JPH04199723A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPH04199723A
JPH04199723A JP33389790A JP33389790A JPH04199723A JP H04199723 A JPH04199723 A JP H04199723A JP 33389790 A JP33389790 A JP 33389790A JP 33389790 A JP33389790 A JP 33389790A JP H04199723 A JPH04199723 A JP H04199723A
Authority
JP
Japan
Prior art keywords
hole
semiconductor
adhesive tape
conductive resin
economics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33389790A
Other languages
Japanese (ja)
Inventor
Tsukasa Shiraishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP33389790A priority Critical patent/JPH04199723A/en
Publication of JPH04199723A publication Critical patent/JPH04199723A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Abstract

PURPOSE: To obtain a highly densely integrated semiconductor device with flip-chip mounting method being superior in productivity and economics by a method wherein a through-hole is provided on a desired position and its hole is filled with a conductive resin, and adhesive tape coated with adhesives on one side is used.
CONSTITUTION: In a semiconductor chip 7, a circuit board 1, on whose main surface, a desired conductive circuit layer is formed, and adhesive tape 4 that is provided with adhesives, at least, on one side as well as a through-hole on a desired position and the hole is filled with a conductive resin 5, the element surface of the semiconductor chip 7 and the main surface of the circuit board are closely bonded facing each other by means of adhesive tape 4, and then, electrically connected and fixed by heating and hardening the conductive resin 5. Thus, it is made possible to perform the flip-chip mounting, thereby obtaining a semiconductor device being superior in productivity and economics.
COPYRIGHT: (C)1992,JPO&Japio
JP33389790A 1990-11-29 1990-11-29 Semiconductor device and manufacture thereof Pending JPH04199723A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33389790A JPH04199723A (en) 1990-11-29 1990-11-29 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33389790A JPH04199723A (en) 1990-11-29 1990-11-29 Semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH04199723A true JPH04199723A (en) 1992-07-20

Family

ID=18271182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33389790A Pending JPH04199723A (en) 1990-11-29 1990-11-29 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH04199723A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1061574A1 (en) * 1999-06-17 2000-12-20 Ming-Tung Shen Semiconductor device and method for manufacturing the same
EP1065718A1 (en) * 1999-06-17 2001-01-03 Ming-Tung Shen Semiconductor chip module and method for manufacturing the same
US6278183B1 (en) 1999-04-16 2001-08-21 Ming-Tung Shen Semiconductor device and method for manufacturing the same
US6359334B1 (en) * 1999-06-08 2002-03-19 Micron Technology, Inc. Thermally conductive adhesive tape for semiconductor devices and method using the same
US6586277B2 (en) 1999-07-30 2003-07-01 Micron Technology, Inc. Method and structure for manufacturing improved yield semiconductor packaged devices
US6734041B2 (en) 1999-04-16 2004-05-11 Ming-Tung Shen Semiconductor chip module and method for manufacturing the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6734041B2 (en) 1999-04-16 2004-05-11 Ming-Tung Shen Semiconductor chip module and method for manufacturing the same
US6278183B1 (en) 1999-04-16 2001-08-21 Ming-Tung Shen Semiconductor device and method for manufacturing the same
US6420210B2 (en) 1999-04-16 2002-07-16 Computech International Ventures Limited Semiconductor device and method for manufacturing the same
US6737299B1 (en) 1999-06-08 2004-05-18 Micron Technology, Inc. Thermally conductive adhesive tape for semiconductor devices and method for using the same
US6359334B1 (en) * 1999-06-08 2002-03-19 Micron Technology, Inc. Thermally conductive adhesive tape for semiconductor devices and method using the same
EP1061574A1 (en) * 1999-06-17 2000-12-20 Ming-Tung Shen Semiconductor device and method for manufacturing the same
EP1065718A1 (en) * 1999-06-17 2001-01-03 Ming-Tung Shen Semiconductor chip module and method for manufacturing the same
US6586277B2 (en) 1999-07-30 2003-07-01 Micron Technology, Inc. Method and structure for manufacturing improved yield semiconductor packaged devices
US6774480B1 (en) 1999-07-30 2004-08-10 Micron Technology, Inc. Method and structure for manufacturing improved yield semiconductor packaged devices
US6902956B2 (en) 1999-07-30 2005-06-07 Micron Technology, Inc. Method and structure for manufacturing improved yield semiconductor packaged devices

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