JP4274885B2 - Ultrasonic bonding apparatus and ultrasonic bonding method - Google Patents

Ultrasonic bonding apparatus and ultrasonic bonding method Download PDF

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JP4274885B2
JP4274885B2 JP2003327313A JP2003327313A JP4274885B2 JP 4274885 B2 JP4274885 B2 JP 4274885B2 JP 2003327313 A JP2003327313 A JP 2003327313A JP 2003327313 A JP2003327313 A JP 2003327313A JP 4274885 B2 JP4274885 B2 JP 4274885B2
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groove
horn
ultrasonic bonding
vibration direction
bonding apparatus
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良裕 加柴
浩明 前田
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Mitsubishi Electric Corp
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本発明は、超音波振動によって電気部品の金属端子などを重ね合わせて接合する超音波接合装置に関し、特に、超音波接合装置に含まれるホーンの構造に関する。   The present invention relates to an ultrasonic bonding apparatus that superimposes and joins metal terminals and the like of electrical components by ultrasonic vibration, and particularly relates to a structure of a horn included in the ultrasonic bonding apparatus.

従来の超音波振動接合装置では、基材をアルビン上に載せて固定し、その上に被接合材を載置する。更に、被接合材の上にホーンを下降させ、載置させる。ホーンは、基材に対して被接合材を押圧しながら、所定の周波数で被接合材を水平方向に超音波振動させる。
この結果、基材と被接合材の接合面は押圧と超音波振動による摺動が相まって、金属表面の酸化物やその他の汚れが除去される。更に、摩擦発熱により材料の塑性流動が起き易くなり、接合面積の拡大とともに金属原子間で接合が行われる。
In a conventional ultrasonic vibration bonding apparatus, a base material is mounted on an albin and fixed, and a material to be bonded is mounted thereon. Further, the horn is lowered and placed on the material to be joined. The horn ultrasonically vibrates the material to be bonded at a predetermined frequency while pressing the material to be bonded against the base material.
As a result, the joining surface of the base material and the material to be joined is combined with pressing and sliding due to ultrasonic vibration to remove oxides and other dirt on the metal surface. Furthermore, the plastic flow of the material is likely to occur due to frictional heat generation, and bonding is performed between metal atoms as the bonding area increases.

かかる超音波接合装置では、ホーンの振動を被接合材に滑りを起こすことなく伝えるために、ホーンの加圧面には複数の角錐状の突起部が形成されている。接合工程においては、被接合材の表面にホーンの突起部が食い込み、ホーンに対して被接合材を固定する。しかし、突起部が被接合材を削ることにより、突起部と被接合材との間の空隙でバリが発生するという問題があった。   In such an ultrasonic bonding apparatus, a plurality of pyramidal projections are formed on the pressing surface of the horn in order to transmit the vibration of the horn to the material to be bonded without causing slippage. In the joining step, the projection of the horn bites into the surface of the material to be joined, and the material to be joined is fixed to the horn. However, there is a problem that burrs are generated in the gap between the protrusion and the material to be bonded by the protrusions shaving the material to be bonded.

これに対して、ホーンの突起部(凹凸部)の谷と被接合材との間の空隙が無くなるまで、被接合材に対してホーンを押圧し、空隙内のバリを潰す方法が提案されている。即ち、ホーンの突起部が被接合材に深く食い込み、空隙が無くなることにより、被接合材の表面に形成される多くのバリは、ホーンと被接合材の間に押し潰されて被接合材と再度接合する(例えば、特許文献1参照)。
特開平4−99307号公報
On the other hand, a method has been proposed in which the horn is pressed against the material to be joined until there is no space between the valley of the projection (uneven portion) of the horn and the material to be joined, and the burrs in the space are crushed. Yes. That is, since the protrusion of the horn deeply penetrates the material to be joined and the gap is eliminated, many burrs formed on the surface of the material to be joined are crushed between the horn and the material to be joined and It joins again (for example, refer to patent documents 1).
Japanese Patent Laid-Open No. 4-99307

しかしながら、ホーンと被接合材の間に空隙がなくなった状態で、接合工程を停止することは困難であり、更に、ホーンの押圧が続いた場合、押し潰されたバリはホーンの外周部に押し出され、ホーンの外周部でバリを形成する。特に、被接合材の厚さや硬度のばらつきにより、ホーンの食い込み量が場所によりばらつくため、かかるバリの発生の防止は非常に困難であった。   However, it is difficult to stop the joining process when there is no gap between the horn and the material to be joined, and when the horn continues to be pressed, the crushed burrs are pushed out to the outer periphery of the horn. Then, burrs are formed on the outer periphery of the horn. In particular, since the amount of bite of the horn varies depending on the location due to variations in the thickness and hardness of the materials to be joined, it is very difficult to prevent the occurrence of such burrs.

そこで、本発明は、超音波接合におけるバリの発生、特にホーン外周部におけるバリの発生を防止したホーン、該ホーンを含む超音波接合装置、及び超音波接合方法の提供を目的とする。   Accordingly, an object of the present invention is to provide a horn that prevents generation of burrs in ultrasonic bonding, particularly generation of burrs in the outer periphery of the horn, an ultrasonic bonding apparatus including the horn, and an ultrasonic bonding method.

本発明は、ホーンとアンビルとを含み、ホーンがアンビルに載置された基材に対して被接合材を1つの振動方向に振動させる超音波接合装置であって、ホーンは、被接合材を加圧する加圧面を有し、振動方向に振動するホーン基部と、加圧面に含まれる第1方向に沿って設けられた複数の第1溝部と、加圧面に含まれる第2方向に沿って設けられた複数の第2溝部と、第1溝部と第2溝部に挟まれた加圧面に設けられた突起部とを含み、第1溝部と振動方向との間の角度が、第2溝部と振動方向との間の角度より大きく、かつ第1溝部の溝幅が第2溝部の溝幅より大きいことを特徴とする超音波接合装置である。第1溝部と振動方向との間の角度が、第2溝部と振動方向との間の角度より大きく、かつ第1溝部の深さが第2溝部の深さより大きくても良い。
ここで、第1溝部と振動方向との間の角度が、第2溝部と振動方向との間の角度より大きいとは、第1溝部が第2溝部より、より振動方向に対して垂直に近い方向に形成されていることをいう。
The present invention is an ultrasonic bonding apparatus that includes a horn and an anvil, and the horn vibrates a material to be bonded in one vibration direction with respect to a substrate placed on the anvil. A horn base that has a pressure surface to be pressurized and vibrates in a vibration direction, a plurality of first grooves provided along a first direction included in the pressure surface, and a second direction included in the pressure surface. A plurality of second groove portions and a protrusion provided on the pressure surface sandwiched between the first groove portion and the second groove portion, and the angle between the first groove portion and the vibration direction is different from that of the second groove portion and the vibration direction. The ultrasonic bonding apparatus is characterized in that the groove width of the first groove portion is larger than the angle between the first groove portion and the second groove portion. The angle between the first groove and the vibration direction may be larger than the angle between the second groove and the vibration direction, and the depth of the first groove may be larger than the depth of the second groove.
Here, the angle between the first groove portion and the vibration direction being larger than the angle between the second groove portion and the vibration direction means that the first groove portion is closer to the vibration direction than the second groove portion. It is formed in the direction.

本発明にホーンを用いた超音波接合では、加圧面外周部でのバリの発生を防止できる。このため、バリの除去工程が不要となり、製造工程及び製造コストの削減が可能となる。   In the ultrasonic bonding using the horn in the present invention, it is possible to prevent the occurrence of burrs at the outer peripheral portion of the pressing surface. For this reason, the burr removal process is not required, and the manufacturing process and manufacturing cost can be reduced.

図1は、全体が100で表される、本実施の形態にかかるホーンの概略図である。図1に示すように、ホーン100は、ホーン基部1の上面が加圧面(図2では、下方が加圧面)10となっている。加圧面10には、被接合材(図2の符号20)との滑りを防止するために、碁盤目(マトリックス)状に、縦溝2(y軸方向)と横溝3(x軸方向)が形成されている。また、縦溝2と横溝3に囲まれるように、複数の角錐状の突起部4が形成されている。
後述するように、ヘッド100の振動方向は、横溝方向(x軸方向)とする。また、突起部4の高さは、接合に必要な被接合材への突起部4の食い込み深さと、発生するバリの厚みとを勘案して決める。
FIG. 1 is a schematic diagram of a horn according to the present embodiment, the whole being represented by 100. As shown in FIG. 1, in the horn 100, the upper surface of the horn base 1 is a pressure surface (in FIG. 2, the lower surface is a pressure surface) 10. The pressurizing surface 10 has a vertical groove 2 (y-axis direction) and a horizontal groove 3 (x-axis direction) in a grid pattern (matrix) to prevent slippage with the material to be joined (reference numeral 20 in FIG. 2). Is formed. A plurality of pyramidal projections 4 are formed so as to be surrounded by the vertical grooves 2 and the horizontal grooves 3.
As will be described later, the vibration direction of the head 100 is the transverse groove direction (x-axis direction). The height of the protrusion 4 is determined in consideration of the depth of protrusion of the protrusion 4 into the material to be joined necessary for bonding and the thickness of the generated burr.

本実施の形態にかかるホーン100では、超音波振動方向30に対して垂直な方向(y軸方向)の縦溝2の幅が、従来構造より広くなっている。
ここで、縦溝2の幅とは、隣接する突起部4の間隔をいい、換言すれば、隣接する突起部4の間に設けられた平坦部の幅をいう(図1において「W」で表示)。
In the horn 100 according to this embodiment, the width of the longitudinal groove 2 in the direction (y-axis direction) perpendicular to the ultrasonic vibration direction 30 is wider than that of the conventional structure.
Here, the width of the vertical groove 2 refers to the interval between the adjacent protrusions 4, in other words, the width of the flat portion provided between the adjacent protrusions 4 (in FIG. 1, “W”). display).

図2は、全体が500で表される、ホーン100が組み込まれた超音波接合装置の概略図である。超音波接合装置はホーン100とアンビル150を含む。ホーン100は、加圧面10が下向きとなるように配置される。
アンビル150に上面にも、ホーン100の加圧面10と同様に、複数の角錐状の突起部151が設けられている。
FIG. 2 is a schematic view of an ultrasonic bonding apparatus incorporating the horn 100, which is represented as a whole by 500. The ultrasonic bonding apparatus includes a horn 100 and an anvil 150. The horn 100 is disposed so that the pressure surface 10 faces downward.
Similar to the pressing surface 10 of the horn 100, a plurality of pyramidal projections 151 are provided on the upper surface of the anvil 150.

超音波接合装置500では、アンビル150の上に、接合させる2つの被接合材20、基材21を載置し、その上にホーン100が載せられる。基材21にはアンビル150の突起部151が食い込んで、アンビル150に対して基材21を固定する。
一方、被接合材20にはホーン100の突起部4が食い込んで、ホーン100に対して被接合材20を固定する。
ホーン100で被接合材20、基材21をアンビル150の方向に加圧しながら、ホーン100が矢印30の方向に、例えば数10kHzの周波数で超音波振動する。これにより、被接合材20、基材21の表面酸化物やその他の汚れが除去される。更に、摩擦発熱により、被接合材20、基材21の塑性流動が起き易くなり、接合面積の拡大とともに接合が行われる。
In the ultrasonic bonding apparatus 500, the two materials to be bonded 20 and the base material 21 are placed on the anvil 150, and the horn 100 is placed thereon. The protrusion 151 of the anvil 150 bites into the base material 21 and fixes the base material 21 to the anvil 150.
On the other hand, the protrusion 4 of the horn 100 bites into the material to be bonded 20 to fix the material 20 to be bonded to the horn 100.
The horn 100 is ultrasonically vibrated at a frequency of, for example, several tens of kHz in the direction of the arrow 30 while the horn 100 pressurizes the workpiece 20 and the base material 21 in the direction of the anvil 150. Thereby, the surface oxide and other dirt of the material 20 and the base material 21 are removed. Further, the frictional heat generation facilitates plastic flow of the material to be bonded 20 and the base material 21, and the bonding is performed with the expansion of the bonding area.

図3は、超音波接合装置500を用いた接合工程を示す概略図である。図3において、縦溝2の幅をW、深さをHとする。
まず、図3(a)に示すように、アンビル(図示せず)上に被接合材20、基材21をセットする。かかる工程では、アンビル上に載置されたその上にホーン100を下降させる。図3(a)は、突起部4の先端を被接合材20に当接させた状態である。
FIG. 3 is a schematic diagram illustrating a bonding process using the ultrasonic bonding apparatus 500. In FIG. 3, the width of the vertical groove 2 is W and the depth is H.
First, as shown to Fig.3 (a), the to-be-joined material 20 and the base material 21 are set on an anvil (not shown). In this step, the horn 100 is lowered on the anvil placed thereon. FIG. 3A shows a state in which the tip of the protrusion 4 is in contact with the material to be joined 20.

図3(b)は、超音波接合中の概略図である。ホーン100により、被接合材20を基材21に対して押圧する。更に、ホーン100を矢印30の方向に超音波振動させる。周波数は、例えば数10kHzである。
これにより、被接合材20と基材21との接合面同士が摺れて、接合面を覆っている酸化膜等の、接合を阻害する膜等が除去される。被接合材20の上面には、ホーン100の突起部4が食い込んでいる。被接合材20は、突起部4の食い込みにより塑性変形し、バリが発生する前の状態にある。
FIG. 3B is a schematic view during ultrasonic bonding. The workpiece 20 is pressed against the base material 21 by the horn 100. Further, the horn 100 is ultrasonically vibrated in the direction of the arrow 30. The frequency is, for example, several tens of kHz.
As a result, the bonding surfaces of the material to be bonded 20 and the base material 21 are slid to remove a film or the like that hinders bonding, such as an oxide film covering the bonding surface. The protrusion 4 of the horn 100 bites into the upper surface of the material 20 to be joined. The material to be joined 20 is in a state before it is plastically deformed by the biting of the protrusions 4 and burrs are generated.

図3(c)は、超音波接合が終了した段階の概略図である。基材21と被接合材20とは、超音波振動により接触面が溶融し、接合されている。突起部4は、更に被接合材20に食い込んだ状態となっている。   FIG. 3C is a schematic diagram at a stage where ultrasonic bonding is completed. The contact surface of the base material 21 and the material to be joined 20 is melted and joined by ultrasonic vibration. The protrusion 4 is in a state of further biting into the material 20 to be joined.

ここで、比較のために、図4に、全体が200で表される従来構造のホーンの斜視図を示す。ホーン基部201は、互いに略直交する縦溝202と横溝203とを有する。また、縦溝202と横溝203に挟まれた部分に、複数の、角錐状の突起部204を含む。   Here, for comparison, FIG. 4 shows a perspective view of a horn having a conventional structure, which is generally indicated by 200. The horn base 201 has a vertical groove 202 and a horizontal groove 203 that are substantially orthogonal to each other. In addition, a plurality of pyramidal projections 204 are included in a portion sandwiched between the vertical groove 202 and the horizontal groove 203.

また、図5は、従来構造のホーン200を用いて超音波接合を行なった場合の、接合工程の概略図であり、図5(a)(b)(c)は、それぞれ図3(a)(b)(c)に相当する工程を示す。   FIG. 5 is a schematic view of a bonding process when ultrasonic bonding is performed using a horn 200 having a conventional structure. FIGS. 5 (a), 5 (b), and 5 (c) are respectively shown in FIG. 3 (a). Steps corresponding to (b) and (c) are shown.

従来のホーン200では、ホーン200の突起部204への被接合材20の食い込みが進み、縦溝202が被接合材20で埋まった時点で、被接合材が主にy軸方向(紙面に垂直な方向)に、ホーン200の外周部に押し出されて、バリ205が発生していた。なお、ここでは、y軸方向に突出したバリは省略し、x軸方向に突出したバリのみ示すこととする。
バリ205の量は、突起部204が被接合材20に食い込む程増加する。ホーン200の突起部204がすべて被接合材20に食い込むと、被接合材20の先端部は、ホーン200と被接合材20との間に留まることができず、被接合材20と突起部204によって形成される、縦溝202の底部の隙間を通って、ホーン200の外周部に押し出されてバリ205となる。
In the conventional horn 200, when the material to be bonded 20 bites into the protrusion 204 of the horn 200 and the longitudinal groove 202 is filled with the material to be bonded 20, the material to be bonded is mainly in the y-axis direction (perpendicular to the paper surface). In other directions, the burr 205 was generated by being pushed out to the outer peripheral portion of the horn 200. Here, burrs protruding in the y-axis direction are omitted, and only burrs protruding in the x-axis direction are shown.
The amount of the burr 205 increases as the protrusion 204 bites into the material 20 to be joined. When all the projections 204 of the horn 200 bite into the material to be joined 20, the tip of the material to be joined 20 cannot stay between the horn 200 and the material to be joined 20, and the material to be joined 20 and the projections 204. The burrs 205 are formed by being pushed out to the outer peripheral portion of the horn 200 through the gap formed at the bottom of the vertical groove 202.

発生したバリについて詳細に観察したところ、バリは、主に、超音波振動の振動方向に対して垂直な方向に発生していることがわかった。
即ち、超音波振動の振動方向に対して垂直方向の溝の幅が例えば0.2mmであり、超音波の振幅量が0.05mmとすると、超音波の振動毎に、溝の幅が、実質的に0.2mmから0.15mmに変化している。このため、溝の幅が狭くなって押された分だけ、振動方向に対して垂直方向に金属の塑性流動が発生し、これがバリとなると考えられる。
When the generated burr was observed in detail, it was found that the burr was mainly generated in a direction perpendicular to the vibration direction of the ultrasonic vibration.
That is, when the width of the groove perpendicular to the vibration direction of the ultrasonic vibration is 0.2 mm and the amplitude amount of the ultrasonic wave is 0.05 mm, the groove width is substantially equal for each ultrasonic vibration. In particular, it is changed from 0.2 mm to 0.15 mm. For this reason, it is considered that a metal plastic flow is generated in the direction perpendicular to the vibration direction by the amount pushed by the narrow width of the groove, which becomes a burr.

これに対して、本発明にかかるホーン100では、上述のように、振動方向に対して垂直な方向(図1のy軸方向)の縦溝2の幅を広くしている。例えば、縦溝2の幅が、従来の2倍である0.4mmとなっている。この場合、超音波振動の振幅量が0.05mmであれば、バリとなる塑性流動の速度は、従来の半分程度となる。   On the other hand, in the horn 100 according to the present invention, as described above, the width of the vertical groove 2 in the direction perpendicular to the vibration direction (the y-axis direction in FIG. 1) is increased. For example, the width of the vertical groove 2 is 0.4 mm, which is twice the conventional width. In this case, if the amplitude amount of the ultrasonic vibration is 0.05 mm, the speed of the plastic flow that becomes a burr becomes about half of the conventional speed.

図6は、ホーン100の縦溝2の幅(W)と、かかるホーン100を用いた場合に発生するバリの数との関係である。図6から明らかなように、縦溝2、横溝3の溝幅が共に0.2mmの場合、発生したバリの数は12個であるが、縦溝2の幅を0.3mmより大きくすることにより、バリの発生を殆ど0にできる。即ち、振動方向に垂直な方向の縦溝2の幅を広くすることによって、バリの発生が防止できる。なお、図6では、横溝3の幅は、0.2mmで一定とする。
ただし、横溝2の幅が大きくなれば、逆に、超音波接合中の被接合材20の固定が不充分となり、被接合材20と基材21と接合強度が低下することもわかった。
従って、接合強度を考慮すると、突起部4のピッチに対して、縦溝2の幅をピッチの1/2以下とすることが好ましい。
FIG. 6 shows the relationship between the width (W) of the longitudinal groove 2 of the horn 100 and the number of burrs generated when the horn 100 is used. As is apparent from FIG. 6, when both the vertical groove 2 and the horizontal groove 3 have a width of 0.2 mm, the number of burrs generated is 12, but the width of the vertical groove 2 should be larger than 0.3 mm. As a result, the generation of burrs can be made almost zero. That is, the generation of burrs can be prevented by increasing the width of the longitudinal groove 2 in the direction perpendicular to the vibration direction. In FIG. 6, the width of the lateral groove 3 is constant at 0.2 mm.
However, it has also been found that when the width of the lateral groove 2 is increased, the material to be bonded 20 is not sufficiently fixed during ultrasonic bonding, and the bonding strength between the material to be bonded 20 and the base material 21 is decreased.
Therefore, considering the bonding strength, it is preferable that the width of the vertical groove 2 is set to ½ or less of the pitch with respect to the pitch of the protrusions 4.

このように、本実施の形態にかかる超音波接合装置500では、超音波振動の振動方向に対して、垂直な縦溝2の幅を、横溝3の幅より広くすることにより、バリの発生を抑えることができる。このため、接合工程において、バリを取り除くための作業工数を減らすことができ、製造コストの削減が可能となる。   Thus, in the ultrasonic bonding apparatus 500 according to the present embodiment, the width of the vertical groove 2 perpendicular to the vibration direction of the ultrasonic vibration is made wider than the width of the horizontal groove 3, thereby generating burrs. Can be suppressed. For this reason, in the joining process, the number of work steps for removing burrs can be reduced, and the manufacturing cost can be reduced.

本実施の形態では、ホーン100の加圧面10に、碁盤目状に角錐状の突起部4を形成したが、振動方向に直交する方向のみ溝(図1では縦溝2)を形成しても良い。また、縦溝2と横溝3とが斜めに交差するように、綾目状に配置してもよい。ただし、振動方向に対する溝の形成方向の角度(例えば、図1では、振動方向(x軸方向)と縦溝2の形成方向との間の角度)が0度に近づくほど、バリ発生防止効果は小さくなる。従って、突起部4の形状としては、三角錐や円錐形状より角錐形状が好ましい。   In this embodiment, the pyramid-shaped projection 4 is formed on the pressure surface 10 of the horn 100 in a grid pattern, but even if a groove (vertical groove 2 in FIG. 1) is formed only in the direction orthogonal to the vibration direction. good. Moreover, you may arrange | position in a twill shape so that the vertical groove 2 and the horizontal groove 3 may cross | intersect diagonally. However, as the angle of the groove formation direction with respect to the vibration direction (for example, the angle between the vibration direction (x-axis direction) and the formation direction of the vertical groove 2 in FIG. 1) approaches 0 degrees, the effect of preventing burr generation is greater. Get smaller. Therefore, the shape of the protrusion 4 is preferably a pyramid shape rather than a triangular pyramid or a cone shape.

なお、ここでは、縦溝2の溝幅を変える場合について説明したが、縦溝2の深さを深くしても同様の効果が得られる。即ち、縦溝2を横溝3より深くすることにより、縦溝2中からホーン100の外周部に押し出される被接合材20をなくし、バリの発生を防止できる。   Here, the case of changing the groove width of the vertical groove 2 has been described, but the same effect can be obtained even if the depth of the vertical groove 2 is increased. That is, by making the vertical groove 2 deeper than the horizontal groove 3, it is possible to eliminate the material to be bonded 20 pushed out from the vertical groove 2 to the outer peripheral portion of the horn 100, and to prevent the generation of burrs.

実施の形態2.
図7は、全体が110で表される、本実施の形態にかかるホーンの概略図である。ホーン110は、上述のホーン100とほぼ同じ形状であり、ホーン基部11の先端に、角錐形状の突起部14が複数設けられている。突起部14の間には、略直行する方向に、縦溝2A〜2Fと横溝(図示せず)とが設けられている。ホーン110の振動方向は、縦溝1A等に対して略直交する方向(図7の横方向)である。
Embodiment 2. FIG.
FIG. 7 is a schematic view of the horn according to the present embodiment, the whole being represented by 110. The horn 110 has substantially the same shape as the horn 100 described above, and a plurality of pyramidal projections 14 are provided at the tip of the horn base 11. Between the protrusions 14, longitudinal grooves 2 </ b> A to 2 </ b> F and lateral grooves (not shown) are provided in a substantially perpendicular direction. The vibration direction of the horn 110 is a direction substantially perpendicular to the longitudinal groove 1A and the like (lateral direction in FIG. 7).

ホーン110では、突起部14の先端は略同一平面内にある。
また、縦溝2Cの底面と縦溝2Dの底面とを含む平面を符号40で表す。同様に、縦溝2A、2B、2Cの底面を含む平面、縦溝2D、2E、2Fの底面を含む平面を、それぞれ符号42、41で表す。図7から分かるように、平面40は、突起部14の先端を含む平面と略平行である一方、平面41及び平面42は、平面40に対して所定の角度で傾斜している。即ち、縦溝2C、2Dは同じ深さであるが、両側に行くほど縦溝が深くなっている。
In the horn 110, the tip of the protrusion 14 is in substantially the same plane.
A plane including the bottom surface of the vertical groove 2C and the bottom surface of the vertical groove 2D is denoted by reference numeral 40. Similarly, a plane including the bottom surfaces of the vertical grooves 2A, 2B, and 2C and a plane including the bottom surfaces of the vertical grooves 2D, 2E, and 2F are denoted by reference numerals 42 and 41, respectively. As can be seen from FIG. 7, the plane 40 is substantially parallel to the plane including the tip of the protrusion 14, while the plane 41 and the plane 42 are inclined at a predetermined angle with respect to the plane 40. That is, the vertical grooves 2C and 2D have the same depth, but the vertical grooves become deeper toward the both sides.

図8は、本実施の形態にかかる超音波接合工程の概略図である。本実施の形態にかかるホーン110を用いて超音波接合を行なった場合、図3の工程と同じように接合工程が進む。しかしながら、周囲の縦溝2A、2B、2E、2Fが中央の縦溝2C、2Dより深くなっているため、図8(c)に示すように、縦溝が被接合材で埋められることによるバリの発生を低減できる。   FIG. 8 is a schematic diagram of an ultrasonic bonding process according to the present embodiment. When ultrasonic bonding is performed using the horn 110 according to the present embodiment, the bonding process proceeds in the same manner as in the process of FIG. However, since the surrounding vertical grooves 2A, 2B, 2E, and 2F are deeper than the central vertical grooves 2C and 2D, as shown in FIG. 8C, the vertical grooves are buried by the material to be joined. Can be reduced.

なお、被接合材に対する突起部14の食い込み量は、超音波振動の印加時間によって変化するが、溝部の空隙が埋まることにより加圧面の面圧は低下するため、食い込みスピードもこの時点で低下する。従って、溝部にできる空隙の量は、食い込み量のプロセスばらつきを考慮した上で決定すればよい。例えば、突起部14の高さが0.7mmの場合、縦溝2Aと縦溝2Cとの段差(上下方向の距離)は約0.2mm以上とするのが好ましい。   Note that the amount of biting of the protrusion 14 with respect to the material to be bonded varies depending on the application time of the ultrasonic vibration, but since the surface pressure of the pressing surface decreases due to the filling of the gap in the groove, the biting speed also decreases at this point. . Therefore, the amount of voids that can be formed in the groove may be determined in consideration of process variations in the amount of biting. For example, when the height of the protrusion 14 is 0.7 mm, the step (vertical distance) between the vertical groove 2A and the vertical groove 2C is preferably about 0.2 mm or more.

このように、本実施の形態2にかかる超音波接合装置では、縦溝の底部を結んだ平面を、3つの面40、41、42からなるようにしたため、バリの発生を防止できる。この結果、接合工程において、バリの除去工程が省略でき、製造コストの低減が可能となる。
なお、縦溝の底部を結んだ平面を、4以上とすることも可能である。
As described above, in the ultrasonic bonding apparatus according to the second embodiment, the plane connecting the bottoms of the longitudinal grooves is formed of the three surfaces 40, 41, and 42, so that the generation of burrs can be prevented. As a result, the burr removing step can be omitted in the joining step, and the manufacturing cost can be reduced.
The plane connecting the bottoms of the longitudinal grooves can be 4 or more.

ここでは、縦溝の底部を結んだ平面が3つの面40、41、42からなり、先端部が1つの平面に含まれる場合について説明した。しかしながら、先端部を結んだ面を、多面構造とすることも可能である。要は、中央の縦溝が被接合材で埋められた場合でも、周囲の縦溝が被接合材で埋まらなければよい。   Here, the case where the plane connecting the bottoms of the longitudinal grooves is composed of the three surfaces 40, 41, and 42, and the tip is included in one plane has been described. However, the surface connecting the tip portions can be a multi-face structure. In short, even if the central vertical groove is filled with the material to be joined, it is sufficient that the surrounding vertical grooves are not filled with the material to be joined.

本発明の実施の形態1にかかるホーンの斜視図である。It is a perspective view of the horn concerning Embodiment 1 of this invention. 本発明の実施の形態1にかかる超音波接合装置の概略図である。1 is a schematic diagram of an ultrasonic bonding apparatus according to a first embodiment of the present invention. 本発明の実施の形態1にかかる超音波接合工程の概略図である。It is the schematic of the ultrasonic joining process concerning Embodiment 1 of this invention. 従来構造にかかるホーンの斜視図である。It is a perspective view of the horn concerning a conventional structure. 従来の超音波接合工程の概略図である。It is the schematic of the conventional ultrasonic bonding process. ホーンに形成された溝幅と発生するばりの数との関係である。This is the relationship between the width of the groove formed in the horn and the number of flashes generated. 本発明の実施の形態2にかかるホーンの概略図である。It is the schematic of the horn concerning Embodiment 2 of this invention. 本発明の実施の形態2にかかる超音波接合工程の概略図である。It is the schematic of the ultrasonic joining process concerning Embodiment 2 of this invention.

符号の説明Explanation of symbols

1 ホーン基部、2 縦溝、3 横溝、4 突起部、10 加圧面、20 被接合材、21 基材、30 超音波振動方向、100 ホーン、150 アンビル、500 超音波接合装置。

DESCRIPTION OF SYMBOLS 1 Horn base part, 2 vertical groove, 3 horizontal groove, 4 protrusion part, 10 pressurization surface, 20 to-be-joined material, 21 base material, 30 ultrasonic vibration direction, 100 horn, 150 anvil, 500 ultrasonic bonding apparatus.

Claims (7)

ホーンとアンビルとを含み、該ホーンが該アンビルに載置された基材に対して被接合材を1つの振動方向に振動させる超音波接合装置であって、
該ホーンは、
被接合材を加圧する加圧面を有し、該振動方向に振動するホーン基部と、
該加圧面に含まれる第1方向に沿って設けられた複数の第1溝部と、
該加圧面に含まれる第2方向に沿って設けられた複数の第2溝部と、
該第1溝部と該第2溝部に挟まれた該加圧面に設けられた突起部とを含み、
該第1溝部と該振動方向との間の角度が、該第2溝部と該振動方向との間の角度より大きく、かつ該第1溝部の溝幅が該第2溝部の溝幅より大きいことを特徴とする超音波接合装置。
An ultrasonic bonding apparatus including a horn and an anvil, wherein the horn vibrates a material to be bonded in one vibration direction with respect to a base material placed on the anvil,
The horn
A horn base having a pressing surface for pressing a material to be joined and vibrating in the vibration direction;
A plurality of first grooves provided along a first direction included in the pressure surface;
A plurality of second grooves provided along a second direction included in the pressure surface;
Including a projection provided on the pressure surface sandwiched between the first groove and the second groove,
The angle between the first groove and the vibration direction is larger than the angle between the second groove and the vibration direction, and the groove width of the first groove is larger than the groove width of the second groove. Ultrasonic bonding apparatus characterized by.
ホーンとアンビルとを含み、該ホーンが該アンビルに載置された基材に対して被接合材を1つの振動方向に振動させる超音波接合装置であって、
該ホーンは、
被接合材を加圧する加圧面を有し、該振動方向に振動するホーン基部と、
該加圧面に含まれる第1方向に沿って設けられた複数の第1溝部と、
該加圧面に含まれる第2方向に沿って設けられた複数の第2溝部と、
該第1溝部と該第2溝部に挟まれた該加圧面に設けられた複数の突起部とを含み、
該第1溝部と該振動方向との間の角度が、該第2溝部と該振動方向との間の角度より大きく、かつ該第1溝部の深さが該第2溝部の深さより大きいことを特徴とする超音波接合装置。
An ultrasonic bonding apparatus including a horn and an anvil, wherein the horn vibrates a material to be bonded in one vibration direction with respect to a base material placed on the anvil,
The horn
A horn base having a pressing surface for pressing a material to be joined and vibrating in the vibration direction;
A plurality of first grooves provided along a first direction included in the pressure surface;
A plurality of second grooves provided along a second direction included in the pressure surface;
Including a plurality of protrusions provided on the pressing surface sandwiched between the first groove and the second groove,
An angle between the first groove and the vibration direction is larger than an angle between the second groove and the vibration direction, and the depth of the first groove is larger than the depth of the second groove. Ultrasonic bonding apparatus characterized.
ホーンとアンビルとを含み、該ホーンが該アンビルに載置された基材に対して被接合材を1つの振動方向に振動させる超音波接合装置であって、
該ホーンは、
被接合材を加圧する加圧面を有し、該振動方向に振動するホーン基部と、
該加圧面に含まれる第1方向に沿って設けられた複数の第1溝部と、
該加圧面に含まれる第2方向に沿って設けられた複数の第2溝部と、
該第1溝部と該第2溝部に挟まれた該加圧面に設けられた複数の突起部とを含み、
該第1溝部と該振動方向との間の角度が、該第2溝部と該振動方向との間の角度より大きく、かつ、該複数の突起部の先端を含む第1平面に対して、該複数の第1溝部の底部を含む第2平面が傾いてなることを特徴とする超音波接合装置。
An ultrasonic bonding apparatus including a horn and an anvil, wherein the horn vibrates a material to be bonded in one vibration direction with respect to a base material placed on the anvil,
The horn
A horn base having a pressing surface for pressing a material to be joined and vibrating in the vibration direction;
A plurality of first grooves provided along a first direction included in the pressure surface;
A plurality of second grooves provided along a second direction included in the pressure surface;
Including a plurality of protrusions provided on the pressing surface sandwiched between the first groove and the second groove,
An angle between the first groove and the vibration direction is larger than an angle between the second groove and the vibration direction, and the first plane including the tips of the plurality of protrusions is The ultrasonic bonding apparatus, wherein the second plane including the bottoms of the plurality of first grooves is inclined.
上記複数の第2溝部を含む平面は、上記第2平面と、該第2平面とは異なり複数の第1溝部の底部を含む第3平面とからなり、該第3平面は、上記第1平面および該第2平面に対して傾いてなることを特徴とする請求項3に記載の超音波接合装置。   The plane including the plurality of second groove portions includes the second plane and a third plane including the bottoms of the plurality of first groove portions unlike the second plane, and the third plane is the first plane. The ultrasonic bonding apparatus according to claim 3, wherein the ultrasonic bonding apparatus is inclined with respect to the second plane. 上記第2方向が上記振動方向と略一致し、上記第1方向が該振動方向と略直交する方向であることを特徴とする請求項1〜4のいずれかに記載の超音波接合装置。   The ultrasonic bonding apparatus according to claim 1, wherein the second direction substantially coincides with the vibration direction, and the first direction is a direction substantially orthogonal to the vibration direction. 上記突起部が、角錐形状であることを特徴とする請求項1〜5のいずれかに記載の超音波接合装置。   The ultrasonic bonding apparatus according to claim 1, wherein the protrusion has a pyramid shape. 上記請求項1〜6のいずれかに記載の超音波接合装置を用いる超音波接合方法であって、
アンビルの上に基材を載置する工程と、
該基材の上に被接合材を載置し、その上に加圧面が接するようにホーンを載せる工程と、
該加圧面で該被接合材を押圧しながら、該被接合材を振動方向に振動させる接合工程とを含み、
該接合工程が、該振動方向に対して所定の角度で該加圧面に設けられた溝部に、該被接合材に埋まらない空隙を保ちつつ、該被接合材を振動させる工程であることを特徴とする超音波接合方法。
An ultrasonic bonding method using the ultrasonic bonding apparatus according to any one of claims 1 to 6 ,
Placing the substrate on the anvil;
Placing the material to be joined on the substrate, and placing the horn so that the pressure surface is in contact with the material;
A bonding step of vibrating the bonded material in a vibration direction while pressing the bonded material with the pressing surface,
The bonding step is a step of vibrating the material to be bonded while maintaining a gap that is not buried in the material to be bonded in a groove provided on the pressure surface at a predetermined angle with respect to the vibration direction. Ultrasonic bonding method.
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