JPS59127339A - Circuit breaking element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The invention relates to circuits and other necessary elements, and more specifically, to a fusible fuse disposed in an electric flow path of an electric device neck,
Ultra-compact 111) used in fuse resistors, etc. valley a
l'llT month 1 element month number element related.

Conventionally, this type of circuit breaker element has been constructed by directly layering a metal resistance film of copper, copper alloy, or chlorine on the surface of an electrically insulating base material such as ceramic by plating or vapor deposition. In any case, even if an overcurrent flows through the element and melts the metal resistance film, the circuit will be incompletely interrupted, resulting in a serious problem of lack of safety.

The reason for this is that the metal resistance film formed by plating or vapor deposition is thin and is provided directly on the surface of the electrically insulating base material, so it cannot be used under such conditions. In this case, even if the entertainment film melts due to excessive flow, the interval between melts is extremely small, and there is always residual resistance (500
Therefore, the interruption of the current is incomplete, and it is impossible to completely interrupt the circuit by fusing, which is an important function of the circuit breaking element. Table 1 shows the relationship between insulation resistance and time wave resistance based on the IS disconnection test.

Table -1 1 ' 0.706 I O,3j: 1 1 0576 1 06 '□ 0.340 :0.5 i 8A , 4.31 [o, o11
'1 1:1
0-81 1 o3: □ As is clear from the above table, in the case of a circuit breaking element in which a metal resistance film is directly layered on the surface of the base material, the insulation resistance when the metal film is fused is small, and the residual resistance is low. is found to be large.

The invention was completed as a result of various research aimed at eliminating the above-mentioned drawbacks.A low melting point organic insulating material layer is formed on the surface of an electrically insulating base material, and the surface of the insulating material layer is The present invention relates to a circuit breaking element characterized in that a metal scrap resistive film layer is formed.

An embodiment of the present invention will be described below with reference to the accompanying drawings. After forming a low-melting point insulating material layer 2 made of resin, a thin metal scrap resistance film 3 made of copper is further formed on the surface of the layer 2 by plating or vapor deposition to form an ultra-small A conductive cap 6 comprising a circuit breaking element 4 and having lead wires 5 at both ends of the element 40.
are fitted and fixed to each other to form an ultra-compact fuse.

However, according to the circuit constructed as described above, and the Jg disconnection element, the circuit is completely disconnected at the next elapsed time ((a) and (b) in Figure 2). , ? → see).

(1) First, the metal resistance film layer 3 generates heat due to the flow of an overcurrent, and the temperature gradually rises.

(2) When the rising temperature of the metal scrap resistance film layer 3 reaches the melting temperature of the lower-layer low-melting edge material layer 2, as shown in (a) of the second pxj, the temperature increases. The layer begins to melt, resulting in molten Aμa.

(3) When the melting of the molten part a of the paulownia layer 2 progresses further and forms a ridge or a complete fused part 1 as shown in FIG. When the metal resistance film 3 starts to melt in the bath, the metal resistance film layer 3 assumes the shape of a bridge C at the melting point 813b.

(4) When the temperature further rises and the melting of the metal scrap resistance coating layer 3 progresses, the coating layer is finally fused at the part of the bushing C and completely separated into both sides, and the second As shown in (c) of the figure, a completely durable part d is formed.

As mentioned above, the element shown in the embodiment of the present invention, which is configured to completely cut off the circuit by the overcurrent switch,
Table 2 shows the relationship between the fusing current value, the fusing time, and the shingle edge resistance based on the fusing test.

Table-2 111 11301 ( i i 1/ 5.4.

1, 39.4: 1o, o
.

As is clear from the above table, in the case of the circuit breaking element shown in the example of the present invention, the insulation resistance of 8 is large and there is no residual resistance when the metal film is fused, and the circuit is completely broken. I know that there is.

Note that the electrically insulating base material, low melting point organic insulating material, and metal resistance coating material used in the present invention are not limited to the above examples, and the following examples can be used in addition to them.

Electrically insulating base materials: Epoxy resin, phenol resin, polyamide resin, enamel resin, low melting point organic insulating material, polyester resin, miton resin, epoxy resin, and other metal resistance coating materials 1 Various types of copper such as copper manganese alloy, copper nickel alloy, etc. Alloy, silver, gold, etc.Furthermore, the coating state of the metal resistance film and low melting point organic insulating material can be selected and adopted as necessary, whether it is full coverage or partial coverage. , group 4.
Examples of the shape of H include columnar, plate-like, chip-like, and cylindrical shapes.

As detailed above, the circuit breaking element according to the present invention suffers from warping due to the combination of the low melting point 41 insulating material interposed between the electrically insulating base material and the metal resistance coating material. Since the metal resistance film layer can be melted in the bridge state, it is possible to completely separate the melted film layer to both sides and completely interrupt the circuit. It can significantly improve reliability, safety, and reliability.

4, FKI u'ri) m'j Ill f, 1
The explanatory drawings show an embodiment of the invention, and 1st tg+ is a longitudinal sectional front view of the main part when applied to a fuse, and (a), (mouth), and (c) of vJ2 are explanatory diagrams of the progress of fusing. It is.

1 electrically insulating group, 2. low melting point organic insulating side layer, 3
Metal resistance film layer.

Claims (1)

[Claims] ``Circuit breaking element characterized in that a layer of an insulating material having a low melting point is formed on the surface of an electrically insulating base material, and a metal resistance film layer is formed on the surface of the insulating material layer.'' .