JPS59136964A - Manufacture of thick film resistor - Google Patents

Manufacture of thick film resistor

Info

Publication number
JPS59136964A
JPS59136964A JP999783A JP999783A JPS59136964A JP S59136964 A JPS59136964 A JP S59136964A JP 999783 A JP999783 A JP 999783A JP 999783 A JP999783 A JP 999783A JP S59136964 A JPS59136964 A JP S59136964A
Authority
JP
Japan
Prior art keywords
resistance value
resistor
electrode
trimming
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP999783A
Other languages
Japanese (ja)
Inventor
Tsuneharu Katada
片田 恒春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP999783A priority Critical patent/JPS59136964A/en
Publication of JPS59136964A publication Critical patent/JPS59136964A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To increase rated power, to improve reliability and to reduce noises by cutting and removing nodes among auxiliary electrodes and main electrodes and resistance value-trimming the nodes in an electrode, in which the auxiliary electrodes are set up to a pair of the main electrodes and a resistor arranged between the main electrodes and which is constituted as two terminal resistors. CONSTITUTION:When the resistance value of length l1-3 of a resistor 5 between a main electrode 1 and an auxiliary electrode 3 is R3, the resistance value of length l3-4 of the resistor 5 between auxiliary electrodes 3 and 4 R2 and the resistance value of length l2-4 of the resistor 5 between the auxiliary electrode 4 and a main electrode 2 R1, the ratios of each resistance value are determined by length l2-4, l3-4 and l1-3. R2, R3 are short-circuited by each electrode connecting section 6, 7 under an initial state, and a resistance value between the main electrodes 1, 2 is represented in R1. Resistance values can be brought to R1+R2 or R1+R3 or R1+R2+R3 by cutting the electrode connecting section 6 or the electrode connecting section 7 or both the electrode connecting sections 6, 7 on a resistance value-trimming, and the resistance values can be changed at three stages.

Description

【発明の詳細な説明】 (産業上の利用分野9 本発明は、電子回路部品の厚膜抵抗の製造方法に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field 9) The present invention relates to a method for manufacturing a thick film resistor for electronic circuit components.

(従来例の構成とその問題点) 近年、民生機器の分野において厚膜プロセスが導入され
てきておシ、厚膜の特徴を活かした電子部品が数多くつ
くられている。なかでも厚膜抵抗の需要が大きく、小型
、高性能化が要求されてきている。以下、従来の厚膜抵
抗製造方法について説明する。
(Conventional configuration and its problems) In recent years, thick film processes have been introduced in the field of consumer electronics, and many electronic components are being manufactured that take advantage of the characteristics of thick films. Among these, demand for thick-film resistors is large, with demands for smaller size and higher performance. A conventional thick film resistor manufacturing method will be described below.

第1図は従来からの厚膜抵抗の製造方法の簡単な工程フ
ローチャートである。第2図は従来の抵抗の冗成状態の
モデル図であり、11および12は電極、13は抵抗体
、14はレーザー装置による抵抗値1− IJ ミンク
の溝である。又従来では抵抗値トリミングをランドブラ
スト法で行なっている場合もあり、この−例として第3
図に示すごとく、斜線部J5はサンドブラスト法によっ
て抵抗体がij1]りとらi9−ている様子を示す。
FIG. 1 is a simple process flowchart of a conventional method for manufacturing a thick film resistor. FIG. 2 is a model diagram of a redundant state of a conventional resistor, in which 11 and 12 are electrodes, 13 is a resistor, and 14 is a mink groove with a resistance value of 1-IJ created by a laser device. Also, in the past, resistance value trimming was sometimes carried out by the land blasting method;
As shown in the figure, the shaded area J5 shows how the resistor is removed by sandblasting.

以上のように構成された厚ルZ抵抗について、以丁にそ
の製造方法を説明する。
A method for manufacturing the thick Z resistor constructed as described above will now be described.

基本となる製造方法は第1図の製造工程フローチャー1
・であるが、捷ず基板に電極印刷乾燥→焼成→抵抗体印
刷・乾燥→焼成の状態までを第1段階とすると、この状
態での抵抗値のばらつきは一般的に±20%程度である
が、抵抗体の大きさく面積〕によって特に小型になると
ほらつき幅は大きくなり、約±30%程度になる。一般
的に電子回路部品としこの抵抗値は所望の抵抗値に対し
て±5係でなければ使用がむづかしく、特に高精度を要
求される場合には±2%以内でなければならないのが現
状である。
The basic manufacturing method is shown in Figure 1, Manufacturing Process Flowchart 1.
・However, if the first stage is the state of printing electrodes on the substrate and drying → firing → printing and drying the resistor → firing, the variation in resistance value in this state is generally about ±20%. However, as the resistor becomes smaller due to its size and area, the fluctuation width becomes larger and becomes approximately ±30%. In general, it is difficult to use electronic circuit components whose resistance value must be within ±5% of the desired resistance value, and especially when high precision is required, it must be within ±2%. This is the current situation.

ところで、第1段階の状態では約±30係のばらつきで
あるので、この状態での一般的分布を第4図に示す。こ
の図では所望の抵抗値を10.、O係として表わしてい
るが、分布かられかるように40係から100%の間に
分布し、平均は大体70係付近になる。このような分布
を持つ第1段階の抵抗体を所望の抵抗値に合わせるため
に、第2段階である抵抗値トリミングがあるわけであり
、第1段階での抵抗値を所望の抵抗値まで上昇させねば
ならない。
By the way, in the first stage state, there is a variation of about ±30 factors, so the general distribution in this state is shown in FIG. In this figure, the desired resistance value is 10. , is expressed as a coefficient of O, but as can be seen from the distribution, it is distributed between a coefficient of 40 and 100%, and the average is approximately around a coefficient of 70. In order to adjust the resistance value of the first stage resistor having such a distribution to the desired resistance value, there is a second stage of resistance value trimming, in which the resistance value of the first stage is increased to the desired resistance value. I have to let it happen.

また一般的に厚膜抵抗の抵抗値と形状の関係は、第5図
に示すごとく抵抗体の幅をw1電極ではさまれた間隔を
tとし、抵抗体の厚さを含んで単位面積抵抗をρとすれ
ば、抵抗値Rは R−ρ×□ の関係式となることが知られている(但し厚さtは定数
としてρに含めるつ。
In general, the relationship between the resistance value and shape of a thick film resistor is as shown in Figure 5, where the width of the resistor is defined as the interval between the w1 electrodes, and t is the width of the resistor, and the unit area resistance including the thickness of the resistor is defined as It is known that if ρ is the resistance value R, the relational expression R-ρ×□ is given (however, the thickness t is included in ρ as a constant).

い1第1段階で得られた40%伺近の抵抗を所望の抵抗
値100チにするためには抵抗値トリミングによって2
5倍変化させねばならない。これを前記の関係式から求
めると抵抗体の形状はWを−71−の幅にしなければな
らない。この様子を第6図に示すが、このように斜線部
16の部分を除去あるいは無効にしなければならない。
1. In order to make the resistance near 40% obtained in the first step to the desired resistance value of 100,
It must be changed by a factor of five. If this is determined from the above relational expression, the shape of the resistor must have a width of -71-. This situation is shown in FIG. 6, and the shaded portion 16 must be removed or disabled in this way.

しかしながらこれは理論上であり現実的にはレーザトリ
ミング法、あるいはザント゛ブラスト法によって抵抗値
トリミングが行なわわ、るので残った抵抗体の幅は理論
値よりも更らに細くなる。この様子は第2図のA1第3
図のBに示す。
However, this is theoretical; in reality, the resistance value is trimmed by a laser trimming method or a Zant blast method, so that the width of the remaining resistor becomes even narrower than the theoretical value. This situation is shown in A1 3 in Figure 2.
Shown in B of the figure.

このように従来の厚膜抵抗製造方法においては、抵抗値
トリミングによって抵抗体を著しく細くしなけi″Li
l′iならなかったので、(1)定格電力か著しく制限
される。
In this way, in the conventional thick film resistor manufacturing method, it is necessary to make the resistor extremely thin by trimming the resistance value.
Since l'i was not achieved, (1) the rated power is significantly limited.

(22局部的に著しく細くなるので電、流束中が起こり
、信頼度を低下させる。
(22) Since it locally becomes extremely thin, current and flux increase occurs, reducing reliability.

(3)局部的に著しく細くなるので、雑音が大きくなり
、使用した様器の雑音特性を劣什させる。
(3) Since it becomes extremely thin locally, the noise becomes large and the noise characteristics of the used transducer are deteriorated.

などの欠点があった。There were drawbacks such as.

(発IJ、lのLI的)一 本発明は上記従来の欠点を解消するものであシ、厚膜抵
抗の定格電力の増大、高信頼度化、低竹、音化を達成す
ることができる厚膜抵抗の製造方法を提供することを目
的とするものである。
(From IJ, LI of I) The present invention solves the above-mentioned conventional drawbacks, and can achieve an increase in the rated power of thick film resistors, higher reliability, lower resistance, and lower noise. The object of the present invention is to provide a method for manufacturing a thick film resistor.

(発明の構成9 本発明は厚膜抵抗において、主電極1対と主電極間に配
置された抵抗体に少なくとも1個所以」二の補助電極を
設け、かつこの補助電極が任意の主電極に接続されて2
端子抵抗として構成されたものを抵抗値トリミングの際
この補助iffと主電極との接続点を切断除去して抵抗
値トリミングを完了、あるいは切断除法してのち抵抗体
を除去し抵抗値トリミングを行なうことを特徴とする厚
膜抵抗の製造方法である。
(Structure 9 of the Invention The present invention provides a thick film resistor in which at least one auxiliary electrode is provided on a pair of main electrodes and a resistor disposed between the main electrodes, and this auxiliary electrode is connected to any main electrode. connected 2
When trimming the resistance value of something configured as a terminal resistor, the connection point between this auxiliary IF and the main electrode is cut and removed to complete the resistance value trimming, or after cutting and division, the resistor is removed and the resistance value trimming is performed. This is a method for manufacturing a thick film resistor characterized by the following.

(実施例の説明) 第7図は本発明の一実施例を示す図面であわ、1.2は
抵抗の主電極、3,4は補助電極、5は抵抗体、6,7
は補助電極と主電極との結線部を示し、この状態は厚膜
抵抗の製造工程図、第1図の焼成工程までの状態である
(Description of Embodiment) FIG. 7 is a diagram showing an embodiment of the present invention, in which 1.2 is the main electrode of the resistor, 3 and 4 are auxiliary electrodes, 5 is the resistor, and 6, 7
1 shows the connection portion between the auxiliary electrode and the main electrode, and this state is the state up to the firing process in FIG. 1, which is a manufacturing process diagram of a thick film resistor.

第8図は第7図の状態から抵抗値トリミングをした状態
を示し、8は電極結線部6の切断溝、9は電極結線部7
の切断溝、1oは抵抗体5のトリミング溝を示す。
FIG. 8 shows a state in which the resistance value has been trimmed from the state shown in FIG.
The cutting groove 1o indicates the trimming groove of the resistor 5.

以上のように構成された本実施例の動作を説明する。寸
ずW抗体5において主電極]と補助1L極:3との間に
ある抵抗体5の長さtl−3の抵抗値R3、補助電極3
と4との間にある抵抗体5の長さt3−4の抵抗値をI
え2、補助電極4と主電極2との間にある抵抗体5の長
さt2−4の抵抗値をR1とすれば、各々の抵抗値の比
率はt2−4・t3−4・tl−6の長さで決定サレル
。ココテIdt2−4:13.:1l−3=l: 0.
2 :01に設>J”しであるものとして説明する。こ
のとき抵抗値の比は、R1:R2:R3=1:0.2:
0.1となっているが、初期の状態ではR21R3は各
各電極結線部6,7によって短絡されており、主電極1
,2間の抵抗値ばR1となっている。次に抵抗値1・I
J ミンクの際電極結線部6捷たは電極結線部7、ある
いは電極結線部6,7共に切断することによって抵抗値
はR]十R2、またはR,十R3あるいはRl+ R2
+R3にすることができ、3段階で抵抗値を変えること
ができる・ いま初期の抵抗値R1が所望の抵抗値に対し70係であ
ったとすれば電極結線部6,7を切断することによシ、
抵抗値はR1+R2+R3= 70係+(70係X0.
2)+(70チ×01)=91係となシ、のと99係分
は抵抗体5をトリミングすることにょシ、所望の抵抗値
が得られる。
The operation of this embodiment configured as above will be explained. Resistance value R3 of the length tl-3 of the resistor 5 located between the main electrode] and the auxiliary 1L pole: 3 in the size W antibody 5, the auxiliary electrode 3
The resistance value of the length t3-4 of the resistor 5 located between and 4 is I
E2. If the resistance value of the length t2-4 of the resistor 5 between the auxiliary electrode 4 and the main electrode 2 is R1, the ratio of each resistance value is t2-4・t3-4・tl- Sarel determined by the length of 6. KokoteIdt2-4:13. :1l-3=l: 0.
The explanation will be made assuming that the setting is set at 2:01>J".At this time, the ratio of resistance values is R1:R2:R3=1:0.2:
0.1, but in the initial state R21R3 is short-circuited by each electrode connection part 6, 7, and the main electrode 1
, 2 is R1. Next, the resistance value 1・I
J Mink, by cutting the electrode connection part 6 or electrode connection part 7, or both electrode connection parts 6 and 7, the resistance value is R] 10R2, or R, 10R3, or Rl+R2
+R3, and the resistance value can be changed in three steps. If the initial resistance value R1 is 70% of the desired resistance value, by cutting the electrode connection parts 6 and 7. C,
The resistance value is R1 + R2 + R3 = 70 coefficient + (70 coefficient x 0.
2) + (70 x 01) = 91 and 99 coefficients can be obtained by trimming the resistor 5 to obtain the desired resistance value.

第8図はこの状態を示したものであシ、ごくわずかなト
リミング量で所望の抵抗値が得られる。
FIG. 8 shows this state, and the desired resistance value can be obtained with a very small amount of trimming.

このように電極結線部を切断するだけで抵抗値を所望の
抵抗値に近づけることができ、また抵抗値にすることも
可能である。また本発明による電極結線部6捷断しただ
けの場合の抵抗値の製造分布を第9図に示す。この図で
aは第4図に示しだ従来の製造分布と同一であシ、トが
本発明による分布である。この図から明らかなように、
平均値を従来例に比し著しく所望抵抗値に近づけること
が可能である。
In this way, the resistance value can be brought close to a desired resistance value simply by cutting the electrode connection portion, and it is also possible to change the resistance value to a desired resistance value. Further, FIG. 9 shows the manufacturing distribution of resistance values when the electrode connection portion 6 according to the present invention is simply cut off. In this figure, a is the same as the conventional manufacturing distribution shown in FIG. 4, and g is the distribution according to the present invention. As is clear from this figure,
It is possible to make the average value much closer to the desired resistance value than in the conventional example.

(発明の効果〕 本発明によれば補助電極の電極結線部を切断することに
より、抵抗体を切断除去することなく所望の抵抗値に近
づけ込ことができることによって、(1)電極結線部の
みを切断することによって抵抗値トリミングが可能であ
る。
(Effects of the Invention) According to the present invention, by cutting the electrode connection portion of the auxiliary electrode, it is possible to approach the desired resistance value without cutting and removing the resistor. Resistance value trimming is possible by cutting.

(2)製造分布を著しく所望抵抗値に近づけた後、抵抗
体本体のトリミングを行なうので、抵抗体の切断除去の
量が少なくてよい。
(2) Since the resistor body is trimmed after the manufacturing distribution has been made extremely close to the desired resistance value, the amount of cutting and removal of the resistor can be small.

この効果により、電気的には、 (1)抵抗体に局部的な細い部分がなくなるので、定格
電力が大きくとれる。
Electrically, this effect is as follows: (1) Since there are no locally thin parts in the resistor, the rated power can be increased.

(2)電流集中がなくなるので、信頼度が向上する。(2) Reliability is improved because current concentration is eliminated.

場合は電流雑音悪化が全くない。In this case, there is no deterioration of current noise at all.

なお本実力山例では補助電極を2点としだが、これを数
多く設けることにより、更らに細かく抵抗値を制量する
ことができる効果がある。
In this practical example, two auxiliary electrodes are used, but by providing a large number of auxiliary electrodes, it is possible to more precisely control the resistance value.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の厚膜抵抗の製造工程図、第2図は従来の
抵抗の完成状態のモデル図、第3図は同サンドブラスト
法による抵抗のモデル図、第4図は従来の初期抵抗値の
製造分布図、第5図は従来の抵抗のモデル図、第6図は
従来の抵抗のトリミング理論モデル図、第7図は本発明
による実施例を示す図、第8図は同抵抗値トリミング後
の実施例を示す図、第9図は本発明の抵抗値の製造分布
図である。 ■、2・・・主電極、3,4・・・補助電極、5・・・
抵抗体、6,7・・電極結線部、8.9・・・電極結線
部の切断溝、10・・・抵抗体のトリミング溝。 第1図 第2図 第3図 第4図 第5図 第6図 ] 268− 第9図 40 60 80 100  (%)   AffiA
JL灯 璧 必、 筏 硯
Figure 1 is a manufacturing process diagram of a conventional thick film resistor, Figure 2 is a model diagram of a completed conventional resistor, Figure 3 is a model diagram of a resistor produced using the same sandblasting method, and Figure 4 is a diagram of the conventional initial resistance value. Fig. 5 is a conventional resistor model diagram, Fig. 6 is a conventional resistor trimming theoretical model diagram, Fig. 7 is a diagram showing an embodiment according to the present invention, and Fig. 8 is a diagram showing the same resistance value trimming. FIG. 9, which is a diagram showing a later example, is a manufacturing distribution diagram of resistance values of the present invention. ■, 2... Main electrode, 3, 4... Auxiliary electrode, 5...
Resistor, 6, 7... Electrode connection part, 8.9... Cutting groove of electrode connection part, 10... Trimming groove of resistor. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6] 268- Figure 9 40 60 80 100 (%) AffiA
JL tobeki, raft inkstone

Claims (2)

【特許請求の範囲】[Claims] (1)基板上に抵抗体、導電電極を印刷し、焼成したの
ち抵抗体の一部を除去、あるいは切断するいわゆる抵抗
値トリミングを施して所望の抵抗値を得る厚膜抵抗の製
造方法において、2つの主電極の内側C・こ少なくとも
1つ以上の補助電極を設け、かつこの補助電極と主型4
砂とを任意に結線し、抵抗体全体としてil″j:2つ
の端子電極になるように印刷し・焼成したのち抵抗1面
トリミングの際に抵抗値トリミング以前の抵抗値の所望
抵抗値偏差値に応じて、予じめ結、凍されている補助電
極と主電極の結線部を切断してのち抵抗体のトリミング
を行なうことを特徴とする厚膜抵抗の製造方法。
(1) A method for manufacturing a thick film resistor in which a desired resistance value is obtained by printing a resistor and a conductive electrode on a substrate, baking it, and then removing or cutting a portion of the resistor to perform so-called resistance value trimming. At least one auxiliary electrode is provided inside the two main electrodes, and this auxiliary electrode and the main mold 4
After arbitrarily connecting the resistor to the sand and printing and firing it so that the entire resistor becomes two terminal electrodes, when trimming one side of the resistor, the desired resistance value deviation value of the resistance value before resistance value trimming is determined. A method for manufacturing a thick film resistor, which comprises cutting the connection portion between the auxiliary electrode and the main electrode, which have been pre-frozen and frozen, and then trimming the resistor.
(2)基板上に抵抗体、導電電極を印刷し、焼成したの
ち、抵抗値トリミングを施して所望の抵抗値を得る厚膜
抵抗の製造方法において、2つの主電極の内側に少なく
とも1つ以上の補助電極を設け、かつこの補助電極と主
電極とを任ししに結線し、抵抗体全体としては2つの端
子電極になるように印刷し、焼成したのち抵抗値トリミ
ングの際に抵抗値トリミング以前の抵抗値の所望抵抗値
偏差値に応じて予じめ結線されている補助電極と主電極
の結線部を切断して抵抗体のトリミングを行なうことを
特徴とする厚膜抵抗の製造方法。
(2) In a method for manufacturing a thick film resistor in which a resistor and a conductive electrode are printed on a substrate, fired, and then resistance value trimmed to obtain a desired resistance value, at least one or more resistors are printed on the inside of two main electrodes. An auxiliary electrode is provided, and the auxiliary electrode and the main electrode are connected as desired, and the entire resistor is printed so that it has two terminal electrodes. After firing, the resistance value is trimmed during resistance value trimming. A method for manufacturing a thick film resistor, which comprises trimming a resistor by cutting a connection between an auxiliary electrode and a main electrode, which are connected in advance according to a desired resistance value deviation value from a previous resistance value.
JP999783A 1983-01-26 1983-01-26 Manufacture of thick film resistor Pending JPS59136964A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP999783A JPS59136964A (en) 1983-01-26 1983-01-26 Manufacture of thick film resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP999783A JPS59136964A (en) 1983-01-26 1983-01-26 Manufacture of thick film resistor

Publications (1)

Publication Number Publication Date
JPS59136964A true JPS59136964A (en) 1984-08-06

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Application Number Title Priority Date Filing Date
JP999783A Pending JPS59136964A (en) 1983-01-26 1983-01-26 Manufacture of thick film resistor

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763044B2 (en) * 1990-06-27 1995-07-05 マルクアルト ゲーエムベーハ Switch circuit with controllable resistance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763044B2 (en) * 1990-06-27 1995-07-05 マルクアルト ゲーエムベーハ Switch circuit with controllable resistance

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