JPS59127988A - Laser working machine - Google Patents

Laser working machine

Info

Publication number
JPS59127988A
JPS59127988A JP58002575A JP257583A JPS59127988A JP S59127988 A JPS59127988 A JP S59127988A JP 58002575 A JP58002575 A JP 58002575A JP 257583 A JP257583 A JP 257583A JP S59127988 A JPS59127988 A JP S59127988A
Authority
JP
Japan
Prior art keywords
support
workpiece
posts
laser
processing machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58002575A
Other languages
Japanese (ja)
Other versions
JPS6353000B2 (en
Inventor
Yukio Ogawa
幸夫 小川
Teruo Sakai
照男 坂井
Koshu Nagashima
長嶋 弘修
Kiyoshi Araki
荒木 清
Noriyuki Asai
浅井 典之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pentax Corp
Original Assignee
Asahi Kogaku Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kogaku Kogyo Co Ltd filed Critical Asahi Kogaku Kogyo Co Ltd
Priority to JP58002575A priority Critical patent/JPS59127988A/en
Publication of JPS59127988A publication Critical patent/JPS59127988A/en
Publication of JPS6353000B2 publication Critical patent/JPS6353000B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To eliminate deviation in a focal point and to prevent the damage on supporting posts in a working installation wherein a laser irradiating part and a supporting part for a working member make two-dimensional movement by sinking automatically the member supporting posts right under laser irradiation. CONSTITUTION:Supporting posts 18 for a member 20 are installed on supporting bars 17 in parallel with the scanning direction of an irradiating head 13. The bars 17 are supported by slide bars 23 having the oblong holes 16 and wedge plates 25 of guide plates 14. The bars 23 are moved by the cam grooves 26 of a base plate 10 and sink the posts 18 by wedging. The grooves 26 are provided under the scanning line of the head 13 and the posts 18 right under the irradiated part are always sunk. The adjacent front and rear posts 18 do not sink and therefore the focal point does not deviate. The damage at the top end of the posts 18 is obviated. It is also possible to make the posts 18 of flat plates.

Description

【発明の詳細な説明】 本発明は、レーザ加工機に係り、特にその被加工物支持
装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing machine, and particularly to a workpiece support device thereof.

レーザ加工機は一般に、被加工物を載置する支持装置と
、レーザ照射部とに相対的な二次元運動を与えなからレ
ーザ光を加工物に照射して切断、孔あけ等の加工を行な
うものである。ところで従来の支持装置は多数の円錐状
支持ポストを平面的に多数並べてなっており、被加工物
は単にこの支持ポスト上に載置されている。支持ポスト
を円錐状にするのは被加工物との接触面積を最小にする
ためであるが、レーザ光による切断、孔あけ箇所の真下
に支持ポストの先端が来た場合には、集光寝れたレーザ
光が被加工物の加工済の溝や孔を通って支持ポスト−h
端に照射されるのを避けることができない。このためポ
スト」一部がレーザ光により破損したり、また支持ポス
ト上部で反射したレーザ光が再度被加工物に照射されて
不要な加工を施してしまい、その結果、加工精度の低下
や加工面の乱れ等の加工不良を発生させる原因となって
いた。ざらにレーザ加工時には通常加工部にアシストガ
スな吹きつけることが行なわれるが、従来装置ではこの
ガス流が被加工物の加工済の孔や溝を通って支持ポスト
上部に当って乱れることがあり、このガス流の乱れの影
響で加工不良が発生することがあった。また同一パター
ンを多数切断する場合には加工不良を防止するために支
持ポストの真上を避けて切断しなければならず、このた
め材料取りに無駄の生じることがあった。
Laser processing machines generally perform processes such as cutting and drilling by irradiating the workpiece with laser light without applying relative two-dimensional movement between a support device on which the workpiece is placed and a laser irradiation unit. It is something. By the way, a conventional support device has a large number of conical support posts arranged in a plane, and the workpiece is simply placed on these support posts. The purpose of making the support post conical is to minimize the contact area with the workpiece, but if the tip of the support post is directly below the point where the laser beam is used to cut or drill holes, it may cause light condensation. The laser beam passes through the machined grooves and holes of the workpiece and attaches to the support post-h.
It is impossible to avoid being irradiated at the edges. As a result, part of the post may be damaged by the laser beam, or the laser beam reflected from the upper part of the support post may be irradiated onto the workpiece again, resulting in unnecessary machining, resulting in a decrease in machining accuracy and the machined surface. This caused machining defects such as irregularities in the process. During rough laser processing, assist gas is normally blown onto the processed area, but with conventional equipment, this gas flow may pass through the holes and grooves already machined in the workpiece and hit the top of the support post, causing disturbances. However, machining defects may occur due to the turbulence of this gas flow. Furthermore, when cutting a large number of the same pattern, it is necessary to avoid cutting directly above the support post to prevent machining defects, which may result in wasted material.

本発明は、このような問題点を解消するべくなされたも
ので、被加工物支持装置を三個以−にの支持セグメント
に分割してこれらをそれぞれ独立して上下動可能となし
、かつこれらの支持セグメントをレーザ照射部の該支持
セグメント」−への相対移動に連動させて下降させるこ
とにより、その支持セグメント上で加工が行なわれてい
るときには該支持セグメントと被加工物とを非接触状態
とし、もって支持装置のレーザ光による破損、あるいは
レーザ光の支持装置による反射に起因する不要で有害な
加工が発生しないようにしたことを特徴としている。
The present invention has been made in order to solve these problems, and the workpiece support device is divided into three or more support segments, each of which can be moved up and down independently, and By lowering the support segment in conjunction with the relative movement of the laser irradiation unit to the support segment, the support segment and the workpiece can be kept in a non-contact state when processing is performed on the support segment. This is characterized in that unnecessary and harmful processing due to damage to the support device caused by the laser beam or reflection of the laser beam by the support device does not occur.

以下図示実施例について本発明を説明する。The invention will now be described with reference to illustrated embodiments.

レーザ加工機は前述のようしこ被加工物とレーザ光との
間に相対的な二次元運動を与えながら加工するものであ
るが、以下の実施例は被加工物をX方向に、レーザ光を
Y方向に移動させる場合についての実施例である。第1
図ないし第4図は本発明の第一の実施例を示すもので、
ベースプレート10上には、リニアローラガイド11を
介してスライドテーブル12が一方向に摺動自在に支持
されており、ベースプレー)10の」一方にはレーザ照
射部13が位置している。スライドテーブル12の摺動
方向をX方向とすると、レーザ照射部13はベースプレ
ート10上の定位置でスライドテーブル12の移動とは
無関係に、X方向と直交するY方向に移動できるように
構成されている。
The laser processing machine processes the workpiece described above while giving a relative two-dimensional movement to the laser beam, but in the following embodiment, the workpiece is moved in the X direction by the laser beam. This is an example in which the image is moved in the Y direction. 1st
The figures to FIG. 4 show a first embodiment of the present invention,
A slide table 12 is supported on the base plate 10 via a linear roller guide 11 so as to be slidable in one direction, and a laser irradiation section 13 is located on one side of the base plate 10. Assuming that the sliding direction of the slide table 12 is the X direction, the laser irradiation unit 13 is configured to be able to move in the Y direction perpendicular to the X direction, regardless of the movement of the slide table 12 at a fixed position on the base plate 10. There is.

本発明の特徴とする被加工物支持装置は上記スライドテ
ーブル12に支持されている。スライドテーブル12は
その両側にX方向に向いた案内板14.14を一体に立
設しており、この案内板14.14間にY方向を向く複
数(この実施例では7個)の支持セグメント15が」−
下動可能に支持されている。支持セグメント15は、そ
の両端が案内板14の縦方向の長孔16に上下動可能に
挿入ぎれる断面長方形の支持パー17と、この支持バー
17」;に立設した複数の円錐状支持ポスト18と、支
持バー17から下方に突設した上下ガイド19とを有し
ており、被加工物20は支持ボス)18の上端点状部間
に支持される。21は支持バー17の案内板14からの
突出端に嵌められ、支持バー17の抜けを防ぐと同時に
Y方向の動きを規制する抜は止めピンである。
A workpiece support device, which is a feature of the present invention, is supported by the slide table 12. The slide table 12 has guide plates 14.14 oriented in the X direction integrally erected on both sides thereof, and between the guide plates 14.14 a plurality of (seven in this embodiment) support segments facing the Y direction are installed. 15”-
It is supported so that it can be moved downward. The support segment 15 includes a support bar 17 with a rectangular cross section whose both ends are vertically movably inserted into the longitudinal elongated hole 16 of the guide plate 14, and a plurality of conical support posts 18 erected on the support bar 17''. and a vertical guide 19 protruding downward from the support bar 17, and the workpiece 20 is supported between the dots at the upper ends of the support bosses 18. Reference numeral 21 denotes a retaining pin that is fitted into the protruding end of the support bar 17 from the guide plate 14 to prevent the support bar 17 from coming off and at the same time restrict its movement in the Y direction.

上記支持バー17の下方にはそれぞれ支持バー17と同
一方向を向くスライドパー22が支持されている。この
スライドパー22は案内板14のガイド孔23に摺動可
能に挿入したもので、その上面に、支持バー17の上下
ガイド19下面の傾斜部24と対応する模板25が固定
されている。
Slide pars 22 facing in the same direction as the support bars 17 are supported below the support bars 17, respectively. The slider 22 is slidably inserted into the guide hole 23 of the guide plate 14, and a pattern plate 25 is fixed to the upper surface of the slider 22, which corresponds to the inclined portion 24 on the lower surface of the upper and lower guides 19 of the support bar 17.

喫板25は第3図右方に摺動したとき傾斜部24を介し
支持セグメント15を上方の被加工物保持位置に上昇さ
せ、同左方に摺動したとき支持セグメント15を下降さ
せる。
When the cutting plate 25 slides to the right in FIG. 3, it raises the support segment 15 to the upper workpiece holding position via the inclined portion 24, and when it slides to the left, it lowers the support segment 15.

しかしてこのスライドパー22はベースプレート10に
固定して設けたカム溝26により摺動位置を規制される
。すなわちスライドパー22の案内板14からの突出端
には下方を向くガイドピン27が一体に設けられ、他方
、ベースプレート10にはこれに固定した二枚のカム板
28.29によりカム溝26が形成されていて、このカ
ム溝26にガイドピン27が嵌入可能となっている。
However, the sliding position of the lever slider 22 is regulated by a cam groove 26 fixedly provided on the base plate 10. That is, a guide pin 27 facing downward is integrally provided at the protruding end of the slide par 22 from the guide plate 14, and on the other hand, a cam groove 26 is formed in the base plate 10 by two cam plates 28 and 29 fixed thereto. A guide pin 27 can be fitted into this cam groove 26.

そしてこのカム溝26は第1図に明らかなように台形状
をしていて、その中央部のX方向の位置がレーザ照射部
13がY方向に移動する真下と一致している。
As is clear from FIG. 1, this cam groove 26 has a trapezoidal shape, and the position of its center in the X direction coincides with the position directly below where the laser irradiation section 13 moves in the Y direction.

上記構成の木レーザ加工機は次のように作動する。いま
スライドテーブル12がX方向に移動すると、支持セグ
メント15のスライドパー22に突設したガイドピン2
7はカム溝26内を第1図のA、B、Cのように移動す
る。スライドパー22がA点からB点に移動するとガイ
ドピン27がカム溝26により外側に引かれ、その結果
スライドパー22および僕板25は第3図左方に移動す
るため、支持セグメント15をに方の被加工物20の保
持位置に上昇させていた力が無くなり、支持セグメント
15は第4図のように下降する。
The wood laser processing machine configured as described above operates as follows. When the slide table 12 moves in the X direction, the guide pin 2 protruding from the slide par 22 of the support segment 15
7 moves within the cam groove 26 as shown in A, B, and C in FIG. When the slide par 22 moves from point A to point B, the guide pin 27 is pulled outward by the cam groove 26, and as a result, the slide par 22 and the plate 25 move to the left in FIG. The force that had raised the workpiece 20 to the holding position is no longer present, and the support segment 15 is lowered as shown in FIG.

すなわちスライドパー22がA点からB点に来るとその
支持セグメン)15の支持ポスト18は被加工物20か
ら離れることとなる。そしてこのときの支持セグメン)
15の位置はレーザ照射部13が移動し、またはその後
移動するY方向と一致しているから、レーザ照射部13
からのレーザ光をその真下の支持セグメン)15が受け
る可能性は非常に少なくなる。なおこのとき被加工物2
0は他の支持セグメント15により保持されるから加工
に悪影響が生じることはない。
In other words, when the slide par 22 moves from point A to point B, the support post 18 of its support segment 15 separates from the workpiece 20. And the supporting segment at this time)
Since the position 15 coincides with the Y direction in which the laser irradiation unit 13 moves or moves thereafter, the laser irradiation unit 13
There is a very small possibility that the support segment (15) directly below will receive laser light from the support segment (15). Note that at this time, the workpiece 2
0 is held by the other support segments 15, so there is no adverse effect on processing.

次にスライドパー22がB点から0点に移動すると、今
度はカム溝26の作用によりスライドパー22が押し込
まれ第3図の状態に復する。そうすると僕板25が傾斜
部24および上下ガイド19を介して支持セグメント1
5、すなわち支持ポスト18を押し上げるから支持ポス
ト18は再びその上端点状部を被加工物20に当接させ
て該被加工物20を支持することになる。この状態は、
僕板25の楔角αを適当に設定することにより、スライ
ドテーブル12かさらにX方向に移動してガイドピン2
7がカム溝26から脱したのちも維持することができる
。いま模板25の楔角をαとし僕板25と傾斜部24間
の静止摩擦角を入(tan 入=用; 壓:静11−摩
擦係数)とすると、模板25を抜くのに要する最小の力
Fは、F=w[tan 入+tan (入−α)で表わ
される(賛は撲板25の両側面が受ける荷重)。櫟板2
5が自然に抜ける場合の条件はF=Oであるからα=2
人。
Next, when the slide par 22 moves from point B to point 0, the slide par 22 is pushed in by the action of the cam groove 26 and returns to the state shown in FIG. 3. Then, the servant board 25 passes through the inclined portion 24 and the upper and lower guides 19 to the support segment 1.
5, that is, since the support post 18 is pushed up, the support post 18 again brings its upper end dotted portion into contact with the workpiece 20 and supports the workpiece 20. This state is
By appropriately setting the wedge angle α of the plate 25, the slide table 12 is further moved in the X direction and the guide pin 2
7 can be maintained even after it comes out of the cam groove 26. Now, if the wedge angle of the pattern board 25 is α and the angle of static friction between the board 25 and the inclined part 24 is tan (tan = yi; 壓: static 11 - coefficient of friction), then the minimum force required to pull out the pattern board 25 is F is expressed as F=w[tan +tan (in - α) (the weight is the load that both sides of the fighting board 25 receive). Sword board 2
The condition when 5 comes out naturally is F=O, so α=2
Man.

すなわちαく2λであれば撲板25が自然に抜けること
はなく、模板25と傾斜部24の関係は自動的に締まる
締まり機構となり、模板25、つまり支持パー17が自
然に抜けることはない。
That is, if α is 2λ, the punch board 25 will not come off naturally, and the relationship between the pattern board 25 and the inclined portion 24 will be a tightening mechanism that automatically tightens, and the pattern board 25, that is, the support par 17 will not come out naturally.

もっとも模板25の楔角をこのように設定しなくとも、
例えばガイドピン27を、スライドテーブル12の全移
動域において確動カムに係合させて規制し、あるいはば
ねを用いてスライドパー22を第3図右方に摺動付勢す
れば」−記と同様の作用を得ることができる。さらに支
持セグメント15の−L下動はこの他油空圧を用いた機
構、電気的な機構によっても明らかに得ることができる
が、図示実施例によれば、特別な動力源を必要とせず、
単純な構造にして確実な作動が得られるという利点があ
る。
However, even if the wedge angle of the pattern board 25 is not set in this way,
For example, if the guide pin 27 is engaged with a positive cam to restrict the entire movement range of the slide table 12, or if a spring is used to urge the slide par 22 to slide to the right in FIG. A similar effect can be obtained. Further, the -L downward movement of the support segment 15 can obviously be achieved by a mechanism using hydraulic pneumatics or an electric mechanism, but according to the illustrated embodiment, no special power source is required.
It has the advantage of having a simple structure and reliable operation.

第5図、第6図は本発明の別の実施例を示すものである
。この実施例は支持セグメント15の形状を第一の実施
例とは異ならせたもので、これ以外の部分はすべて第一
の実施例と同一である。支持セグメント15はその上端
に平らな帯状板30を有しており、その上面には微細な
V溝31が連続して形成しである。被加工物の支持装置
として帯状板のような平らな板を利用することは、支持
装置のレーザ光による破損の危険、およびレーザ光の支
持装置による反射の可能性が増加することから、従来の
レーザ加工機ではできなかったのであるが、本発明では
支持セグメント15がレーザ光の照射に応動して下降す
るためこのような帯状板の利用が可能となる。そしてこ
のような平らな板から支持セグメントを構成すれば、従
来の円錐」−の支持ポストでは凹凸が生じて支持できな
かった柔軟な材料、例えば布やシート材等にもレーザ加
工を施すことができる。なおV溝31は万一レーザ光が
帯状板30に照射された場合に、反射光が元の方向に戻
るのを防ぐ作用をする。
5 and 6 show another embodiment of the present invention. This embodiment differs from the first embodiment in the shape of the support segment 15, and all other parts are the same as in the first embodiment. The support segment 15 has a flat strip plate 30 at its upper end, and a fine V-groove 31 is continuously formed on the upper surface thereof. Using a flat plate such as a strip plate as a support device for the workpiece increases the risk of damage to the support device by the laser beam, and increases the possibility that the laser beam will be reflected by the support device. Although this could not be done with a laser processing machine, in the present invention, the support segment 15 descends in response to laser beam irradiation, making it possible to use such a strip plate. By constructing support segments from such flat plates, it is also possible to perform laser processing on flexible materials such as cloth and sheet materials, which could not be supported with conventional conical support posts due to their unevenness. can. Note that the V-groove 31 functions to prevent reflected light from returning to its original direction in the event that the strip plate 30 is irradiated with laser light.

なお支持セグメン)15は被加工物20の支持の安定性
を考慮すると、多数に分割した方が好ましいが、理論的
には五個以上に分割すれば本発明は成立する。
Note that it is preferable that the support segment 15 is divided into a large number of parts in consideration of the stability of supporting the workpiece 20, but theoretically, the present invention can be realized if the support segment 15 is divided into five or more parts.

以上要するに本発明は、被加工物を支持する三個以」−
の支持セグメントをレーザ照射部下部への相対移動に連
動させて下降させるようにしたから、レーザ光が支持装
置に当る可能性が減り、したがって支持装置自体の破損
のおそれはもとより、支持装置によって反射するレーザ
光による加工精度の悪化をも未然に防止することができ
る。
In summary, the present invention provides three or more parts that support the workpiece.
Since the supporting segment of the laser beam is lowered in conjunction with the relative movement toward the lower part of the laser irradiation unit, the possibility that the laser beam will hit the supporting device is reduced, and there is a risk of damage to the supporting device itself, as well as being reflected by the supporting device. It is also possible to prevent deterioration of processing accuracy due to laser light.

また仮にレーザ光が当っても、支持セグメントは下降し
ていて、レーザ光のエネルギ密度が最大となる焦点位置
にはないから、レーザ光による損傷はほとんど生ぜず、
周囲に対する安全度が増す。
Furthermore, even if the laser beam were to hit the support segment, it would not be damaged by the laser beam because it is lowered and is not at the focal point where the energy density of the laser beam is at its maximum.
Increased safety for the surrounding area.

さらに支持装置に起因してアシストガスが乱れることが
なくなるから、加工精度をさらに向上させることが可能
となり、また加T位置に制約がなくなるので、材料取り
に無駄が生じることなく経済1 性を高めることができる。
Furthermore, since the assist gas is no longer disturbed by the support device, it is possible to further improve machining accuracy, and since there are no restrictions on the T position, there is no waste in material removal, increasing economy. be able to.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係るレーザ加工機の実施例を示す平面
図、第2図は同正面図、第3図、第4図はそれぞれ第1
図の■−■線、IV−IV線に沿う断面図、第5図は本
発明の他の実施例を示す平面図、第6図は同正面図であ
る。 10・・・ベースプレート、12・・・スライドテーブ
ル、13・・・レーザ照射部、14川案内板、15・・
・支持セグメント、17・・・支持バー、18・・・支
持ポスト、20・・・被加工物、22・・・スライドバ
ー、24・・・傾斜部、25・・・僕板、26・・・カ
ム溝、27・・・ガイドビン27.3o・・・帯状板。 特許出願人  旭光学工業株式会社 同代理人    三 浦 邦 夫 2 47
FIG. 1 is a plan view showing an embodiment of a laser processing machine according to the present invention, FIG. 2 is a front view of the same, and FIGS.
5 is a plan view showing another embodiment of the present invention, and FIG. 6 is a front view thereof. 10... Base plate, 12... Slide table, 13... Laser irradiation part, 14 River guide board, 15...
-Support segment, 17... Support bar, 18... Support post, 20... Workpiece, 22... Slide bar, 24... Inclined part, 25... Private board, 26... - Cam groove, 27...Guide bin 27.3o...Strip plate. Patent applicant: Asahi Optical Industry Co., Ltd. Agent: Kunio Miura 2 47

Claims (1)

【特許請求の範囲】 (1)被加工物を載置する支持装置と、上記被加工物に
レーザ光を照射するレーザ照射部とからなり、この支持
装置とレーザ照射部とに相対的な二次元運動を与えて被
加工物を加工するレーザ加工機において、上記支持装置
を独立して」−下動しうる三以上の支持セグメントに分
割し、これらの支持セグメントを常時は被加工物の支持
位置に保持し、−上記レーザ照射部の該支持セグメント
上への相対移動に連動させて下降させるようにしたこと
を特徴とするレーザ加工機。 (2、特許請求の範囲第1項において、支持セグメント
は複数の円錐状支持ポストを有し、このポストの上端点
状部で被加工物を支持するレーザ加工機。 (3)特許請求の範囲第1項において、支持セグメント
は、被加工物と平行でこれを支持する帯状板を有してい
るレーザ加工機。 (4)特許請求の範囲第1項ないし第3項のいずれか−
において、支持セグメントはその下面に傾斜部を有し、
この傾斜部はスライドバーの楔板と係合しており、スラ
イドバーはガイドピンを一体に有していてこのガイドピ
ンとカム溝の係合により、支持装置とレーザ照射部の相
対移動に応動して」−記スライドバーがスライドし、そ
れに伴ない支持セグメントが」二下動するレーザ加工機
。 (5)特許請求の範囲第4項において、楔板の僕角は、
外力を加えない限り支持セグメントに対して移動しない
ように設定されているレーザ加工機。
[Scope of Claims] (1) Consisting of a support device on which a workpiece is placed and a laser irradiation section that irradiates the workpiece with laser light, the relative position between the support device and the laser irradiation section is In a laser processing machine that processes a workpiece by applying dimensional motion, the above-mentioned support device is divided into three or more support segments that can move downward independently, and these support segments are normally used to support the workpiece. 1. A laser processing machine, wherein the laser processing machine is held in position and lowered in conjunction with relative movement of the laser irradiation section onto the support segment. (2. Scope of Claims In claim 1, the support segment has a plurality of conical support posts, and the workpiece is supported at the dot-shaped upper end of the posts. (3) Scope of Claims In claim 1, the support segment is a laser processing machine having a strip plate that is parallel to and supports the workpiece. (4) Any one of claims 1 to 3.
, the support segment has a sloped portion on its lower surface;
This inclined portion engages with the wedge plate of the slide bar, and the slide bar has an integral guide pin, and the engagement between the guide pin and the cam groove responds to the relative movement of the support device and the laser irradiation unit. A laser processing machine in which the slide bar slides and the support segment moves downwards accordingly. (5) In claim 4, the free angle of the wedge plate is:
A laser processing machine that is set so that it does not move relative to the support segment unless an external force is applied.
JP58002575A 1983-01-11 1983-01-11 Laser working machine Granted JPS59127988A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58002575A JPS59127988A (en) 1983-01-11 1983-01-11 Laser working machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58002575A JPS59127988A (en) 1983-01-11 1983-01-11 Laser working machine

Publications (2)

Publication Number Publication Date
JPS59127988A true JPS59127988A (en) 1984-07-23
JPS6353000B2 JPS6353000B2 (en) 1988-10-20

Family

ID=11533168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58002575A Granted JPS59127988A (en) 1983-01-11 1983-01-11 Laser working machine

Country Status (1)

Country Link
JP (1) JPS59127988A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS623892A (en) * 1985-06-28 1987-01-09 Amada Co Ltd Work supporting equipment for thermal cutting machine
JPS6380991A (en) * 1986-09-26 1988-04-11 Amada Co Ltd Method and device for cutting
JPS63123568A (en) * 1986-11-11 1988-05-27 Koike Sanso Kogyo Co Ltd Structure of cutting device and cutting surface plate
JPS6438194U (en) * 1987-02-10 1989-03-07
EP1731256A1 (en) * 2005-05-30 2006-12-13 Hans Dietle Laser processing table with movable workpiece supporting elements
WO2007134628A1 (en) * 2006-05-24 2007-11-29 Trumpf Werkzeugmaschinen Gmbh + Co.Kg Workpiece support for receiving an especially tabular workpiece in a machining installation comprising mobile supporting elements provided with carrier tips
EP1992443A1 (en) * 2006-12-22 2008-11-19 Panasonic Corporation Laser processing apparatus and laser processing method using the same
US8172211B2 (en) 2006-05-24 2012-05-08 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Work rests for supporting a workpiece in a machining unit and machining units containing such work rests
EP2626165A1 (en) 2012-02-07 2013-08-14 Bystronic Laser AG Work piece support
NL2008731C2 (en) * 2012-04-27 2013-10-29 Therp Holding B V Work piece support with improved supporting elements.
IT201900014355A1 (en) * 2019-08-08 2021-02-08 Fonderia Vigano Srl SUPPORT UNIT FOR A SHEET METAL CUTTING BENCH, METHOD OF CONSTRUCTION AND CUTTING BENCH FITTED WITH THIS UNIT

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS623892A (en) * 1985-06-28 1987-01-09 Amada Co Ltd Work supporting equipment for thermal cutting machine
JPS6380991A (en) * 1986-09-26 1988-04-11 Amada Co Ltd Method and device for cutting
JPS63123568A (en) * 1986-11-11 1988-05-27 Koike Sanso Kogyo Co Ltd Structure of cutting device and cutting surface plate
JPS6438194U (en) * 1987-02-10 1989-03-07
EP1731256A1 (en) * 2005-05-30 2006-12-13 Hans Dietle Laser processing table with movable workpiece supporting elements
US8382087B2 (en) 2006-05-24 2013-02-26 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Work rests for supporting a workpiece in a machining unit and machining units containing such work rests
US8172211B2 (en) 2006-05-24 2012-05-08 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Work rests for supporting a workpiece in a machining unit and machining units containing such work rests
WO2007134628A1 (en) * 2006-05-24 2007-11-29 Trumpf Werkzeugmaschinen Gmbh + Co.Kg Workpiece support for receiving an especially tabular workpiece in a machining installation comprising mobile supporting elements provided with carrier tips
EP1992443A1 (en) * 2006-12-22 2008-11-19 Panasonic Corporation Laser processing apparatus and laser processing method using the same
EP1992443A4 (en) * 2006-12-22 2010-11-17 Panasonic Corp Laser processing apparatus and laser processing method using the same
US9421638B2 (en) 2006-12-22 2016-08-23 Panasonic Intellectual Property Management Co., Ltd. Laser processing apparatus and laser processing method using the same technical field
EP2626165A1 (en) 2012-02-07 2013-08-14 Bystronic Laser AG Work piece support
NL2008731C2 (en) * 2012-04-27 2013-10-29 Therp Holding B V Work piece support with improved supporting elements.
IT201900014355A1 (en) * 2019-08-08 2021-02-08 Fonderia Vigano Srl SUPPORT UNIT FOR A SHEET METAL CUTTING BENCH, METHOD OF CONSTRUCTION AND CUTTING BENCH FITTED WITH THIS UNIT

Also Published As

Publication number Publication date
JPS6353000B2 (en) 1988-10-20

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