JPS59126685A - Pattern formation by lift-off method - Google Patents

Abstract

PURPOSE:To obtain the pattern of a deposit layer with gentle pattern edges by depositing a deposit substance on a substrate which rotates within a substrate surface to which the incidence angle of said substance onto the substrate does not become vertical, and removing the deposit layer while applying mechanical oscillation. CONSTITUTION:At the part unnecessitating the deposit layer on the main surface of a base layer 2, a cutting die 3 having no eave structure is formed faithfully to an image drawing or photo mask pattern. Therefore the deposit layer is formed while the base layer 2 is rotated within the substrate rotary surface 6 to which the incidence angle 5 of the deposit substance onto the substrate does not become vertical, and then a coating layer 7 covering the deposit layer 4 is formed. Afterwards, the coating layer 7 and the cutting die 3 are removed while applying mechanical oscillation to the cutting die 3 and the coating layer 7, thus forming the pattern of the deposit layer 4.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a patterning process using a lift-off method.

Lift-off technology is an important technique used for patterning thin film layers. This requires a so-called eave structure in which a cutout is formed using photoresist, and the upper layer protrudes from the lower layer through the opening. Alternatively, it has been difficult to control the pattern of the deposited layer 4 faithfully to the photomask pattern. In other words, even if the deposits are incident perpendicularly to the substrate as shown in FIG.
As shown in Figure (b), it is defined by the amount of wrap around, and it has been difficult to control the amount of wrap.

In order to obtain even smoother pattern edges, use Fig. 2 (a).
As shown in Figure 2, if the angle of incidence of the deposit onto the substrate is not perpendicular and if the deposit adheres to the side of the lower layer of the punching chamber, the deposit is placed on the substrate rotating within the plane of the substrate. Even when piled up, some of the piled plants will be pushed under the eaves more than expected, but they will form six turns defined by the shape of the lower curved part of the cutting die, and the piled layer after 7 to 7 will be formed. The pattern is shown in Figure 2 (b
), it was difficult to faithfully transfer multiple drawings or photomask patterns. Alternatively, if the deposits do not adhere to the sides of the cutting die, it is possible to use a punching die 3 that does not have an eaves structure as shown in Figure 3 (al), and forming a vacuum of the deposited layer 4 that is faithful to the drawing or mask pattern 1. Although control becomes easier, as shown in Fig. 3(b), the shape of the edge of the pattern depends on the shape of one side of the cutting die, resulting in a steep step.In other words, in the conventional glue 7-off method,
It has been difficult to simultaneously form a deposited layer pattern faithful to a drawing or photomask pattern and form a pattern/edge with smooth steps.

An object of the present invention is to provide a pattern forming method using a lift-off method that enables both the formation of a deposited layer pattern faithful to a drawing or photomask pattern and the formation of pattern edges with smooth steps. be.

According to the invention, there is a step of providing a cutting die in the Bater-Jung process using the S7-to-off method, and rotating the deposit patterned by the cutting die within the plane of the substrate where the angle of incidence of the deposit onto the substrate is not perpendicular. a step of depositing the deposited layer on a substrate that is coated, a step of providing a covering layer covering the deposited layer and sandwiching the unnecessary deposited layer between the covering layer and the cutting die, and a step of subjecting the cutting die and the wax to mechanical vibration. A pattern forming method using a lift-off method is obtained, which is characterized in that it includes a step of removing while adding.

The present invention will be described in detail below with reference to the drawings.

The principle of the present invention will be explained using FIGS. 4(a) to ((l).

A cutting die 3 having no eaves structure is formed faithfully to the drawing or photomask pattern 1 on a portion of the main surface of the base layer 2 that does not require electrodeposition. Afterward, a deposited layer 4 is formed while rotating the base layer 2 within the substrate rotation plane 6 in which the incident angle 5 of the deposit onto the substrate is not perpendicular (FIG. 4(b)), and then the deposited layer 4 is covered. After the coating layer 7 is formed (FIG. 4(C)), the coating layer 7 and the cutting die 3 are not mechanically retracted.
A pattern of the deposited layer 4 is formed by removing (
It is possible to form a deposited layer pattern that is faithful to the binding, drawing, or photomask pattern 1 shown in FIG. 4(d)) and has smooth pattern edges. In other words, the pattern of the deposited layer is determined only by the transfer viscosity of the photomask pattern or by using a punching die that does not have an eaves structure. Because the object is incident on the board at an angle that is not perpendicular to the board, and the board is rotating, the shadow of the cutting die will stop at the chest circumference of the cutting die, and the t will appear in that area.
A thicker trough is formed compared to the groove and pond parts, and the putter/edge becomes smooth. Unnecessary layers 8tIi# attached to the sides of the cutting die are sandwiched between the cutting die 3 and the dyed layer 7, and are removed at the same time when the machine is subjected to vibration and removed. Therefore, it is possible to form a deposited one-sided pattern that is faithful to the drawing or photomask pattern and has smooth pattern edges.

Next 4. In order to better understand the invention, examples will be explained below. FIG.
13. lj.

As shown in FIG. 5 (iii), the position of the area other than the part where the base electrode is formed on the insulating substrate 9 is determined by, for example, a photomask pattern edge 8, and the cutout filO having no eaves structure is formed by using, for example, a positive type photolithography. A resist is used to form the film to a thickness of, for example, 1.5 months.
As shown in Figure (b), the example used for the base electrode is Au-Pb.
A single layer 11 of a superfluid, 21I, such as a lead alloy such as -In, is evaporated to a thickness of, for example, 21) OnnI onto a substrate that is rotating in the plane of the substrate, where the angle of incidence onto the substrate is not realigned. As a result, in the area around the cutting die 10 where the shadow of the cutting pattern 10 is produced, a superconducting layer 11 with h of 200 ohm or less is formed with a smooth step to form the conductive layer. After cutting the photoresist in acetone and removing the photoresist cutting die 1o and the photoresist coating layer 12 in acetone without applying ultrasonic lift, the photomask pattern edge 8 is precisely defined and smooth as shown in Figure 5 (dJ). A base electrode 13 having a pattern edge portion is obtained.A method for manufacturing a Josephson element as another preferred embodiment of the present invention will be explained using FIGS. 6(a) to 6(f).

A base electrode B provided on an insulating substrate 9 as shown in FIG. 6(a) is prepared, for example, by the method shown in FIGS. 3(a) to 3(d). Next, as shown in FIG. 6 tb+, the position is determined by, for example, a photomask pattern edge 8 at a portion where a bond is to be formed, and a cutting die 10 having no eave structure is used, for example, with a positive type photoresist to form a 15 μm thick film. Form into a thick layer. Thereafter, as shown in FIG. 6 (C1), the Si0 layer used for the insulating layer 14 is deposited by a thickness of, for example, 300 nm onto the substrate which is rotating within the plane of the substrate where the angle of incidence on the substrate is not perpendicular.
Deposit to a thickness of . As a result, an insulating layer having a thickness of 300 nm or less is formed with smooth steps around the area around the cutting die 10 where the shadow of the cutting die 10 is produced. After that, as shown in Figure 6 (dl), for example, a 15 μm thick positive type 7t
Cover the insulating layer 14 with photoresist aJ&t2 and remove the unnecessary insulating layer from the photoresist! After being sandwiched between molds 10 and 7 photoresist coating layer 12, the photoresist is removed from mold 1 in acetone while applying ultrasonic vibration.
0 and the photoresist coating layer 12 are removed, FIG.
), a bonding region 15 is obtained which is precisely defined by the photomask pattern edges 8 and surrounded by smooth pattern edges. After that, the bonding area 15 is
), a junction barrier layer 16 serving as a tunnel barrier is formed by, for example, an RF plasma oxidation method. Thereafter, without exposing the junction barrier 1vi16 to the atmosphere, a superconducting material such as a lead alloy such as Pb-B1 or Pb-Au is deposited to a thickness of, for example, 400 nm to form the counter electrode 17. As a result, a high-quality Josephson device is obtained which is precisely defined by the photomask pattern edges 8 and includes a junction region with a smooth pattern edge area of 1 ffl.

In order to make it possible to realize a deposited layer pattern with an i-en-emission part, there are two points: the deposit is deposited on a rotating substrate in the plane of the substrate where the angle of incidence on the substrate is not perpendicular; A coating layer is provided to sandwich the deposited layer between cutting dies, and the coating layer is removed while applying mechanical vibration.

[Brief explanation of the drawing]

FIGS. 1(a) to 1(b) are structural sectional views for explaining the principle of one conventional lift-off technique. Figures 2 (a) to (bl) are structural cross-sectional views for explaining the principle of another possible lift-off technology. Figures 3 (a) to (b) are still another possible lift-off technology. It is a structural cross-sectional view for explaining the principle. dl is a cross-sectional view of the device at each step of a method for manufacturing a base electrode of a Josephson device according to an embodiment of the present invention. 3 is a cross-sectional view of the device at each step in the method for manufacturing a Josephson device. In the figure, 1 is a drawn Sumiphotomask pattern, N is a base layer, 3 is a cutting die, 4 is a deposited layer, and 5 is a deposited Incident angle of the object onto the substrate, 6 is the substrate rotation plane, 7 is the coating layer, 8 is the photomask pattern edge, 9 is the insulating substrate, 10 is the photoresist cutting die, 11 is the superconducting layer, 12 is the photoresist coating 13 is a base electrode, 14 is an insulating layer, 15 is a bonding region, 16 is a bonding barrier layer, and 17 is a counter electrode. Figure 2 No (b) (fl) 396- (α) (C)

Claims (1)

[Claims] A step of providing a cutting die in a patterning process using a lift-off method, and a step of depositing a deposit patterned by the cutting die on a rotating substrate within a substrate plane in which the incident angle of the deposit onto the substrate is not perpendicular. and a step of providing a coating layer covering the deposited layer and sandwiching the unnecessary deposited layer between the coating layer and the cutting die, and a step of removing the cutting die and the coating layer while applying mechanical vibration. A pattern formation method using the lift-off method, which features black ink.