JPS59127968A - Positioning jig for leadless parts - Google Patents
Positioning jig for leadless partsInfo
- Publication number
- JPS59127968A JPS59127968A JP58002857A JP285783A JPS59127968A JP S59127968 A JPS59127968 A JP S59127968A JP 58002857 A JP58002857 A JP 58002857A JP 285783 A JP285783 A JP 285783A JP S59127968 A JPS59127968 A JP S59127968A
- Authority
- JP
- Japan
- Prior art keywords
- leadless
- printed wiring
- wiring board
- positioning
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
（発明の分野）
本発明はリードレス部品を印刷配線板上の所定位置に半
田接合する場合の位置決め治具に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of the Invention) The present invention relates to a positioning jig for soldering leadless components to predetermined positions on a printed wiring board.
（従来技術）
従来、リードレス部品の位置決めは作業者の目視による
位置決め、あるいは印刷配線板の基準穴を用い、リード
レス部品位置決め用穴を設けた治具を印刷配線板上へ基
準ビンにて位置合わせし、リードレス部品の位置決めを
行っていた。しかしながら目視による位置合わせではリ
ードレス部品が小型で複数の電極を有していることから
位置決めが難しく、部品の電極が所定のパターンに半田
付は接合されなかったり、所定外の・ぐターンと接合さ
れたりすることに々る。(Prior art) Conventionally, the positioning of leadless components has been done by visual inspection by an operator, or by using a reference hole on a printed wiring board, and placing a jig with holes for positioning the leadless component onto the printed wiring board using a reference bin. Positioning was performed and leadless components were positioned. However, positioning by visual inspection is difficult because leadless components are small and have multiple electrodes, and the electrodes of the components may not be soldered to the specified pattern or may be connected to a pattern other than the specified pattern. There are many things that can be done.
第１図に従来実施例によるリードレス部品の位置決め方
法ならびに位置決め治具を示す。第１図（ａ）はリード
レス部品の外観であり（１辺約１〜２０輔）、１４はリ
ードレス部品６の側面に設けられた接続部である。第１
図（ｂ）はリードレス部品位置決め用の治具４を示し、
３は治具４に明けられたリードレス部品位置決め用穴、
５は基準ｔンである。第１図（ｃ）は印刷配線基板１を
示し、２は前記治具４の基準ビンと挿嵌される基準穴で
ある。FIG. 1 shows a conventional method for positioning leadless components and a positioning jig. FIG. 1(a) shows the external appearance of the leadless component (approximately 1 to 20 pieces on each side), and 14 is a connecting portion provided on the side surface of the leadless component 6. 1st
Figure (b) shows a jig 4 for positioning leadless components,
3 is a hole drilled in jig 4 for positioning leadless components;
5 is the standard ton. FIG. 1(c) shows a printed wiring board 1, and 2 is a reference hole into which a reference bottle of the jig 4 is inserted.
第１図において、治具４はその対角線上の２隅に設けら
れた基準ビン５を印刷配線板１の基準穴２に挿嵌して位
置合わせされ、リードレス部品は印刷配線板及びリード
レス部品の両方又は一方にあらかじめ半田を供給してお
いだ状態でリードレス部品位置決め用穴３にはめられて
位置決めされ、全体を雰囲気炉、蒸気半田付装置、赤外
線リフロー装置、オイルデツプ等のりフロー装置により
全体を加熱し、半田を溶融せしめ、リードレス部品と印
刷配線板の・ぐターンとが接合されるものである。In FIG. 1, the jig 4 is aligned by inserting the reference bins 5 provided at two diagonal corners into the reference holes 2 of the printed wiring board 1. With solder supplied to both or one of the parts in advance, they are fitted into the leadless part positioning hole 3 and positioned, and the whole is soldered using a glue flow device such as an atmospheric furnace, steam soldering device, infrared reflow device, or oil dip. The whole is heated to melt the solder, and the leadless components and the printed circuit board's turns are joined together.
第２図はリードレス部品６が印刷配線板Ｉへ半田接合さ
れる前の状態を示す断面図であり、７は半田を示し、他
の記号は第１図と同じものを示す。FIG. 2 is a sectional view showing the state before the leadless component 6 is soldered to the printed wiring board I, where 7 indicates solder and other symbols are the same as in FIG. 1.
第３図は第２図の状態にてリフロー装置を用いてリード
レス部品６の半田接合を行った状態を示し、第４図はり
フロー半田付は後治具４を取り外した状態を示す。第４
図にて明らかなように、半田フィレットが接合部に形成
されず、はぼ均一の厚みにて半田接合がなされることか
ら、半田接合強度の低下を招く欠点がある。又第１図に
示した治具４を用いる場合、印刷配線板Ｉの基準穴２に
治具４の基準−ン５が挿入されているだけであり、取扱
い時において治具４が容易に外れたり、治具４の熱が印
刷配線板ならびにリードレス部品に影響を与えるという
欠点がある。（その目的上、治具４は変形、繰返し使用
に耐え得るように一般には金属で作られる。従って全体
を加熱した場合、治具の方が熱容量が大きく冷却時に印
刷配線板と温度差を生じることに起因するものである。FIG. 3 shows a state in which the leadless component 6 is soldered using a reflow apparatus in the state shown in FIG. 2, and FIG. 4 shows a state in which the post jig 4 is removed for flow soldering. Fourth
As is clear from the figure, since no solder fillet is formed at the joint and the solder joint is made with a fairly uniform thickness, there is a drawback that the strength of the solder joint is reduced. Furthermore, when using the jig 4 shown in Fig. 1, only the reference hole 5 of the jig 4 is inserted into the reference hole 2 of the printed wiring board I, and the jig 4 is easily removed during handling. Another disadvantage is that the heat of the jig 4 affects the printed wiring board and leadless components. (For that purpose, the jig 4 is generally made of metal so that it can withstand deformation and repeated use. Therefore, when the whole jig is heated, the jig has a larger heat capacity and a temperature difference with the printed wiring board occurs when it is cooled.) This is due to this.
）（発明の目的）
本発明の目的は、上記欠点を解決する為、印刷配線板を
固定する固定板とリードレス部品位置決め板から成る治
具を用いてリードレス部品を取りつけるものであり、以
下詳細に説明する。) (Object of the Invention) In order to solve the above-mentioned drawbacks, the object of the present invention is to mount leadless components using a jig consisting of a fixing plate for fixing a printed wiring board and a leadless component positioning plate. Explain in detail.
（発明の構成）
本発明は、印刷配線板上の所定位置にリードレス部品を
半田接合するリードレス部品の位置決め治具であって、
複数の点支持にてリードレス部品を位置決め固定する複
数のリードレス部品位置決め穴を有するリードレス部品
位置決め板と、印刷配線板を挾んで前記リードレス部品
位置決め板を載せ前記印刷配線板上下者々に間隙をおい
て前記印刷配線板ならびに前記リードレス部品位置決め
板を点支持かつ係合固定する複数の突部を有する印刷配
線板固定板とから構成される。(Structure of the Invention) The present invention is a leadless component positioning jig for soldering a leadless component to a predetermined position on a printed wiring board, comprising:
A leadless component positioning plate having a plurality of leadless component positioning holes for positioning and fixing the leadless component by supporting at a plurality of points, and a printed wiring board on which the leadless component positioning board is placed between the printed wiring board and the upper and lower parts of the printed wiring board. and a printed wiring board fixing plate having a plurality of protrusions for point-supporting and engagingly fixing the printed wiring board and the leadless component positioning plate at intervals.
（第１の実施例）
第５図は本発明の第１の実施例を説明するものであり、
１０は印刷配線板固定板、１１はガイドぎン、１２は印
刷配線板支持ビン、１３はリードレス部品位置決め板支
持ピン、１は印刷配線板、２は基準穴、３０はリードレ
ス部品位置決め板、３１はガイド穴、３はリードレス部
品位置決め穴である。第５図において、印刷配線板１は
２カ所の基準穴２を基準ビン５に各々挿入して印刷配線
板固定板ＩＯ上の複数個の印刷配線板支持ビン１２にて
支持され、その上にリードレス部品位置決め板３０をガ
イド穴３１に印刷配線板固定板（５）
１θのがイドピン１１に挿入して３者を各々固定してい
る。このような状態で第１図（ａ）に示すＩＪ−ドレス
部品６をリードレス部品位置決め板３０のリードレス部
品位置決め穴３に嵌められ、リフロー半田付けされる。(First Embodiment) FIG. 5 explains the first embodiment of the present invention,
10 is a printed wiring board fixing plate, 11 is a guide pin, 12 is a printed wiring board support bin, 13 is a leadless component positioning plate support pin, 1 is a printed wiring board, 2 is a reference hole, 30 is a leadless component positioning plate , 31 is a guide hole, and 3 is a leadless component positioning hole. In FIG. 5, the printed wiring board 1 is supported by a plurality of printed wiring board support bins 12 on the printed wiring board fixing plate IO by inserting the two reference holes 2 into the reference bins 5, and The leadless component positioning plate 30 is inserted into the guide hole 31, and the printed wiring board fixing plate (5) 1θ is inserted into the id pin 11 to fix each of the three members. In this state, the IJ-dress component 6 shown in FIG. 1(a) is fitted into the leadless component positioning hole 3 of the leadless component positioning plate 30 and reflow soldered.
この場合、リードレス部品位置決め穴３は第５図に示す
ように４隅が突状態となっており、リードレス部品６が
４隅でのみ位置決めされ、穴の側面とは接触しない構造
となっている。In this case, the leadless component positioning hole 3 has four protruding corners as shown in FIG. 5, and the leadless component 6 is positioned only at the four corners and does not come into contact with the side surfaces of the hole. There is.
第６図はリードレス部品６とリードレス部品位置決め板
３０ならびに印刷配線板ｌとの関係を示す断面図である
。リードレス部品６は上述したようにリードレス部品位
置決め板３０とはリードレス部品位置決め穴３の４隅に
て位置決め固定されている為、リードレス部品位置決め
穴３の側面と間隙をおいだ状態となっている。しだがっ
てり−ドレス部品６は印刷配線板１上に半田フィレット
１５を形成し・て半田接合されることになり、接合部の
強度を強くすることができる。又、リードレス部品位置
決め板３０ならびに印刷配線板固定板（６）
１０は治具という性格から印刷配線板Ｉの材質よりも比
較的強度の強い材料（金属等）で作られている為、高温
の雰囲気中でリフロー半田した場合、リードレス部品位
置決め板３０ならびに印刷配線板固定板１０の方が冷却
時に温度勾配を持ち高温と々る。そして本実施例の場合
、印刷配線板１がリードレス部品位置決め板３０ならび
に印刷配線板固定板ｌＯのいずれとも直接接触していな
い為、基板に力える温度影響が少い。FIG. 6 is a sectional view showing the relationship between the leadless component 6, the leadless component positioning plate 30, and the printed wiring board l. As mentioned above, the leadless component 6 is positioned and fixed to the leadless component positioning plate 30 at the four corners of the leadless component positioning hole 3, so it is in a state where it is spaced from the side surface of the leadless component positioning hole 3. It has become. Therefore, the slant-dressing component 6 is solder-bonded by forming a solder fillet 15 on the printed wiring board 1, thereby increasing the strength of the bonded portion. In addition, since the leadless component positioning plate 30 and the printed wiring board fixing plate (6) 10 are made of a material (metal, etc.) that is relatively stronger than the material of the printed wiring board I due to their nature as jigs, they are not exposed to high temperatures. When reflow soldering is performed in the atmosphere, the leadless component positioning plate 30 and the printed wiring board fixing plate 10 have a temperature gradient during cooling and reach a high temperature. In the case of this embodiment, since the printed wiring board 1 is not in direct contact with either the leadless component positioning plate 30 or the printed wiring board fixing plate IO, the influence of temperature exerted on the board is small.
以上説明したように、第１の実施例では印刷配線板１を
強度の強い印刷配線板固定板１０とＩＪ−ドレス部品位
置決め板３０により点接触状態で挾み込み、リードレス
部品６をリードレス部品位置決め板３０のリードレス部
品位置決め穴３内に点接触で位置決めする構造となって
いる為、リードレス部品をリフロー半田付は装置に装着
する際に治具が容易に外れることなく、又高温雰囲気中
でリフロー半田側けを行った場合に治具（リードレス部
品位置決め板３０と印刷配線板固定板１０）の熱による
印刷配線板への影響を少なくすることができる。更にリ
ードレス部品６と印刷配線板１とは容易に半田フィレッ
トを形成でき、強固に半田接合するととが出来る利点を
有する。As explained above, in the first embodiment, the printed wiring board 1 is sandwiched between the strong printed wiring board fixing plate 10 and the IJ-dress component positioning plate 30 in a point contact state, and the leadless component 6 is mounted in the leadless state. Since the structure is such that positioning is performed by point contact within the leadless component positioning hole 3 of the component positioning plate 30, the jig does not easily come off when reflow soldering the leadless component to the equipment, and it does not require high temperatures. When reflow soldering is performed in an atmosphere, the influence of heat from the jig (leadless component positioning plate 30 and printed wiring board fixing plate 10) on the printed wiring board can be reduced. Furthermore, the leadless component 6 and the printed wiring board 1 have the advantage that a solder fillet can be easily formed and a strong solder joint can be achieved.
（第２の実施例）
第１の実施例では、リードレス部品６をリードレス部品
位置決め穴３の４隅にて位置決めを行い、リードレス部
品６とリードレス部品位置決め板３０の大側面間に間隙
を設けるようにした場合を示したが、第７図の断面図に
て示すようにリードレス部品位置決め板３２の厚さａ、
半田フィレットＩ５の高さｂ、リードレス部品６の厚み
をＣとし、ａ ＋ ｂ≦Ｃが成立するようにしても第１
の実施例の場合と同様の効果を提供できる。すなわち、
リードレス部品位置決め板の下面より印刷配線板のパタ
ーンまでの距離を半田フィレットが十分形成しうる長さ
とすることによっても、リードレス部品の位置決めなら
びに強固な半田接合が可能となる。又本実施例の場合、
リードレス部品６を第１の実施例と同様にリードレス部
品位置決め板の位置決め穴部の４隅において点支持する
場合あるいはリードレス部品６が直接位置決め穴の側面
と接触するようにした場合においても半田フィレットは
容易に形成される（但し後者の場合は治具の熱による影
響が大きく々る）。(Second Embodiment) In the first embodiment, the leadless component 6 is positioned at the four corners of the leadless component positioning hole 3, and the leadless component 6 is positioned between the large side surface of the leadless component positioning plate 30. Although the case where a gap is provided is shown, as shown in the cross-sectional view of FIG. 7, the thickness a of the leadless component positioning plate 32,
Even if the height b of the solder fillet I5 and the thickness of the leadless component 6 are set to C, and a + b≦C is satisfied, the first
The same effects as in the embodiment can be provided. That is,
By setting the distance from the bottom surface of the leadless component positioning plate to the pattern on the printed wiring board to a length that is sufficient to form a solder fillet, positioning of the leadless component and strong solder bonding are also possible. In addition, in the case of this example,
Even when the leadless component 6 is point-supported at the four corners of the positioning hole of the leadless component positioning plate as in the first embodiment, or when the leadless component 6 is brought into direct contact with the side surface of the positioning hole. Solder fillets are easily formed (however, in the latter case, the effect of the heat of the jig is significant).
（発明の効果）
本発明は印刷配線板を印刷配線板固定板とＩＪ−ドレス
部品位置決め板によって点接触状態で挾み込み、リード
レス部品をリードレス部品位置決め板の位置決め穴にて
点接触で位置決めするものであり、リードレス部品の位
置決めが確実に行えると共に、操作性が良く、熱による
影響も少なくすることができる。特に多ビンのリードレ
ス部品の組立に於いて品質性、作業性を向上させること
ができる。(Effects of the Invention) The present invention allows a printed wiring board to be sandwiched between a printed wiring board fixing plate and an IJ-dress component positioning plate in a point contact state, and a leadless component to be in point contact with a positioning hole in the leadless component positioning plate. This positioning device enables reliable positioning of leadless components, has good operability, and can reduce the effects of heat. Particularly in the assembly of multi-bin leadless parts, quality and workability can be improved.
第１図は従来のリードレス部品の位置決め方法ならびに
位置決め治具を示す説明図、第２図は従来実施例におい
てリードレス部品６が印刷配線板１へ半田接合される前
の状態を示す断面図、第３図は第２図の状態から半田接
合を行った後の状態（９）
を示す断面図、第４図は半田接合後治具４を取り外した
状態を示す断面図、第５図は本発明の第１の実施例を示
す説明図１、第６図は第１の実施例におけるリードレス
部品６の印刷配線板Ｉへの半田接合状態を示す断面図、
第７図は第２の実施例におけるリードレス部品６の印刷
配線板Ｉへの半田接合状態を示す断面図である。
１・・・印刷配線板、２・・・基準穴、３・・・リード
レス部品位置決め穴、５・・・基準ビン、６・・・リー
ドレス部品、１０・・・印刷配線板固定板、１１・・・
ガイドビン、１２・・・印刷配線板支持ビン、１３・・
・リードレス部品位置決め板支持ビン、１５・・・半田
フィレット、３０，３２・・・リードレス部品位置決め
板。
特許出願人 沖電気工業株式会社
（１０）
手続補正書（睦）
１．事件の表示
昭和５８年 特 許 間第００２８５７ 号２、発明
の名称
リードレス部品の位置決め治具
３ 補正をする者
事件との関係 特 許 出 願 人任 所（
〒１０５） 東京都港区虎ノ門１丁目７番１２号４、
代理人
住 所（〒１０５） 東京都港区虎ノ門１丁目７番１
２号沖電気工業株式会社内
氏名（６８９２） 弁理士 鈴木敏明電話 ５０１−
３１１１（大代表）
５、補正の対象 図面「第２図」
６補正の内容 別紙のとおシ補正する
第２図FIG. 1 is an explanatory diagram showing a conventional positioning method and positioning jig for leadless components, and FIG. 2 is a cross-sectional view showing a state before leadless component 6 is soldered to printed wiring board 1 in the conventional embodiment. , Fig. 3 is a sectional view showing the state (9) after soldering from the state shown in Fig. 2, Fig. 4 is a sectional view showing the state with the jig 4 removed after soldering, and Fig. 5 Explanatory drawings 1 and 6 showing a first embodiment of the present invention are cross-sectional views showing a state of soldering of a leadless component 6 to a printed wiring board I in the first embodiment,
FIG. 7 is a sectional view showing a state in which the leadless component 6 is soldered to the printed wiring board I in the second embodiment. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Reference hole, 3... Leadless component positioning hole, 5... Reference bin, 6... Leadless component, 10... Printed wiring board fixing plate, 11...
Guide bin, 12...Printed wiring board support bin, 13...
- Leadless component positioning plate support bin, 15...Solder fillet, 30, 32...Leadless component positioning plate. Patent Applicant Oki Electric Industry Co., Ltd. (10) Procedural Amendment (Mutsu) 1. Indication of the case 1982 Patent No. 002857 2 Title of the invention Positioning jig for leadless parts 3 Person making the amendment Relationship with the case Patent application Person in charge (
105) 1-7-12-4 Toranomon, Minato-ku, Tokyo.
Agent address (105) 1-7-1 Toranomon, Minato-ku, Tokyo
No. 2 Oki Electric Industry Co., Ltd. Name (6892) Patent attorney Toshiaki Suzuki Telephone number 501-
3111 (major representative) 5. Target of correction: Drawing “Figure 2” 6. Contents of correction: Figure 2 to be corrected as shown in the attached sheet
Claims (1)
るリードレス部品の位置決め治具であって、 複数の点支持にてリードレス部品を位置決め固定する複
数のリードレス部品位置決め穴を有するリードレス部品
位置決め板と、 印刷配線板を挾んで前記リードレス部品位置決め板を載
せ前記印刷配線板上下者々に間隙をおいて前記印刷配線
板ならびに前記リードレス部品位置決め板を点支持かつ
係合固定する複数の突部を有する印刷配線板固定板 とから構成されることを特徴とするリードレス部品の位
置決め治具。[Claims] A positioning jig for leadless components that solder joins the leadless components to predetermined positions on a printed wiring board, the jig comprising a plurality of leadless components that position and fix the leadless components by supporting at multiple points. A leadless component positioning board having a positioning hole; and a printed wiring board is sandwiched between the leadless component positioning plates, and the printed wiring board and the leadless component positioning board are placed with a gap between the upper and lower sides of the printed wiring board. 1. A positioning jig for leadless components, comprising a printed wiring board fixing plate having a plurality of protrusions for supporting, engaging and fixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58002857A JPS59127968A (en) | 1983-01-13 | 1983-01-13 | Positioning jig for leadless parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58002857A JPS59127968A (en) | 1983-01-13 | 1983-01-13 | Positioning jig for leadless parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59127968A true JPS59127968A (en) | 1984-07-23 |
| JPH0337466B2 JPH0337466B2 (en) | 1991-06-05 |
Family
ID=11541050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58002857A Granted JPS59127968A (en) | 1983-01-13 | 1983-01-13 | Positioning jig for leadless parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59127968A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5964397A (en) * | 1993-10-05 | 1999-10-12 | American Telephone & Telegraph Co. | Passive alignment of components with micromachined tool |
| JP2007216250A (en) * | 2006-02-15 | 2007-08-30 | Toyota Motor Corp | Brazed joint structure and its brazing method |
| JP2011143422A (en) * | 2010-01-13 | 2011-07-28 | Ckd Corp | Soldering apparatus and method for manufacturing lamp using the same |
| CN102935537A (en) * | 2012-07-27 | 2013-02-20 | 西安永电电气有限责任公司 | Welding fixture structure and welding method for n-shaped electrode based on insulated gate bipolar translator (IGBT) |
-
1983
- 1983-01-13 JP JP58002857A patent/JPS59127968A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5964397A (en) * | 1993-10-05 | 1999-10-12 | American Telephone & Telegraph Co. | Passive alignment of components with micromachined tool |
| JP2007216250A (en) * | 2006-02-15 | 2007-08-30 | Toyota Motor Corp | Brazed joint structure and its brazing method |
| JP2011143422A (en) * | 2010-01-13 | 2011-07-28 | Ckd Corp | Soldering apparatus and method for manufacturing lamp using the same |
| CN102935537A (en) * | 2012-07-27 | 2013-02-20 | 西安永电电气有限责任公司 | Welding fixture structure and welding method for n-shaped electrode based on insulated gate bipolar translator (IGBT) |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337466B2 (en) | 1991-06-05 |
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