JP3178990B2 - Frequency adjustment method for multilayer electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adjusting the frequency of a multilayer electronic component.

[0002]

2. Description of the Related Art As a laminated electronic component, for example, there is a band pass filter 51 as shown in FIG. In the bandpass filter 51, a pattern electrode 53 is formed on both front and back surfaces of a dielectric layer 52, and a first sheet layer 54 and a shield electrode film 55 are formed on the pattern electrode 53 in this order from the electrode 53 side.
And the second sheet layer 56 are laminated.

Incidentally, the frequency characteristic (center frequency) of the band-pass filter 51 needs to be the same as the design value, but may differ from the design value depending on the environment in the manufacturing process. Therefore, conventionally, the center frequency of the bandpass filter 51 has been adjusted by trimming the pattern electrode 53 inside the laminate.

[0004]

However, in the above-mentioned conventional method, the distance between the surface of the band-pass filter 51 (the surface of the second sheet layer 56) and the pattern electrode 53 is large (that is, the trimming hole 57 is deep). It is necessary to increase the output during trimming. For this reason, cracks may occur from the trimming holes. In addition, since the pattern electrode 53 in the trimming hole is exposed, the pattern electrode 53 may be oxidized. For these reasons, there is a problem that the characteristics of the bandpass filter 51 are deteriorated.

Accordingly, the present invention has been made in view of the above problems, and prevents cracks from being generated from trimming holes and oxidation of pattern electrodes by preventing the trimming holes.
An object of the present invention is to provide a frequency adjustment method capable of dramatically improving the characteristics of a multilayer electronic component.

[0006]

In order to achieve the above object, the present invention is directed to a method for forming a pattern electrode forming an inductor and a pattern electrode forming a capacitor between a plurality of dielectric layers, wherein the pattern electrode is determined by the inductor and the capacitor. A method for adjusting the frequency of a laminated electronic component having a built-in dielectric resonator body having a predetermined frequency, wherein a first sheet layer and a malleable material made of copper or silver are sequentially formed on the dielectric resonator body. A shield electrode film and a second sheet layer are formed, and the frequency is adjusted by physically trimming and removing the shield electrode film together with the second sheet.

[0007]

With the above arrangement, the distance between the shield electrode film and the surface of the multilayer electronic component is smaller than the distance between the pattern electrode and the surface of the multilayer electronic component. Therefore, since the trimming can be performed without increasing the trimming output too much, generation of cracks in the filter can be suppressed.

In addition, since the pattern electrode is not exposed, it is possible to prevent the pattern electrode from being oxidized.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is an external perspective view of a bandpass filter to which the present invention is applied, and FIG. 2 is a cross-sectional view taken along line II-II of FIG. This bandpass filter has a dielectric layer 2
And a main body 5 comprising pattern electrodes 3 and 4 formed on both front and back surfaces of the dielectric layer 2. Both surfaces of the main body 5 are made of first sheet layers 6 and 7 made of a dielectric or an insulator and a malleable material made of copper or silver.
And the shield electrode films 8, 9 and a second sheet layer 10, 11 made of a dielectric or insulator is formed in this order from the main body 5 side. Input terminal electrodes 13, output terminal electrodes 14, and ground electrodes 15 and 16 are formed on both side surfaces of the bandpass filter.

As shown in FIG. 3, the pattern electrode 3 comprises a substantially U-shaped pattern electrode 31 and a substantially L-shaped pattern electrode 32, while the pattern electrode 4 has a substantially L-shaped pattern electrode. It comprises a pattern electrode 41 and a substantially U-shaped pattern electrode. The above four pattern electrodes 31
32, 41, and 42 of the pattern electrode 31
41 is one capacitor electrode pattern 31a 41a
(C ₁ ) has coil patterns 31b (L ₁ , L ₂ ),
Alternatively, it has a structure in which the coil patterns 41b (L ₃ ) are connected. The capacitor electrode patterns 31a and 41a are:
The coil patterns 31b and 41b are opposed to each other in the front and back directions of the dielectric layer 2, and are connected via a VIA hole 21a penetrating the dielectric layer 2. Further, a tongue piece 31c formed at an end of the pattern electrode 3 is connected to the output terminal electrode 14, and a tongue piece 31d formed at an end of the pattern electrode 3 is connected to the ground electrode 15.

On the other hand, the right pattern electrodes 32 and 42 are
One capacitor electrode pattern 32a, 4
2a (C ₂₎ to a respective connecting the coil pattern 32b (L _6), or coil pattern 42b (L _4, L ₅₎ structure, the coil pattern 32 b · 42b is a VIA hole 21b which penetrates the dielectric layer 2 Connected through. Also, a tongue piece 32 formed at the end of the pattern electrode 3
“c” is connected to the ground electrode 16, and a tongue piece 41 c formed at an end of the pattern electrode 4 is connected to the input terminal electrode 13. Furthermore, the tongue 42e formed inwardly of the tongue 31e and the pattern electrodes 42 formed on the inside of the pattern electrode 31 are opposed across the dielectric layer 2, whereby the capacitor C ₃ Make up.

With the above structure, a bandpass filter as shown in the equivalent circuit of FIG. 4 is formed. Here, when adjusting the center frequency of the bandpass filter, the shield electrode film 8 is trimmed as shown in FIGS. Then, since the area of the shield electrode film 8 is reduced, the magnetic influence on the coil pattern is reduced and the inductance of the coil pattern is increased. Therefore, the center frequency of the band-pass filter decreases as shown in FIG.

At this time, since the distance between the shield electrode films 8 and 9 and the surface of the bandpass filter is 20 to 40 μm,
The depth of the trimming hole 45 may be about 50 μm. Therefore, the trimming can be performed without increasing the output of the trimming, so that the occurrence of cracks in the bandpass filter can be suppressed. In addition, since the pattern electrodes 3 and 4 are not exposed, the pattern electrodes 3 and 4 are not exposed.
4 can be prevented from being oxidized.

If the diameter of the trimming hole 45 is too large, the shielding effect is deteriorated. Therefore, it is necessary to make the diameter such that the shielding effect is not deteriorated. In the above embodiment, the trimming is performed at six places. However, the present invention is not limited to this. When the center frequency is not largely shifted, the number of trimmings is reduced. Can be adjusted by further increasing the number of trimmings.

[0015]

As described above, according to the first aspect of the present invention, since the frequency is adjusted by trimming the shield electrode near the outer surface of the multilayer electronic component, the trimming can be performed without increasing the trimming output too much. It is possible to suppress the occurrence of cracks in the multilayer electronic component, and it is possible to adjust the frequency without exposing the pattern electrode of the resonator body by the adjustment, thereby preventing the pattern electrode from being oxidized. The effect is that it is possible.

According to the second aspect of the present invention, since the shield electrode film is mechanically trimmed and removed together with the second sheet, even if the shield electrode film is made of a malleable material such as copper or silver, it is accurate. Thus, a desired amount of trimming can be removed, and the accuracy of frequency adjustment can be increased.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a bandpass filter.

FIG. 2 is a sectional view taken along line II-II in FIG.

FIG. 3 is a plan view of a bandpass filter main body.

FIG. 4 is an equivalent circuit diagram of a bandpass filter.

FIG. 5 is an external perspective view of the bandpass filter of FIG. 1 after frequency adjustment.

FIG. 6 is a sectional view taken along line VI-VI of FIG. 5;

FIG. 7 is a graph showing frequency characteristics of a band-pass filter adjusted according to the present invention.

FIG. 8 is a cross-sectional view when frequency adjustment is performed by a conventional method.

[Description of sign]

 2 Dielectric layer 3.4 Pattern electrode 6.7 First sheet layer 8.9 Shield electrode film 10.11 Second sheet layer 45 Trimming hole

Continuation of front page (72) Inventor Tetsuo Taniguchi 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd. (56) References JP-A-61-121409 (JP, A) JP-A-64-48304 (JP, A) JP-A-56-104430 (JP, A) JP-A-59-52804 (JP, A)

Claims (1)

(57) [Claims] 1. A laminated type in which a pattern electrode forming an inductor and a pattern electrode forming a capacitor are formed between a plurality of dielectric layers, and a dielectric resonator main body having a frequency determined by the inductor and the capacitor is built in. A method for adjusting the frequency of an electronic component , wherein the resonator body includes a capacitor and an inductor connected in parallel.
Parallel resonant circuit, wherein the multilayer electronic component has a plurality of resonator main bodies coupled thereto.
A band-pass filter, before Symbol dielectric resonator sequentially first sheet layer on the body and the copper or shield electrode film and the second sheet layers are made from malleable a material of silver is formed, the shield A frequency adjustment method for a multilayer electronic component, wherein the frequency is adjusted by physically trimming and removing an electrode film together with a second sheet.