JPS59134895A - Method of producing electronic circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for manufacturing an electronic circuit device, particularly a first method for manufacturing an electronic circuit device.
This relates to the connection between the conductors of the substrate and the second substrate.

In a heel control device such as a liquid crystal display, contact with external leads is a major problem. Conventionally, as a method for connecting the bases of a quadruple circuit device used for this type of application, there has been, for example, a solder re-row method using an infrared edge.

FIG. 1 is a top view of a conventional electronic circuit device IT showing a method of manufacturing a conventional electronic circuit device. In the figure, (1a) is a first substrate, which in this case is made of glass. (1b) Ha! g1 board (1
a) 14 multiple younger brothers connected to the above '1 Shiki Kaikan (not shown)! It is shaped like a hole so as to reach the end of the g1 board (1a), and is a conductor made of materials such as Nesa, steel, and nickel. (2a) is the second substrate, which in this case is a film made of a material such as polyimide. (2b)
It consists of a partially gold-plated steel leaf temple. tJ! Therefore, a solid second conductor is formed on the second substrate (2&) so as to be connected to the first conductor (1b). C20)/'i, Norda
This is a cover coat made of the same material as the resist or film (2a), and these 6 (2a) to (2C) are:
It is made of a flexible substrate and was used for some time as an external lead band for the Seiko circuit device. (3) is the 14th body (1b) and the second conductor (
2b) is an adhesive layer made of a solder stopper material provided at the part where it is connected. (4) is infrared, a fountain.

The first substrate (1a) and the second substrate (2a) continue to be mistresses,
Mezu 14th body (lb): j, - call! g24 bodies (2b)
A preliminary solder portion 3), which is an adhesive layer, is applied to each C11S portion to be connected by a method such as a solder dip method or a solder printing method. These 4514 bodies (1b) and the second
By aligning the preliminary solder parts of the four bodies (2b) and placing them in contact with each other, and melting the solder by heating with infrared irradiation (4), both boards ( 1
a), contact (za).

In such a conventional solder reflow method using infrared radiation, the first substrate (1a) and the second substrate (2a) are bonded not only at a height of 1 m (3) but also at a temperature above the melting point of the solder, for example 2; Heat resistant 1 to be heated to ~250℃
From point a, there was a drawback that the materials used for the first substrate (1a) and the second substrate (2a) were significantly determined.

In fact, when a flexible substrate is used, the substrate stretches when heated, resulting in one short connection and poor reliability.

This invention was made in order to eliminate the drawbacks of the conventional method as described above.
Using a first substrate, a laser beam is transmitted through the first substrate and irradiated onto the connected portion of the first substrate and the second substrate. A plurality of 24ths on the substrate
One object of the present invention is to provide a method for manufacturing an electronic circuit device that is easy to clean, reliable, and easy to use by connecting the bodies to each other.

Hereinafter, one embodiment of the present invention will be described with reference to the drawings. Second
The figure is a sectional view of an electronic circuit device showing an embodiment of the present invention. In the figure, (la) is a first substrate made of a glass substrate, and (5) is a YAG, Ar, or other laser beam driven in a pulsed manner. The first substrate (1a) and the second substrate (2
The connection with a) is made by the conventional Shichidozo method, and the first conductor (
lb) TovJ24 body (21)) No'f:hP Apply a preliminary I-under (3), which is an adhesive layer, to the parts to be connected, then align these preliminary I-under parts and attach them together. Place them next to each other. Taking advantage of the property that laser light (5) slightly passes through glass, it can be applied to glass substrates.
Through Tachibana m (la), feel the preliminary solder part - the light (5
) is irradiated and heated in a pulsed manner to bond the 14th body (1b) and the 24th body (1b) with the adhesive layer (3) of the solder.
The heating time of the pre-excited solder part by the Rede light (59) which reads 2b) is extremely short, i/100 to 1/1o second,
By narrowing down the beam diameter of the laser beam (5),
Since it is possible to heat only the pre-11tfi solder part, jtJ is applied to the first board (1a) and the second board (2a).
There are no restrictions on the heat resistance of the material to be heated, and even in the case of 48 using a waste substrate, it is possible to prevent the elongation of the substrate due to heating.
The body (2b) and the first part body (1b) are connected to each other with Is 4 chastity.

-, the time for forming the adhesive layer (3) is 1/1 t) 0 to 17
Since it is extremely short at 10 seconds, it is very suitable for cooking. Furthermore, heating the pre-soldering part with the Rede light (5) does not require the addition of No. 7 lux, which is commonly used in the conventional method, and simplifies the manufacturing process.

In the above example, the second plate was placed on the top of the porridge l & plate (1a).
Although the substrate (2a) is connected, the second substrate (2a) may be connected to the side end portion of the first substrate (1a). FIG. 3 is a +f+ drawing of a recirculation device a showing another embodiment of the present invention, and shows the case where it is connected to the side end surface of the first substrate (1a).

Further, in the above embodiment, the second substrate (2a) is a flexible film, but it is of course possible to use an insulating substrate made of a material such as glass, epoxy, or phenol.

Further, in the above embodiment, a glass substrate was used as the first substrate (1a), but if the laser beam (5) for forming the adhesive layer (3) is a YAG radar (wavelength: 1.06 μD), the glass substrate
tIl! An organic sealant such as acrylic that transmits this may be used, and in the case of a C02 laser (wavelength 10.6 μm), glass is used. Materials are sorted.

As described above, according to the present invention, the first substrate that is transparent to the laser beam is used, and the laser beam is transmitted through the first substrate and irradiated onto the connecting portion of the first substrate and the second substrate. Shine!
+ Since we have infiltrated the plurality of solid particles on the +g1 board and the several second conductors of the second group and temporary fixing, the heat resistance of the board material has been slowly removed, and , there are young fruits that can be obtained with high degree of connectivity with high reliability and good productivity.

[Brief explanation of the drawing]

Figure 1 is a sectional view of an electronic circuit device showing a conventional method of manufacturing an electronic circuit device, Figure 2 is a sectional view of an electronic circuit device showing an embodiment of the present invention, and Figure 3 is a cross-sectional view of an electronic circuit device showing an embodiment of the present invention. 1 is a cross-sectional view of an electronic circuit device showing an example. As shown in the figure, (1a) is the first substrate, (1b) is the first calyx body, (2a) is the second substrate, (2b) is the 24th body, (3)
V′i adhesion no, (5) is Rede light. In addition, in the figure, the same <= sign indicates the same - or the t target part.

Claims (2)

[Claims] (1) Using the first substrate that is transparent to Rede light, this first
Connect the fJ1 conductor of the Fukudanran connected to the quasi-QI recovery on the board as the lth
In the process of forming on the edge of the substrate, a plurality of first layers are formed on two substrates.
The process of forming the second conductor of the four bodies and the concubine,
A step of vertically aligning the inner substrates with an adhesive no. θ interposed between the plurality of 24th bodies and the plurality of 14th bodies; and radiate heat from the LED light to a plurality of 1st bodies and a plurality of 24th bodies.
A method for manufacturing a multiplex circuit device that performs a process of connecting each body sound. (2) A claim characterized in that the first substrate is made of glass. Method.