JPS59135739A - Device for measurement of semiconductor element - Google Patents
Device for measurement of semiconductor elementInfo
- Publication number
- JPS59135739A JPS59135739A JP929783A JP929783A JPS59135739A JP S59135739 A JPS59135739 A JP S59135739A JP 929783 A JP929783 A JP 929783A JP 929783 A JP929783 A JP 929783A JP S59135739 A JPS59135739 A JP S59135739A
- Authority
- JP
- Japan
- Prior art keywords
- contact needle
- contact
- needle
- fixed card
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は半導体素子の測定装置にかがり、髄に複数の
ＩＣが形成されたウェハの各ＩＣの電気的特性をつＪ凸
状態で測定する固定カード部の改良に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a semiconductor device measuring device, and a fixed device for measuring the electrical characteristics of each IC of a wafer in which a plurality of ICs are formed in a J convex state. Concerning improvements to the card section.
半導体素子でＩＣのチップはその周辺に多数のポンチイ
ンクハツトを備えており、ウェハの状態（チップに分割
されてない状態）で電気的特性の測定を行ない、その結
果にもとづいて区、不良の判別やクラス分類などを行な
い夫々νこマーキングを施して次工程に送っていた。■
１記測定においでは、ＩＣのポンディングパッドの配置
に対応して配線基板上に取着された上記パッドに対応す
る接触針を回路要素とともに備えた固定カードが用いら
れる。特にこの固定カードにおける接触針の取着を第１
図および第２図によって例示する。（１）は固定カード
の配線基板で、配線パターン（２＋、ｔ２＋・・・を含
み回路要素（図示省略）が形成されており、配線パター
ンに接触針＋３１．（３１・・・が取着端（３ａ）、（
３ａ）・・・で取着されて電気的接続を達成し、他端は
緩い角度で曲って接触端（３ｂ）、（３ｂ）・・・にな
っている。とのような接触針は各々の中間の一部が一例
のエボキーシ樹脂などで環状に形成された電気絶縁部材
（４）で配線基板（１）に固着され、その定位がはから
れている。An IC chip, which is a semiconductor device, is equipped with a large number of punch ink hats around it, and its electrical characteristics are measured in the wafer state (not divided into chips), and based on the results, it is determined whether the chip is defective or not. After performing discrimination and classification, markings were applied to each product before it was sent to the next process. ■
In the first measurement, a fixed card is used which is equipped with a circuit element and contact needles that are attached to the wiring board in accordance with the arrangement of the bonding pads of the IC and correspond to the pads. In particular, the first step is to attach the contact needle on this fixed card.
Illustrated by the figure and FIG. (1) is a wiring board of a fixed card, which includes wiring patterns (2+, t2+, etc.) and circuit elements (not shown) are formed thereon. (3a), (
3a)... to achieve electrical connection, and the other end is bent at a gentle angle to form contact ends (3b), (3b)... The middle part of each of the contact needles is fixed to the wiring board (1) by an annular electrically insulating member (4) made of eg epoxy resin, etc., and its position is determined.
双手の構造で、接触針は電気絶縁部材で固定されている
ので、その固定部から接触端までの長さ（ノ罎だけの弾
１」、でポンチインクパッドに接触するときのバランス
を保つものである。したがって、各接触べνＦに上下方
向のばらつきがあるとき、適ｉＥな針ＩＦ：をうるため
にはあるｌ特定の釧に針用がががりすぎるｌｌ：ｌ′Ｉ
向があり、後に詳述するようにポンディングパッドのア
ルミニウム膜全削りとるととがあり、゛ま／弘繰返し使
用により接触針＋ｊ＋身の弾性の寿命をｉｊノかくする
などの欠点がある。It has a two-handed structure, and the contact needle is fixed with an electrically insulating material, so the length from the fixed part to the contact end (1") maintains balance when contacting the punch ink pad. Therefore, when there is variation in the vertical direction of each contact point νF, in order to obtain an appropriate needle IF:, it is necessary to have a certain l:l'I if the needle is too steep for a particular hook.
However, as will be explained in detail later, there is a disadvantage in that the entire aluminum film of the bonding pad is removed, and the life of the elasticity of the contact needle is shortened by repeated use.
この発明は斜上の従来の欠点に鑑みて半導体素子の改良
さ７’した測定に置ケ１！ｉ＋−供する。This invention has been developed to improve the measurement of semiconductor devices in view of the conventional drawbacks of slanting. i+- provide.
この発明にかかる半導体素子の測定装置は、配線基機上
に半導体素子の軍、極パッドの配置に対応してそｔ’ｌ
らの各々に同時に接触針を（＋ｉ２ｉ接させ４相定回路
を形ｌＪ９する回路要素と接触針とを備えた固定カード
において、接触針が配線基板に取着され７七弾性部月を
１４通し支持されたことを特徴とする。The semiconductor device measuring device according to the present invention can be used to measure semiconductor devices according to the arrangement of semiconductor device groups and pole pads on a wiring board.
In the fixed card, the contact needle is attached to the wiring board and the contact needle is attached to the wiring board. It is characterized by being supported.
次にこの発明を実施例につき図面を参照してｗｆ細に説
明する。１実施例はその「皮部が第３図および第４図に
承されるように接触針の支持機構のみ従来と異なり、他
は変わらないのでこの変わらない部分は図面に同じ符号
を付けて示し説明を省略する。固定カードにおける接触
針ｆＪ３＋、０３）・・・はその取着端（１３ａ）、（
１３ａ）・・・で固定カードの配線基板（１）の配線パ
ターン（２１，（２＋・・・に電気的接続を達成［７て
取着され、他端の接触端（１３ｂ）、（１３ｂ）・・・
との間の一部をゴム、シリコンゴムのような弾性材で一
例のｆｆｉ状に形成さｎた弾性１（℃気絶縁抽料（１４
）で配線基板（１＋に同着［７ている。これで、接触金
１’ （１３）は取着端から接触端に至る全長（Ｉ、）
でポンディングパッドに衝接の圧力を受けとめることに
＆る。すなわち、ソフトコンクク］・が達成できる。Next, the present invention will be explained in detail with reference to the drawings with reference to the embodiments. Embodiment 1 differs from the conventional one only in the support mechanism of the contact needle, as the skin part is shown in FIGS. 3 and 4, but the rest remains the same, so the same parts are indicated with the same reference numerals in the drawings. The explanation is omitted.The contact needle fJ3+, 03)... on the fixed card has its attachment end (13a), (
13a)... Achieve electrical connection to the wiring pattern (21, (2+...) of the wiring board (1) of the fixed card [7] and the other contact end (13b), (13b) ...
The part between them is made of an elastic material such as rubber or silicone rubber and is shaped like an elastic material (14 °C).
) and attached to the wiring board (1+) at the same time [7].Now, the contact metal 1' (13) has the entire length (I, ) from the mounting end to the contact end.
The pressure of the impact is received by the pounding pad. In other words, it is possible to achieve a soft texture.
次に、第５図ないし第７図に示される別の実施例（ｄ−
ヒ記実Ｊ（１例における弾性電気絶縁部）ａ Ｌ１４１
について接触針＋１．３）を１１面させる部分のみを弾
性ＡＡにｌ〜だものである。すなわち、接触針（１■を
−その中間マ゛支持する電気絶縁部材（財）が接触針（
１３１全貫通さ什る部分に部分弾性電気絶縁部材（２４
１））とＬ〜、他１イ；（来技術と変わらない電気絶縁
部材（２４ａ）で環状に形成される。なお、部分弾性電
気絶縁部材（２４）））はハ１状体の一部を図示の如く
仕切って設けても、または、接触針の周囲をこ牡と同軸
で管状に形成された部分弾性電気絶縁部材（２４ｂ’）
で被包し’＋［気絶縁部材中に埋込む構造（第８図）に
してもよい。Next, another embodiment (d-
Note J (Elastic electrical insulation part in one example) a L141
Only the portion where the contact needle +1.3) faces 11 is elastic AA. In other words, the electrically insulating member (goods) supporting the contact needle (1
131 A partially elastic electric insulating member (24
1)) and L~, and 1A; (formed in an annular shape with an electrically insulating member (24a), which is the same as the previous technology; the partially elastic electrically insulating member (24))) is a part of the 1-shaped body. Alternatively, a partially elastic electric insulating member (24b') formed in a tubular shape coaxially with the contact needle may be provided as shown in the figure.
It is also possible to have a structure (FIG. 8) in which it is encapsulated in a gas insulating material and embedded in a gas insulating member.
この発明によれば、１！４定カードの多くが備える４０
ピン前後の接触針の相互に生ずる高さのばらつきに対応
できる。すなわち、従来最初の接触針（低い接触針）が
ホンディングパッドに接触してからＪ徒後の接触針（高
い接触針）がポンディングパッドに接触するまでの距離
と、最後の接触針が適切な圧接圧になるまでの距離とを
固定カード全体で調整する必要がある。しかし、このよ
うな調整をすることによって最初に圧接さｌ、た接触針
の圧接圧は不所望に大きなものとなり、その力全接触針
の長さの一部で受けるのでポンディングパッド面を滑動
し、パッドを形成しているアルミニウム膜を削り取って
しまう。との状態は顕微鏡観、そγによって第９図に例
示するように、ポンディングパッド面（１０）を形成す
るアルミニウム膜に接触針跡（１０ａ）を生じ、さらに
強力にすべって削りとった欠部０】）が認められる。こ
のように、ホンディングパッドに損傷を受けることは後
の組立］−稈に重大な支障をきたすが、本発明によれば
、ホンディングパッドに印加される過大な圧接圧を艮い
接触針と電気絶縁部材との弾性によって吸収し７適正な
ものにする。According to this invention, most of the 1!4 fixed cards have 40
It is possible to deal with variations in height between the contact needles before and after the pin. In other words, the distance from when the first contact needle (low contact needle) contacts the bonding pad to when the contact needle after J (high contact needle) contacts the bonding pad, and when the last contact needle is It is necessary to adjust the distance until a suitable contact pressure is achieved for the entire fixed card. However, by making such an adjustment, the contact pressure of the contact needle that is initially pressed becomes undesirably large, and since the entire force is received by a portion of the contact needle's length, it is difficult for the contact needle to slide on the surface of the bonding pad. However, the aluminum film forming the pad is scraped off. As shown in Fig. 9, the state of contact needle marks (10a) are formed on the aluminum film forming the bonding pad surface (10) under a microscope, and there are also chips that are scraped off by sliding forcefully. Part 0]) is accepted. Thus, damage to the honding pad will seriously impede the subsequent assembly, but according to the present invention, the excessive contact pressure applied to the honding pad can be avoided and the contact needles It is absorbed by the elasticity of the electrically insulating member and made 7 proper.
斜上の如くして、ボンデインクパッドを損傷することな
く各接触針の圧接圧を適正（ＩＩさせて良好な測定結果
を得るとともに、固定カードの耐Ｊｌｌ ｕｎｉ間も延
伸することができるなどの顕著な利点が夛）る。By tilting it upward, the pressure of each contact needle can be adjusted appropriately (II) without damaging the bonding ink pad, and good measurement results can be obtained. There are many significant advantages.
また、との発明は実施が容易で固定カードＣ）設計変更
なども要しない利点もある。Furthermore, the invention has the advantage that it is easy to implement and does not require any changes in the design of the fixed card.
第１図および第２図は従来の固定カードの一部の接触針
部を示す第１図はｉＥ ｔｆｉ図、；聴２図は断面図
ｉ）； ：３図および第４図は１実施例の固定カードの
一部の隆触９１部を示す第３図は正面図、第４図は断面
図、第５図ないし第７図は別の実施例の同定カー ドの
一部の接触針部を示す第５図は正面図、第６図−および
卯３７図は断面図、第８図はさらに別の実施例の固定カ
ードの一部の接触針部の断面図、第９図はホンディング
パッド向の正面図である。
１ （１ｑ定カードの配線基板２ 配
線パターン
１０ ホンディングパッド向１３
接触針
１３ａ 接触針の取着娼
１３ｂ 接触針の接触端
１４ 弾性電気絶縁部材
初 電気絶縁部材
２４ｂ、 ２４ｂ’ 部分弾性電気絶縁部材代理人
弁丹士 井 上 −男
第１図
第 ３ 図
第 ５ 図
第６図
、／
第７図
、ｔ３ 〜ＩFigures 1 and 2 show some contact needles of a conventional fixed card. Figure 1 is an iEtfi diagram; Figure 2 is a cross-sectional view.
i): Figures 3 and 4 show a portion of the ridge 91 of the fixed card of one embodiment. Figure 3 is a front view, Figure 4 is a sectional view, and Figures 5 to 7 are separate views. FIG. 5 is a front view showing a contact needle part of a part of an identification card in this embodiment, FIGS. 6-37 and 37 are a cross-sectional view, and FIG. FIG. 9 is a sectional view of the contact needle portion of FIG. 1 (Wiring board for 1q constant card 2 Wiring pattern 10 Forwarding pad 13
Contact needle 13a Contact needle attachment point 13b Contact end of the contact needle 14 First elastic electrical insulating member Electrical insulating members 24b, 24b' Partially elastic electrical insulating member agent Bentanshi Inoue-Man Figure 1 Figure 3 Figure 5 Figure 6, / Figure 7, t3 to I
Claims (1)
でそれらの各々に同時に接触針を衝接させ測定回路を形
成する回路要素と接触針とを備えた固定カードにおいて
、接触針が配線基板に取着された弾性部材を貫通し支持
さルたことを特徴とする半導体素子の測定装置。Corresponds to the arrangement of electrode pads of semiconductor elements on wiring boards.
In a fixed card equipped with a circuit element and a contact needle, each of which is simultaneously impinged with a contact needle to form a measuring circuit, the contact needle penetrates an elastic member attached to a wiring board and is supported. A semiconductor device measuring device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP929783A JPS59135739A (en) | 1983-01-25 | 1983-01-25 | Device for measurement of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP929783A JPS59135739A (en) | 1983-01-25 | 1983-01-25 | Device for measurement of semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59135739A true JPS59135739A (en) | 1984-08-04 |
Family
ID=11716534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP929783A Pending JPS59135739A (en) | 1983-01-25 | 1983-01-25 | Device for measurement of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59135739A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63244750A (en) * | 1987-03-31 | 1988-10-12 | Tokyo Electron Ltd | Probe card and manufacture thereof |
| JPS63273328A (en) * | 1987-05-01 | 1988-11-10 | Tokyo Electron Ltd | Probe card |
| JPH0342574A (en) * | 1989-07-11 | 1991-02-22 | Nippon Denshi Zairyo Kk | Probe card |
| JPH0390081U (en) * | 1989-12-27 | 1991-09-13 |
-
1983
- 1983-01-25 JP JP929783A patent/JPS59135739A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63244750A (en) * | 1987-03-31 | 1988-10-12 | Tokyo Electron Ltd | Probe card and manufacture thereof |
| JPS63273328A (en) * | 1987-05-01 | 1988-11-10 | Tokyo Electron Ltd | Probe card |
| JPH0342574A (en) * | 1989-07-11 | 1991-02-22 | Nippon Denshi Zairyo Kk | Probe card |
| JPH0390081U (en) * | 1989-12-27 | 1991-09-13 |
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