasonic metal joining method, and ultrasonic metal joining device
JP2016034656A (en) * 2014-08-01 2016-03-17 株式会社アドウェルズ Face joining method
CN109249123A (en) * 2018-09-25 2019-01-22 苏州英威腾电力电子有限公司 Automatic seeking frequency method and automatic seeking frequency device
JP2020131229A (en) * 2019-02-18 2020-08-31 株式会社アルテクス Metal joining method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013000792A (en) * 2011-06-21 2013-01-07 Seidensha Electronics Co Ltd Ultrasonic metal joining method, and ultrasonic metal joining device
JP2016034656A (en) * 2014-08-01 2016-03-17 株式会社アドウェルズ Face joining method
CN109249123A (en) * 2018-09-25 2019-01-22 苏州英威腾电力电子有限公司 Automatic seeking frequency method and automatic seeking frequency device
CN109249123B (en) * 2018-09-25 2020-10-20 苏州英威腾电力电子有限公司 Automatic frequency searching method and automatic frequency searching device
JP2020131229A (en) * 2019-02-18 2020-08-31 株式会社アルテクス Metal joining method

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